JPH08125371A - Printed-board housing case - Google Patents
Printed-board housing caseInfo
- Publication number
- JPH08125371A JPH08125371A JP25801994A JP25801994A JPH08125371A JP H08125371 A JPH08125371 A JP H08125371A JP 25801994 A JP25801994 A JP 25801994A JP 25801994 A JP25801994 A JP 25801994A JP H08125371 A JPH08125371 A JP H08125371A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- metal core
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属コアを内層するプ
リント基板により発熱部品の冷却を行うプリント基板収
納筐体に関し、メンテナンスが容易で、冷却効率がよい
プリント基板収納筐体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board housing for cooling heat-generating components by means of a printed circuit board having a metal core as an inner layer, and more particularly to a printed circuit board housing for easy maintenance and high cooling efficiency. .
【０００２】[0002]
【従来の技術】プリント基板に搭載される発熱部品を冷
却する方法として、金属コアを用いて冷却する方法があ
る。この方法では、発熱部品が発生する熱を金属コアに
伝熱し、金属コアからプリント基板が取り付けられる筐
体に熱を伝熱し、筐体から空気中に熱を放熱して冷却を
行っている。または、金属コアからヒートシンクに熱を
伝熱し、ヒートシンクから冷却水により熱を伝熱して冷
却を行っている。このような冷却水による装置は、例え
ば、実開平４−３４７９５号公報や実開平５−８２０９
１号公報などに開示されている。2. Description of the Related Art As a method of cooling a heat generating component mounted on a printed circuit board, there is a method of cooling using a metal core. In this method, the heat generated by the heat-generating component is transferred to the metal core, the heat is transferred from the metal core to the housing to which the printed circuit board is attached, and the heat is radiated from the housing to the air for cooling. Alternatively, the heat is transferred from the metal core to the heat sink, and the heat is transferred from the heat sink by the cooling water for cooling. An apparatus using such cooling water is disclosed in, for example, Japanese Utility Model Application Laid-Open No. 4-34795 and Japanese Utility Model Application Laid-Open No. 5-8209.
It is disclosed in Japanese Patent Publication No. 1 and the like.
【０００３】[0003]
【発明が解決しようとする課題】このような構成の装置
は、金属コアから冷却プレートへ熱を伝熱するとき、プ
リント基板の金属コアと冷却プレートは一体でないた
め、金属コアと冷却プレートを接触させて、熱抵抗を小
さく抑える必要がある。その方法として、くさび状金具
をプリント基板間に圧入して固定したり、複数箇所をネ
ジにより固定する方法がある。しかし、くさび状金具や
ネジによりプリント基板を冷却プレートに固定してしま
うと、プリント基板に搭載された電子回路が故障したと
きなどは、くさび状金具の取り外し、あるいは、ネジを
いくつも取り外さなければならず、プリント基板のメン
テナンスに時間が掛かってしまうという問題点があっ
た。In the device having such a structure, when the heat is transferred from the metal core to the cooling plate, the metal core and the cooling plate of the printed circuit board are not integrated, so that the metal core and the cooling plate come into contact with each other. Therefore, it is necessary to keep the thermal resistance small. As a method therefor, there is a method in which wedge-shaped metal fittings are press-fitted and fixed between printed circuit boards, or a plurality of positions are fixed by screws. However, if the printed circuit board is fixed to the cooling plate with wedge-shaped metal fittings and screws, if the electronic circuit mounted on the printed circuit board fails, you must remove the wedge-shaped metal fittings or remove many screws. In addition, there is a problem that maintenance of the printed circuit board takes time.
【０００４】本発明の目的は、プリント基板の取り外し
が簡単に行え、しかも冷却効率がよいプリント基板収納
筐体を実現することにある。An object of the present invention is to realize a printed circuit board housing in which the printed circuit board can be easily removed and the cooling efficiency is good.
【０００５】[0005]
【課題を解決するための手段】本発明は、プリント基板
に内層される金属コアを介して発熱部品を冷却するプリ
ント基板収納筐体において、コ字形に形成され、前記プ
リント基板を保持するガイド部と、このガイド部あるい
は前記プリント基板に固定される本体部と、本体部の穴
部を通るネジにより連結される２つの可動部とを有し、
プリント基板とガイド部の間に設けられる固定部材と、
前記ガイド部と熱的に接続し、流体に熱を伝熱する冷却
プレートと、を設け、前記固定部材のネジを締めること
により、可動部が本体部よりスライドし、前記プリント
基板を前記ガイド部に固定して前記プリント基板の金属
コアを前記ガイド部に熱的に接続することを特徴とする
ものである。According to the present invention, there is provided a printed circuit board housing for cooling a heat-generating component through a metal core which is an inner layer of the printed circuit board. The guide part is formed in a U shape and holds the printed circuit board. And a main body portion fixed to the guide portion or the printed circuit board, and two movable portions connected by a screw passing through a hole portion of the main body portion,
A fixing member provided between the printed circuit board and the guide portion,
A cooling plate that is thermally connected to the guide portion and transfers heat to a fluid is provided, and the screw of the fixing member is tightened, so that the movable portion slides from the main body portion, and the printed circuit board is guided by the guide portion. And the metal core of the printed circuit board is thermally connected to the guide portion.
【０００６】[0006]
【作用】このような本発明では、固定部材のネジを締め
ることにより、固定部材の可動部が本体部よりスライド
し、プリント基板をガイド部に固定してプリント基板の
金属コアをガイド部に熱的に接続する。そして、発熱部
品が発生する熱は、プリント基板の金属コアを伝熱し
て、ガイド部に伝わり、ガイド部から冷却プレートに伝
熱する。冷却プレートは、熱を流体に伝熱して、冷却を
行う。According to the present invention as described above, by tightening the screw of the fixing member, the movable portion of the fixing member slides from the main body portion, the printed circuit board is fixed to the guide portion, and the metal core of the printed circuit board is heated to the guide portion. Connect to each other. Then, the heat generated by the heat-generating component is transferred to the metal core of the printed circuit board, transferred to the guide portion, and transferred from the guide portion to the cooling plate. The cooling plate transfers heat to the fluid to perform cooling.
【０００７】[0007]
【実施例】以下図面を用いて本発明を説明する。図１，
２は、本発明の一実施例の構成を示した図で、それぞ
れ、正面図，上面図である。図において、１はプリント
基板で、金属コア１ａが内層され、ＬＳＩなどの発熱部
品（図示せず）を搭載する。２はガイド部で、コ字形に
形成され、プリント基板１を保持する。そして、ガイド
部２は、Ｌ字形のＬ字部材２ａと板部材２ｂとにより構
成され、Ｌ字部材２ａに板部材２ｂがネジにより固定さ
れている。The present invention will be described below with reference to the drawings. Figure 1
2 is a diagram showing a configuration of an embodiment of the present invention, which is a front view and a top view, respectively. In the figure, reference numeral 1 is a printed circuit board, on which a metal core 1a is provided as an inner layer, on which a heat-generating component (not shown) such as an LSI is mounted. Reference numeral 2 denotes a guide portion, which is formed in a U shape and holds the printed circuit board 1. The guide portion 2 is composed of an L-shaped L-shaped member 2a and a plate member 2b, and the plate member 2b is fixed to the L-shaped member 2a with screws.
【０００８】３は柱状に形成される固定部材で、プリン
ト基板１に当て板４を介してネジにより固定される本体
部３ａと、本体部３ａの穴部を通るネジ３ｂにより連結
される２つの可動部３ｃ，３ｄとを有し、プリント基板
１とガイド部２の間に設けられる。そして、ネジ３ｂを
締めることにより、可動部３ｃ，３ｄが本体部３ａより
矢印の方向にスライドし、プリント基板１をガイド部２
に固定してプリント基板１の金属コア１ａをガイド部２
に熱的に接続する。５は冷却プレートで、ガイド部２の
Ｌ字部材２ａが熱的に接続されると共にシリコーンコン
パウンドなどを介してＬ字部材２ａに固定される。そし
て、内部に流路管を有し、外部装置（図示せず）からの
流体である冷却水が流路管内に流れ、流路管内の冷却水
に熱を伝熱する。Reference numeral 3 is a fixing member formed in a columnar shape. The main body portion 3a is fixed to the printed circuit board 1 by a screw via a backing plate 4, and the two connecting portions are connected by a screw 3b passing through a hole portion of the main body portion 3a. It has movable parts 3c and 3d and is provided between the printed circuit board 1 and the guide part 2. Then, by tightening the screw 3b, the movable portions 3c and 3d slide in the direction of the arrow from the main body portion 3a, and the printed circuit board 1 is guided by the guide portion 2
The metal core 1a of the printed circuit board 1 is fixed to the guide 2
Thermal connection to. Reference numeral 5 denotes a cooling plate which is thermally connected to the L-shaped member 2a of the guide portion 2 and fixed to the L-shaped member 2a via a silicone compound or the like. Then, it has a channel pipe inside, and cooling water which is a fluid from an external device (not shown) flows into the channel pipe to transfer heat to the cooling water in the channel pipe.
【０００９】次に、固定部材３の構成について補足説明
を行う。図３は、固定部材３の構成を説明する図であ
る。本体部３ａはネジ３ｂが移動可能で長辺方向に貫通
する穴部を有している。そして、可動部３ｃはネジ３ｂ
が挿入される穴部を有し、可動部３ｄはネジ３ｂの雄ネ
ジ部がねじ込まれる雌ネジ部を有する。Next, a supplementary description will be given of the structure of the fixing member 3. FIG. 3 is a diagram illustrating the configuration of the fixing member 3. The main body 3a has a hole through which the screw 3b is movable and which penetrates in the long side direction. Then, the movable portion 3c has the screw 3b.
The movable portion 3d has a female screw portion into which the male screw portion of the screw 3b is screwed.
【００１０】以上の構成を用いたプリント基板収納筐体
の全体構成について以下に説明する。図４〜６は、図１
の装置のプリント基板収納筐体の全体構成を示す図で、
それぞれ、側面図，正面図，上面図である。図におい
て、６はバックボードで、プリント基板１のコネクタ１
１，１２がコネクタ６１，６２に接続される。７は冷却
プレートで、プリント基板１に固定され、プリント基板
１に搭載されるＬＳＩ１０に伝熱シート７１を介して接
触し、ＬＳＩ１０が発生する熱を吸収する。そして、冷
却プレート７は内部に流路管を有し、外部装置（図示せ
ず）からの流体である冷却水が流路管内に流れ、流路管
の冷却水に熱を伝熱する。８は金属コアを内層しないプ
リント基板で、ＬＳＩなどの電子部品が搭載され、バッ
クボード６のコネクタ６１，６２にコネクタ８１，８２
を接続する。９はガイドで、筐体に固定され、プリント
基板８をバックボード６のコネクタ６１，６２に導くと
共に、プリント基板８を保持する。ここで、プリント基
板１には、冷却プレート７を取り付けるものと、取り付
けないものとがある。The overall structure of the printed circuit board housing using the above structure will be described below. 4 to 6 are shown in FIG.
FIG. 2 is a diagram showing the overall configuration of a printed circuit board housing of the device of FIG.
They are a side view, a front view, and a top view, respectively. In the figure, 6 is a backboard, which is a connector 1 of the printed circuit board 1.
1, 12 are connected to the connectors 61, 62. A cooling plate 7 is fixed to the printed circuit board 1 and contacts the LSI 10 mounted on the printed circuit board 1 via the heat transfer sheet 71 to absorb the heat generated by the LSI 10. The cooling plate 7 has a channel pipe inside, and cooling water, which is a fluid from an external device (not shown), flows into the channel pipe to transfer heat to the cooling water in the channel pipe. Reference numeral 8 denotes a printed circuit board having no metal core as an inner layer, on which electronic components such as LSI are mounted, and connectors 81, 82 are attached to connectors 61, 62 of the backboard 6.
Connect. A guide 9 is fixed to the housing, guides the printed circuit board 8 to the connectors 61 and 62 of the backboard 6, and holds the printed circuit board 8. Here, there are a printed circuit board 1 on which the cooling plate 7 is attached and a printed circuit board 1 which is not attached.
【００１１】このような装置の動作を以下で説明する。
図７は固定部材３の動作を説明する図である。ここで、
（Ａ）はネジ３ｂを緩めた状態、（Ｂ）はネジ３ｂを締
めた状態を示す。固定部材３のネジ３ｂを緩めた状態、
つまり、本体部３ａ，可動部３ｃ，３ｄが直線状の状態
（図７（Ａ））で、プリント基板１をガイド部２に沿っ
て挿入し、プリント基板１のコネクタ１１，１２をバッ
クボードのコネクタ６１，６２に接続する。そして、固
定部材３のネジ３ｂを締めて、可動部３ｃ，３ｄを本体
部３ａよりスライドさせ、固定部材３を短辺方向に広
げ、図７（Ｂ）の状態にする。これにより、プリント基
板１の露出している金属コア１ａをガイド部２のＬ字部
材２ａに押し当てられると共に、プリント基板１はガイ
ド部２に固定される。The operation of such a device is described below.
FIG. 7 is a diagram for explaining the operation of the fixing member 3. here,
(A) shows a state in which the screw 3b is loosened, and (B) shows a state in which the screw 3b is tightened. With the screw 3b of the fixing member 3 loosened,
That is, with the main body portion 3a and the movable portions 3c and 3d in a linear state (FIG. 7A), the printed board 1 is inserted along the guide portion 2 and the connectors 11 and 12 of the printed board 1 are connected to the backboard. Connect to the connectors 61 and 62. Then, the screw 3b of the fixing member 3 is tightened, the movable portions 3c and 3d are slid from the main body portion 3a, the fixing member 3 is widened in the short side direction, and the state of FIG. 7B is obtained. As a result, the exposed metal core 1a of the printed board 1 is pressed against the L-shaped member 2a of the guide portion 2, and the printed board 1 is fixed to the guide portion 2.
【００１２】取り外し動作は、固定部材３を図７（Ｂ）
の状態、つまり、固定部材３が短辺方向に広げられた状
態から、固定部材３のネジ３ｂを緩めて、図７（Ａ）の
状態、つまり、固定部材３を直線状態にする。そして、
バックボード６のコネクタ６１，６２からコネクタ１
１，１２を取り外して、プリント基板１を取り外す。In the removing operation, the fixing member 3 is moved as shown in FIG.
From that state, that is, from the state where the fixing member 3 is expanded in the short side direction, the screw 3b of the fixing member 3 is loosened to bring the state of FIG. 7A, that is, the fixing member 3 into the linear state. And
Backboard 6 connectors 61, 62 to connector 1
1, 2 are removed, and the printed circuit board 1 is removed.
【００１３】次に冷却動作について説明する。プリント
基板１の発熱部品が発生する熱は、プリント基板１の金
属コア１ａに伝熱し、金属コア１ａからガイド部２のＬ
字部材２ａに伝熱する。Ｌ字部材２ａに伝熱した熱は、
冷却プレート５を介して冷却プレート５の流路管内を流
れる冷却水に伝熱する。また、冷却プレート７は、プリ
ント基板１のＬＳＩ１０が発生する熱を伝熱シート７１
を介して熱を吸収し、冷却水に伝熱する。そして、冷却
プレート５，７は外部装置と冷却水の授受を行う。Next, the cooling operation will be described. The heat generated by the heat-generating component of the printed circuit board 1 is transferred to the metal core 1a of the printed circuit board 1 and L of the guide portion 2 is transferred from the metal core 1a.
Heat is transferred to the character member 2a. The heat transferred to the L-shaped member 2a is
The heat is transferred to the cooling water flowing through the cooling plate 5 through the cooling plate 5. Further, the cooling plate 7 transfers heat generated by the LSI 10 of the printed circuit board 1 to the heat transfer sheet 71.
It absorbs heat through the and is transferred to the cooling water. The cooling plates 5 and 7 exchange cooling water with an external device.
【００１４】そして、金属コアを内層しないプリント基
板８から金属コアを内層するプリント基板１への変更動
作について説明する。ガイド９をプリント基板収納筐体
から取り外し、ガイド部２を冷却プレート２に取り付け
る。そして、金属コアを内層しないプリント基板８の代
わりに、プリント基板１をガイド部２に挿入して取り付
ける。Then, an operation of changing the printed board 8 having no metal core as an inner layer to the printed board 1 having a metal core as an inner layer will be described. The guide 9 is removed from the printed circuit board housing, and the guide portion 2 is attached to the cooling plate 2. Then, instead of the printed board 8 having no metal core as an inner layer, the printed board 1 is inserted and attached to the guide portion 2.
【００１５】このように、固定部材３の可動部３ｃ，３
ｄを動作させるネジ３ｂを締めたり、緩めるだけで、プ
リント基板１の金属コア１ａからの熱を冷却プレート５
に伝熱するガイド部２に対して、金属コア１ａの取り付
け、取り外しが簡単にできるので、プリント基板１のメ
ンテナンスを容易に行うことができる。また、固定部材
３のネジ３ｂを１つ締めるだけで、固定部材３が広い接
触面積でプリント基板１を押して金属コア１ａをガイド
部２に熱的に接続させるので、金属コア１ａとガイド部
２との熱抵抗を低くすることができ、冷却効率がよい。Thus, the movable parts 3c, 3 of the fixed member 3 are
The heat from the metal core 1a of the printed board 1 is cooled by simply tightening or loosening the screw 3b for operating the d.
Since the metal core 1a can be easily attached to and removed from the guide portion 2 that transfers heat to the printed circuit board 2, the printed circuit board 1 can be easily maintained. Further, since the fixing member 3 pushes the printed circuit board 1 with a wide contact area to thermally connect the metal core 1a to the guide portion 2 only by tightening one screw 3b of the fixing member 3, the metal core 1a and the guide portion 2 It is possible to reduce the heat resistance with and the cooling efficiency is good.
【００１６】さらに、プリント基板１の金属コア１ａか
ら伝熱する熱をガイド部２を介して冷却プレート５に伝
熱する構成なので、ガイド９をガイド部２に取り替える
だけで、金属コアを内層しないプリント基板８から金属
コアを内層するプリント基板１への変更を簡単に行うこ
とができる。これにより、プリント基板１に搭載する部
品を変更して、発熱量が大きくなり冷却能力を上げる必
要が生じても簡単に対応することができる。Further, since the heat transferred from the metal core 1a of the printed board 1 is transferred to the cooling plate 5 via the guide portion 2, the guide 9 is simply replaced by the guide portion 2, and the metal core is not an inner layer. The printed circuit board 8 can be easily changed to the printed circuit board 1 having the metal core as an inner layer. As a result, it is possible to easily cope with the necessity of changing the components mounted on the printed circuit board 1 to increase the amount of heat generation and increase the cooling capacity.
【００１７】なお、本発明は、固定部材３をプリント基
板１に固定する構成を示したが、ガイド部２に固定する
構成でもよい。また、プリント基板１の金属コア１ａと
ガイド部２との間に、熱伝導性のよい部材を介在させる
構成も本発明に含まれる。さらに、冷却プレートは、流
路管を内部に有する構成ではなく、ヒートパイプを内部
に有する構成にし、ヒートパイプからの熱を冷却水に伝
熱する構成にしてもよい。In the present invention, the fixing member 3 is fixed to the printed board 1, but it may be fixed to the guide portion 2. Further, the present invention includes a configuration in which a member having good thermal conductivity is interposed between the metal core 1a of the printed board 1 and the guide portion 2. Further, the cooling plate may have a structure having a heat pipe inside instead of having a flow path pipe inside, and may have a structure for transferring heat from the heat pipe to the cooling water.
【００１８】[0018]
【発明の効果】本発明によれば、以下のような効果があ
る。固定部材の可動部を動作させるネジを締めたり、緩
めるだけで、プリント基板の金属コアからの熱を冷却プ
レートに伝熱するガイド部に対して、金属コアの取り付
け、取り外しが簡単にできるので、プリント基板のメン
テナンスを容易に行うことができる。また、固定部材の
ネジを１つ締めるだけで、固定部材が広い接触面積でプ
リント基板を押して金属コアをガイド部に熱的に接続さ
せるので、金属コアとガイド部との熱抵抗を低くするこ
とができ、冷却効率がよい。The present invention has the following effects. By simply tightening or loosening the screw that operates the movable part of the fixed member, you can easily attach and detach the metal core to the guide part that transfers the heat from the metal core of the printed circuit board to the cooling plate. The printed circuit board can be easily maintained. Further, by only tightening one screw of the fixing member, the fixing member pushes the printed circuit board over a wide contact area to thermally connect the metal core to the guide portion, so the thermal resistance between the metal core and the guide portion should be reduced. And the cooling efficiency is good.
【００１９】さらに、プリント基板の金属コアから伝熱
する熱をガイド部を介して冷却プレートに伝熱する構成
なので、金属コアを内層しないプリント基板を挿入する
ガイドを、金属コアを内層するプリント基板を挿入する
ガイド部に取り替えるだけで、金属コアを内層しないプ
リント基板から金属コアを内層するプリント基板への変
更を簡単に行うことができる。これにより、プリント基
板に搭載する部品を変更して、発熱量が大きくなり冷却
能力を上げる必要が生じても簡単に対応することができ
る。Further, since the heat transferred from the metal core of the printed circuit board is transferred to the cooling plate via the guide portion, the guide for inserting the printed circuit board without the metal core inside is used as the guide for inserting the printed circuit board with the metal core inside. It is possible to easily change from a printed circuit board having no metal core as an inner layer to a printed circuit board having a metal core as an inner layer only by replacing with a guide portion into which the metal core is inserted. As a result, it is possible to easily cope with the case where the amount of heat generated becomes large and the cooling capacity needs to be increased by changing the components mounted on the printed circuit board.
【図１】本発明の一実施例の構成を示した正面図であ
る。。FIG. 1 is a front view showing the configuration of an embodiment of the present invention. .
【図２】本発明の一実施例の構成を示した上面図であ
る。FIG. 2 is a top view showing the configuration of an embodiment of the present invention.
【図３】固定部材３の構成を説明する図である。FIG. 3 is a diagram illustrating a configuration of a fixing member 3.
【図４】図１の装置のプリント基板収納筐体の全体構成
を示す側面図である。FIG. 4 is a side view showing an overall configuration of a printed circuit board housing of the apparatus shown in FIG.
【図５】図１の装置のプリント基板収納筐体の全体構成
を示す正面図である。5 is a front view showing the overall configuration of a printed circuit board housing of the apparatus of FIG.
【図６】図１の装置のプリント基板収納筐体の全体構成
を示す上面図である。6 is a top view showing the overall configuration of a printed circuit board housing of the apparatus of FIG.
【図７】固定部材３の動作を説明する図である。FIG. 7 is a diagram for explaining the operation of the fixing member 3.
１ プリント基板 １ａ 金属コア ２ ガイド部 ３ 固定部材 ３ａ 本体部 ３ｂ ネジ ３ｃ，３ｄ 可動部 ５ 冷却プレート 1 Printed circuit board 1a Metal core 2 Guide part 3 Fixing member 3a Main body part 3b Screws 3c, 3d Movable part 5 Cooling plate
Claims (1)
して発熱部品を冷却するプリント基板収納筐体におい
て、 コ字形に形成され、前記プリント基板を保持するガイド
部と、 このガイド部あるいは前記プリント基板に固定される本
体部と、本体部の穴部を通るネジにより連結される２つ
の可動部とを有し、プリント基板とガイド部の間に設け
られる固定部材と、 前記ガイド部と熱的に接続し、流体に熱を伝熱する冷却
プレートと、を設け、前記固定部材のネジを締めること
により、可動部が本体部よりスライドし、前記プリント
基板を前記ガイド部に固定して前記プリント基板の金属
コアを前記ガイド部に熱的に接続することを特徴とする
プリント基板収納筐体。1. A printed circuit board housing for cooling a heat-generating component through a metal core that is internally layered on the printed circuit board, and a guide part formed in a U shape and holding the printed circuit board, and the guide part or the print. A fixing member provided between the printed circuit board and the guide unit, the fixing unit having a main body unit fixed to the substrate and two movable units connected by screws passing through holes of the main body unit; And a cooling plate for transferring heat to a fluid, and by tightening the screw of the fixing member, the movable portion slides from the main body portion, and the printed circuit board is fixed to the guide portion to print the print. A printed circuit board housing, wherein a metal core of the circuit board is thermally connected to the guide portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25801994A JPH08125371A (en) | 1994-10-24 | 1994-10-24 | Printed-board housing case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25801994A JPH08125371A (en) | 1994-10-24 | 1994-10-24 | Printed-board housing case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08125371A true JPH08125371A (en) | 1996-05-17 |
Family
ID=17314405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25801994A Pending JPH08125371A (en) | 1994-10-24 | 1994-10-24 | Printed-board housing case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08125371A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161225A (en) * | 2009-01-08 | 2010-07-22 | Toshiba Corp | Substrate holding device and substrate air cooling system |
| JP5797329B2 (en) * | 2012-04-19 | 2015-10-21 | 株式会社日立製作所 | Electronic computer with cooling system |
-
1994
- 1994-10-24 JP JP25801994A patent/JPH08125371A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161225A (en) * | 2009-01-08 | 2010-07-22 | Toshiba Corp | Substrate holding device and substrate air cooling system |
| JP5797329B2 (en) * | 2012-04-19 | 2015-10-21 | 株式会社日立製作所 | Electronic computer with cooling system |
| US9348378B2 (en) | 2012-04-19 | 2016-05-24 | Hitachi, Ltd. | Computer provided with cooling system |
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