JPH01286350A - Cooling device of integrated circuit - Google Patents

Abstract

PURPOSE:To seek to improve cooling efficiency and lighten the weight by using a cooling pipe and a cooling plate and inserting the cooling pipe into a hole provided in the cooling plate so as to unite them closely. CONSTITUTION:A flat cooling plate 13 made of material light and excellent in heat conductivity is provided with a plurality of cooling pipe insertion holes 13a pierced through its side face, while a thin cooling pipe 14 is made of material excellent in heat conductivity and corrosion resistance. This cooling plate 13 is heated to high temperature, while the cooling pipe 14 is cooled to low temperature, and the cooling pipe 14 is inserted into a cooling pipe insertion hole 13a of the cooling plate 13 in the arrow A direction. When the cooling plate 13 and the cooling pipe 14 are returned to the normal temperature after being united this way, the cooling pipe insertion hole 13a shrinks and the cooling pipe 14 expands, therefore the cooling pipe 14 and the cooling plate 13 is completely in close contact with each other and unite. By uniting them this way, a light cooling device can be obtained without loosing heat conduction.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling device for integrated circuits used in electronic computers and the like.

[Conventional technology]

In recent years, the amount of heat generated by electrons in electronic devices such as computers has also increased. Various methods have been considered as such heat treatment methods, and the method shown in FIG. 3 is one example.

That is, as shown in FIG. 3, the heat generated from the integrated circuit 2 mounted on the printed wiring board 1 is transferred to the cooling plate 3 disposed above it, and the heat is transferred to the inside of the cooling plate 3. Cooling is performed by the refrigerant flowing through the refrigerant flow path 8 provided.

[Problem to be solved by the invention]

The conventional integrated circuit cooling means described above uses lyllium copper or the like in order to efficiently dissipate heat from the heat dissipating surface of the integrated circuit. However, although such materials have excellent thermal conductivity, they are heavy, so there are problems with operability when replacing them for maintenance.Also, if aluminum is used to reduce the weight, it is difficult to use the materials that flow internally. The drawback is that the refrigerant causes rust and corrosion.

[Failure to solve the problem]

The integrated circuit cooling device of the present invention uses a cooling pipe made of copper, aluminum copper, etc. with excellent thermal conductivity as a flow path through which the coolant passes, and a cooling plate that holds this cooling pipe and an I- By using lightweight aluminum or the like and integrating the two, it is possible to obtain a lightweight cooling device without impairing thermal conductivity.

Since the adhesion between the cooling plate and the cooling pipe affects the cooling capacity of the cooling device, the following means are used to connect them.

That is, by heating the cooling plate, it is expanded to make the insertion hole provided for inserting the cooling pipe thicker, and by cooling the cooling pipe, it is contracted to reduce the outer diameter of the cooling pipe. In this state, the cooling pipe is inserted into the hole of the cooling plate and both are returned to room temperature, thereby completely bringing the cooling plate and the cooling pipe into close contact with each other and making them integral. This makes it possible to reliably transfer heat from the integrated circuit to the coolant passing through the cooling pipe.

That is, the integrated circuit cooling device of the present invention includes a flat cooling plate made of a lightweight metal material with good thermal conductivity and having a flat surface that contacts the heat dissipation surface of the integrated circuit case, and a cooling plate that has corrosion resistance. , and a cooling pipe formed of a metal material with good thermal conductivity, the cooling pipe is press-fitted into an insertion hole provided in the cooling plate 7, and the cooling plate and the cooling pipe are brought into close contact with each other to be integrated. It is something.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is an exploded perspective view showing the cooling plate and cooling pipe of the illustrated embodiment.

As shown in FIGS. 1 and 2, a flat cooling plate 13 made of a lightweight and highly thermally conductive material such as aluminum has cooling pipe insertion holes 13 penetrating its side surface.
A plurality of a are provided.

On the other hand, the thin-walled cooling pipe 14 is made of copper, IJ IJ Uno,
It is made of a material that has excellent thermal conductivity and corrosion resistance, such as copper. When this cooling plate 13 is heated 7 to a high temperature, and the cooling vibe 4 is cooled to a low temperature, and the cooling plate 13 and the cooling pipe 14 are returned to normal temperature as a unit, the cooling pipe insertion hole 13a contracts and the cooling pipe 14 expands, so the cooling pipe 14 and the cooling plate 13 are completely in close contact with each other and become one body. The cooling device formed in this way is placed on the integrated circuit 12 mounted on the printed wiring board 11, fixed to the printed wiring board 11 with the mounting screws 15, and by passing a coolant through the cooling pipe 14, the integrated circuit The heat generated in step 2 is transferred to the cooling pipe 14 press-fitted into the cooling plate 13 through the flat surface thereof, and is further transferred to the refrigerant passed through the cooling pipe 13, thereby cooling the integrated circuit 2. It becomes possible.

〔Effect of the invention〕

As explained above, the integrated circuit cooling device of the present invention has the following features:
Excellent thermal conductivity! A cooling pipe made of a material with good corrosion resistance and a cooling plate made of a lightweight material with good thermal conductivity are used, and the cooling pipe is inserted into a hole in the cooling plate and brought into close contact with the cooling plate. This has the effect that there is no risk of rust or corrosion caused by the refrigerant, and a lightweight integrated circuit cooling device with good cooling efficiency can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
An exploded perspective view showing the cooling plate and cooling pipe of the embodiment shown in the figure;
FIG. 3 is a sectional view showing an example of a conventional integrated circuit cooling device. 1.11...Printed wiring board, 2,12...
...Integrated circuit, 3.13...Cooling plate, 8...
... Refrigerant passage, ]4 ... Cooling pipe, 15
...Mounting screw. Agent Patent Attorney Shinpaku Uchihara 1 Figure No. 21￥llI 3rd session

Claims (1)

[Claims] A flat cooling plate made of a lightweight metal material with good thermal conductivity and a flat surface that contacts the heat dissipation surface of the integrated circuit case, and a cooling plate made of a metal material with corrosion resistance and good thermal conductivity. A cooling device for an integrated circuit, characterized in that the cooling pipe is press-fitted into an insertion hole provided in the cooling plate so that the cooling plate and the cooling pipe are brought into close contact and integrated.