JPH09162578A - Liquid-cooling structure of electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid-cooling structure of electronic components which is lightweight and easy of exchange. SOLUTION: Beat generating electronic components 4 are mounted on a cooling board 1. Cooling liquid flows in a flow tube 3. Heat generated from the electronic components 4 is conducted and absorbed by bringing the flow tube 3 into contact with the cooling board 1. The cooling board 1 is composed of aluminum which is light material excellent in heat conductivity. A plurality of pressing boards 2 are joined to the flow tube 3 and make unified body. Female screws are formed in the pressing boards 2, and the flow tube 3 can be detachably fixed to the cooling board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for liquid-cooling a heat-generating electronic component such as a transistor.

[0002]

2. Description of the Related Art Next, a conventional liquid cooling structure for electronic parts will be described with reference to the configuration diagram of FIG. In FIG. 6, 11 is a cooling substrate, 13 is a flow tube, and 4 is a transistor which is a heat generating electronic component.

In FIG. 6, a plurality of transistors 4 are mounted on the cooling board 11. A U-shaped flow tube 13 is brazed to the cooling substrate 11. FIG. 7 is a partial cross-sectional view of FIG. 6, showing a state in which the flow tube 13 is joined to the cooling substrate 11 by flare brazing.

In FIG. 6, the cooling liquid is supplied from one end of the flow tube 13. Since the cooling liquid absorbs the heat of the cooling plate 11, the heat generation temperature of the transistor can be lowered. In addition, as the cooling liquid, for example, inexpensive groundwater is used.

[0005]

The flow tube 13 shown in FIG. 6 is made of a copper pipe which ensures corrosion resistance and is excellent in thermal conductivity. In FIG. 6, the flow tube 13 and the cooling substrate 11 are brazed to each other in order to improve heat conduction, but the copper cooling substrate 11 may be deformed due to thermal strain during brazing.
Further, copper has a specific gravity of 8.8 kg / m ³ , which makes the cooling substrate 11 integrated with the flow tube 13 heavy.

Further, when replacing the cooling substrate 11 of FIG. 6 mounted on the apparatus, it is wasteful to replace the entire flow tube 13 integrated with the cooling substrate 11.

According to the present invention, the cooling board is made of the same material as that of the flow tube by joining a plurality of pressing plates to the flow tube and detachably attaching the flow tube integrated with the mounting plate to the cooling board. It is an object of the present invention to provide a liquid cooling structure for electronic parts which is excellent in cooling and easy to replace.

[0008]

In order to achieve this object, according to the present invention, a heat generating electronic component is mounted on a cooling substrate, and a flow tube through which a cooling liquid flows is brought into contact with the cooling substrate. Is a liquid cooling structure of an electronic component that absorbs heat, wherein the cooling substrate is composed of a lightweight material having favorable thermoconductivity, and a pressing plate is joined to the flow tube to be integrated, and the integrated flow tube is It is characterized in that it is detachably attached to the cooling substrate.

[0009]

Since the flow tube through which the cooling liquid flows and the cooling substrate on which the electronic component is mounted are not required to be joined, the cooling substrate can be made of a workable and lightweight material. The cooling substrate or flow tube can be replaced alone. Also, the flow tube and the pressing plate are integrated by joining, and the contact area of the pressing plate with the cooling substrate is increased,
The thermal conductivity is improved and high cooling performance is obtained.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the structure of an embodiment according to the present invention. In FIG.
The parts corresponding to those in FIG. 6 are designated by the same reference numerals, and the description thereof will be omitted. In FIG. 1, 1 is a cooling substrate, 2 is a pressing plate, and 3 is a flow tube.

In FIG. 1, a plurality of transistors 4 are mounted on the cooling board 1. A plurality of pressing plates 2 are brazed to the U-shaped flow tube 3. A cooling liquid is supplied from one end of the flow tube 3. The cooling liquid absorbs the heat of the cooling plate 11 by conduction, so that the heat generation temperature of the transistor can be lowered. In addition, as the cooling liquid, for example, inexpensive groundwater is used.

FIG. 2 is a perspective exploded view of FIG. As shown in FIG. 2, the flow tube 3 and the plurality of pressing plates 2 are integrated. A female screw is formed in the pressing plate 2, a mounting hole for the cooling substrate 1 is provided, and the flow tube 3 with the pressing plate 2 is screwed.

Since the cooling substrate 3 is mounted with heat-generating components such as the transistor 4, it has good workability and strength.
Moreover, a material having good thermal conductivity is required. Furthermore, when many parts are mounted, a light material is required. The cooling substrate 3 is made of aluminum as a material that satisfies the above conditions.

FIG. 3 is a state diagram before joining the flow tube 3 and the pressing plate 2. The number of pressing plates 2 varies depending on the shape and length of the flow tube 3. Although the flow tube 3 in FIG. 1 is U-shaped, it is not limited to this and may be W-shaped, for example. The flow tube 3 uses a copper pipe for the same reason as in the prior art. Therefore, the press plate 2 to be brazed is also a copper material. The pressing plate 2 is provided with an internal thread portion for fixing the cooling plate 1.

FIG. 4 is a partial sectional view of FIG.
And the pressing plate 2 are joined by flare brazing.

FIG. 5 is a diagram showing how the heat of the transistor 4 in FIG. 1 is conducted. Heat generated from the transistor 4 can be conducted from not only the contact point between the flow tube 3 and the cooling substrate 1 but also the entire mounting surface of the pressing plate 2 to which the flow tube 3 is attached.

The cooling performance according to the structure of the embodiment of the present invention is, for example, 15 W when mounted as shown in FIG.
It is expected that the junction temperature will be 82.9 ℃ when three transistors and one 4.5W diode are mounted. Since the absolute rating of the transistor is 150 ° C. and the derating is 0.55, the temperature reliability is high.

[0018]

As described above, according to the present invention, when the flow tube and the cooling substrate are attached, the pressing plate is used, so that it is not necessary to match the cooling base material with the material of the flow tube. Excellent materials can be used. Further, since the cooling substrate and the flow tube are not brazed, the cooling substrate is not distorted and the uniformity of contact is not impaired. In addition, the flow tube and the cooling substrate can be removed with the electronic element attached, and the flow tube can be replaced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a structure of an embodiment according to the present invention.

FIG. 2 is a perspective exploded view of FIG.

FIG. 3 is a state diagram before joining the flow tube 3 and the pressing plate 2.

FIG. 4 is a partial sectional view of FIG. 1;

FIG. 5 is a diagram showing how heat is transmitted through a transistor 4 in FIG.

FIG. 6 is a configuration diagram of a liquid cooling structure for an electronic component according to a conventional technique.

FIG. 7 is a partial sectional view of FIG. 6;

[Explanation of symbols]

 1 Cooling Substrate 2 Holding Plate 3 Flow Tube 4 Transistor (Electronic Component)

Claims (1)

[Claims] 1. A heat-generating electronic component is mounted on a cooling board,
A liquid cooling structure of an electronic component that absorbs heat transfer of the electronic component by bringing a flow tube through which a cooling liquid flows into contact with the cooling substrate, wherein the cooling substrate is composed of a lightweight material having favorable thermal conductivity, A liquid cooling structure for an electronic component, wherein a pressure plate is joined to a pipe to be integrated, and the integrated flow pipe is detachably attached to the cooling substrate.