五、新型說明： 【新墊所屬之技術領域】··- [0001] 本創作係有關於一種散熱單元，尤指一種不破壞散熱單 元其本身而於其上設置固定結構，提供一較佳之鎖固方 式，進而得有效防止該散熱單元其内腔室產生滲漏影響 熱傳效率的散熱單元之固定結構。 【先前技術】 [0002] 隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元 件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而 來產生的熱變成電子設備與系統改善性能的主要障礙。 無論形成電子元件的半導體尺寸不斷地縮小，仍持續地 要求增加性能。 當半導體尺寸縮小，結果熱通量增加，熱通量增加所造 成將產品冷卻的挑戰超過僅僅是全部熱的增加，因為熱 通量的增加造成在不同時間和不同長度尺寸會過熱，可 能導致電子故障或損毀。 而均溫板係為一種較大範圍面與面之熱傳導應用，其 有別於熱管之點對點的熱傳導方式，並適用於空間較為 窄小之處使用。 均溫板具有一受熱面與一冷凝面及一真空腔室並填充 有工作流體，該真空腔室内具有複數支撐柱及毛細結構 ，該等支撐柱連接該均溫板之受熱面與冷凝面並支撐該 真空腔室，均溫板係透過該受熱面與熱源貼設，該均溫 板另一側之冷凝面則與另一散熱裝置連接傳導熱量，並 該工作流體於受熱面處吸附熱量產生蒸發轉換成汽態之 表單編號A0101 第3頁/共15頁 M419135 工作流體，該汽態工作流體於該冷凝面處產生冷凝，轉 ’換為液態，該液態之S作流體透過腔室内部之毛細結構 回流至受熱面，工作流體於該腔室内形成汽液循環傳導 熱量。 習知係將均溫板與一基板結合使用並透過均溫板傳導 該基板上之發熱元件之熱量，習知技術主要係於均溫板 避開該腔室之部位，即該均溫板之四耦處各穿設一具有 内螺牙之銅柱，基板相對該均溫板設置銅柱之位置係開 設至少一孔洞，再透過一螺鎖元件以螺鎖之方式同時穿 設該等銅柱及孔洞將該均溫板固定於該基板上，但此一 固定方式因銅柱設置於該均溫板之四耦處，與該發熱元 件距離較遠，該均溫板固定後與發熱元件無法緊密貼合 ，進而產生熱阻現象；為改善前述無法緊密貼合之問題 ，則業者將銅柱直接對應設置於該均溫板與發熱元件貼 設之部位之鄰近處，故該等銅柱係直接貫穿均溫板具有 腔室之部位，雖可增加組裝時緊密度防止熱阻現象產生 ，但該均溫板之腔室受該等銅柱貫穿破壞後失去氣密性 ，其腔室内部不再具有真空狀態，並且因銅柱貫穿破壞 該腔室，則其内部之工作流體之流動路徑可能因此受阻 礙造成熱傳效率降低，甚至嚴重亦可能產生洩漏，進而 令該均溫板失去熱傳效用；故習知技術具有下列缺點： 1. 易產生熱阻現象； 2. 熱傳效率降低。 【新型内容】 [0003] 爰此，為有效解決上述之問題，本創作之主要目的在提 供一種具有確保腔室内之氣密性，並提供較佳鎖固性的 表單編號A0101 第4頁/共15頁 散熱單元之固定結構。 為達上述目的，本釗作係提供一種散熱單元之固定結 構，係包括一本體及複數固定件，該本體具有一腔室及 複數支撐部，該等支撐部係設置在該腔室内，並該腔室 内填充有一工作流體，至少一毛細結構係形成在腔室内 壁上，而該等固定件係對接本體的一側上，且對應該腔 室内的該等支撐部，並該等固定件設有一結合孔；透過 前述固定件與本體結合一體的設計，使得有效確保腔室 内之氣密性，並可令散熱單元與其他元件達到緊密結合 ，進而更達到較佳鎖固性之效果者。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 附圖式之較佳實施例予以說明。 本創作係一種散熱單元之固定結構，請參閱第ΙΑ、1B 圖係顯示本創作之一第一較佳實施例之組合及剖面示意 圖；該散熱單元之固定結構係包括一本體1及複數固定件 2，該本體1於該較佳實施係以均溫板做說明，但並不侷 限於此，或亦可為一熱板。並前述本體1具有一腔室10及 複數支撐部11，該腔室10内設置有該等支撐部11，該等 支撐部11之兩端分別抵接相對該腔室10之内壁，用以支 撐該本體1之腔室10。其中前述支撐部11係以金屬材質所 構成的支撐體，如銅柱，該支撐部11上可設有燒結體及 溝槽其中任一。 另者前述腔室10内填充有一工作流體7，該工作流體7 係為如為如純水、無機化合物、醇類、酮類、液態金屬 、冷煤、有機化合物或其混合物其中任一。至少一毛細 表單編號A0101 第5頁/共15頁 M419135 結構3係形成在該腔室10内壁上，使汽態之工作流體於該 本體1的另一側（即所稱冷凝區）處後巧冷凝轉換成液態之 工作流體，並該液態之工作流體透過所述腔室10内的毛 細結構3回流至該本體1的一側（即所稱蒸發區），以促使 工作流體於該腔室10内汽液相變循環傳導熱量。 再者，前述固定件2係以金屬材質所構成，於該較實施之 固定件2係採用銅材質做說明，但並不侷限於此，於具體 實施時，該固定件2亦可選擇為如鋁材質、金材質、鐵材 質及鋁合金材質及合金材質其中任一。 續參閱第2圖，輔以參閱第1B圖示，所述固定件2係對接 該本體1之一侧上，且對應該腔室10内的該等支撐部11 ; 其中該固定件2與本體1 一側的對接方式係採用以焊接、 機械加工及尖端放電其中任一，以使該固定件2與本體1 結合一體。 該等固定件2具有一固定端21、一自由端22、一結合 孔24，該固定端21係固接在該本體1的一側並對應腔室10 内的支撐部11，該自由端22則從該固定端21向外延伸構 成，並前述結合孔24内側具有一内螺紋26，係用以供對 應的鎖定件5相鎖固（如第4圖示）。 故透過本創作前述固定件2設於該本體1之一側上，且 對應該腔室10内的該等支撐部11的設計，使得有效防止 該腔室10產生滲漏影響熱傳效率（即有效確保該腔室10内 的氣密性），並可令散熱單元與其他元件緊密結合，藉以 達到較佳鎖固性之效果。 請參閱第3、4、5圖示，係顯示本創作之第二較佳實施例 之立體示意圖；該較佳實施例之結構及連結關係及功效 表單编號A0101 第6頁/共15頁 大致與前述第一較佳實施例相同，故在此不重新贅述， 其兩者差異處在於：前述本體1的一规凸設有至少一受熱. 區13，該受熱區13係相鄰該等固定件2 ;並該本體1係對 應與一機板4相貼設，該機板4上設有至少一發熱元件41( 如中央處理器、南北橋晶片、繪圖晶片），而前述受熱區 13係相對貼設在機板4上的發熱元件41上，用以吸附發熱 元件41產生的熱琴。 « ： 另者，該等固定件2之該自由端22係與對應的機板4 一 侧相貼靠，以透過複數鎖定件5穿設相對所述機板4上具 有的複數洞孔43及該等結合孔24相鎖固。其中該鎖定件5 外側具有一外螺紋51，該外螺紋51係與相對所述結合孔 24之内螺紋26相螺合。 再者，續參閱第4、5圖示，前述本體1的另一侧上設 有一散熱器6，該散熱器6具有複數散熱鰭片61，該等散 熱鰭片61係連接在該本體1的另一側上，使該本體1的另 一側上的熱源透過該等散熱鰭片61以輻射方式散發出去 ，以促進助該汽態之工作流體於前述冷凝區（即該本體1 之另一側）加速冷凝而轉換成液態之工作流體。 所以透過本創作此結構的設計，使得有效在不破壞整 體散熱單元的結構之下，讓受熱區13與發熱元件41緊密 貼靠，藉以減少熱阻的產生，並更有效防止該腔室10產 生滲漏影響熱傳效率（即有效確保該腔室10内的氣密性） ，進而又可達到較佳鎖固性之效果。 請參閱第6A、6B圖示，係顯示本創作之第三較佳實施 例之立體示意圖；該較佳實施例之結構及連結關係及功 效大致與前述第二較佳實施例相同，故在此不重新贅述 表單編號A0101 第7頁/共15頁 M419135 ，其兩者差異處在於：前述本體1更具有一第一板體15及 i谧K 一 二板體16，該第一板體15係對應蓋合該第二板體16 ，並共同界定所述腔室10。 另者，前述支撐部11係設置在該腔室10内，且其兩端 分別抵接相對該第一、二板體15、16的一側，以支撐該 第一、二板體15、16。而該等固定件2係對接在該第一板 體15上，且對應該本體1之腔室10内的該等支撐部11。 再者，所述受熱區13係凸設形成在該第一板體15的另 一側上，以與對應該機板4上的發熱元件41相貼設，並透 °過複數鎖定件5穿設相對複數洞孔43及該等結合孔24相鎖 固一起；該散熱器6則對接在該第二板體16的另一側上， 用以輔助快速散熱。 因此，透過本創作前述固定件2設於該第一板體15上 ，且對應該腔室10内的該等支撐部11的設計，使得有效 在不破壞整體散熱單元的結構之下，讓受熱區13與發熱 元件41緊密貼靠，藉以減少熱阻的產生，並更有效防止 該腔室10產生滲漏影響熱傳效率（即有效確保該腔室10内 的氣密性），進而又可達到較佳鎖固性之效果。 以上所述，本創作相較於習知具有下列優點： 1. 具有達到在不破壞散熱單元其本身而於其上設置固定 結構，藉以防止該散熱單元其内腔室產生滲漏影響熱傳 效率之效果； 2. 具有較佳鎖固性。 惟以上所述者，僅係本創作之較佳可行之實施例而已 ，舉凡利用本創作上述之方法、形狀、構造、裝置所為 之變化，皆應包含於本案之權利範圍内。 表單編號Α0101 第8頁/共15頁 M419135 【圖式簡單說明】 [0005]..第1A圖係本創作之第一較佳實施例之組合立體示意圖； 二· - 、_ 第1B圖係本創作之第一較佳實施例之剖面示意圖； 第2圖係本創作之第一較佳實施例之分解立體示意圖； 第3圖係本創作之第二較佳實施例之組合立體示意圖； 第4圖係本創作之第二較佳實施例之分解立體示意圖； 第5圖係本創作之第二較佳實施例之另一組合立體示意圖 第6A圖係本創作之第三較佳實施例之組合立體示意圖； 第6B圖係本創作之第三較佳實施例之剖面示意圖。 【主要元件符號說明】 本體 … 1 内螺紋 … 26 腔室 … 10 毛細結構 … 3 支撐部 … 11 機板 • · · 4 受熱區 … 13 發熱元件 … 41 第一板體 … 15 洞孔 … 43 第二板體 … 16 鎖定件 … 5 固定件 … 2 外螺故 … 51 固定端 … 21 散熱器 … 6 自由端 … 22 散熱鰭片 … 61 結合孔 ...24 工作流體 … 7 表單編號A0101 第9頁/共15頁V. New description: [Technical field to which new mat belongs]··- [0001] This creation relates to a heat dissipating unit, especially a fixing structure on which the heat dissipating unit itself is not damaged, providing a better lock. In the solid mode, the fixing structure of the heat dissipating unit which effectively prevents the leakage of the inner cavity of the heat dissipating unit from affecting the heat transfer efficiency is obtained. [Prior Art] [0002] With the current electronic devices gradually becoming the slogan, all components must be reduced in size, but the heat generated by the shrinking of electronic devices becomes electronic devices and systems to improve performance. The main obstacle. Regardless of the ever-shrinking size of semiconductors forming electronic components, there is a continuing demand for increased performance. As semiconductors shrink in size, the resulting heat flux increases, and the increase in heat flux causes the challenge of cooling the product more than just the increase in total heat, as the increase in heat flux causes overheating at different times and lengths, possibly leading to electrons. Failure or damage. The uniform temperature plate is a kind of heat transfer application with a wide range of surface and surface, which is different from the point-to-point heat conduction mode of the heat pipe, and is suitable for use in a narrow space. The temperature equalizing plate has a heating surface and a condensation surface and a vacuum chamber filled with a working fluid. The vacuum chamber has a plurality of supporting columns and a capillary structure, and the supporting columns are connected to the heating surface and the condensation surface of the temperature equalizing plate. Supporting the vacuum chamber, the temperature equalizing plate is attached to the heat source through the heating surface, and the condensation surface on the other side of the temperature equalizing plate is connected to another heat dissipating device to conduct heat, and the working fluid absorbs heat at the heating surface. Evaporation into vapor form No. A0101 Page 3 of 15 M419135 Working fluid, the vaporous working fluid produces condensation at the condensation surface, and is converted to a liquid state, and the liquid S is used as a fluid to pass through the chamber. The capillary structure is returned to the heated surface, and the working fluid forms a vapor-liquid circulation in the chamber to conduct heat. Conventionally, a temperature equalizing plate is used in combination with a substrate and the heat of the heating element on the substrate is transmitted through the temperature equalizing plate. The prior art is mainly applied to the portion of the temperature equalizing plate that avoids the chamber, that is, the temperature equalizing plate Each of the four couplings is provided with a copper column having an internal thread, and the substrate is provided with at least one hole at a position where the copper column is disposed relative to the temperature equalizing plate, and the copper pillars are simultaneously threaded through a screw locking component. And the hole fixing the temperature equalizing plate on the substrate, but the fixing manner is because the copper column is disposed at the four couplings of the temperature equalizing plate, and the distance from the heating element is far, the heating element cannot be heated and the heating element cannot be fixed. Tightly fitting, which causes thermal resistance; in order to improve the above-mentioned problem of intimate close fitting, the manufacturer directly places the copper column in the vicinity of the position where the temperature equalizing plate and the heating element are attached, so the copper column system Directly penetrating the portion of the uniform temperature plate with the chamber, although the tightness during assembly can be increased to prevent the occurrence of thermal resistance, the chamber of the uniform temperature plate loses airtightness after being broken by the copper columns, and the interior of the chamber is not Have a vacuum state, and When the copper column breaks through the chamber, the flow path of the working fluid inside may be hindered to cause a decrease in heat transfer efficiency, and even a serious leak may occur, thereby causing the temperature-average plate to lose heat transfer effect; The following disadvantages: 1. It is easy to produce thermal resistance; 2. The heat transfer efficiency is reduced. [New content] [0003] In order to effectively solve the above problems, the main purpose of the present invention is to provide a form number A0101 which has a good airtightness in the chamber and provides better locking property. Fixed structure of 15 pages heat sink unit. In order to achieve the above object, the present invention provides a fixing structure of a heat dissipating unit, comprising a body and a plurality of fixing members, the body having a chamber and a plurality of supporting portions, wherein the supporting portions are disposed in the chamber, and The chamber is filled with a working fluid, at least one capillary structure is formed on the inner wall of the chamber, and the fixing members are on one side of the docking body, and corresponding to the supporting portions in the chamber, and the fixing members are provided with a The coupling hole is integrated with the body through the foregoing fixing member, so that the airtightness in the chamber is effectively ensured, and the heat dissipating unit can be tightly combined with other components, thereby achieving better locking effect. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. The present invention is a fixed structure of a heat dissipating unit. Please refer to the first embodiment and the cross-sectional view of a first preferred embodiment of the present invention. The fixing structure of the heat dissipating unit includes a body 1 and a plurality of fixing members. 2, the body 1 is described in the preferred embodiment as a temperature equalizing plate, but is not limited thereto, or may be a hot plate. The body 1 has a chamber 10 and a plurality of supporting portions 11 . The supporting portions 11 are disposed in the chamber 10 . The two ends of the supporting portions 11 respectively abut against the inner wall of the chamber 10 for supporting The chamber 10 of the body 1. The support portion 11 is a support made of a metal material, such as a copper post, and the support portion 11 may be provided with any one of a sintered body and a groove. The aforementioned chamber 10 is filled with a working fluid 7 such as, for example, pure water, an inorganic compound, an alcohol, a ketone, a liquid metal, a cold coal, an organic compound or a mixture thereof. At least one capillary form number A0101 page 5 / 15 pages M419135 structure 3 is formed on the inner wall of the chamber 10, so that the working fluid in the vapor state is on the other side of the body 1 (ie, the so-called condensation zone) The condensation is converted into a liquid working fluid, and the liquid working fluid is returned to the side of the body 1 (ie, the so-called evaporation zone) through the capillary structure 3 in the chamber 10 to promote the working fluid in the chamber 10 The internal vapor phase change cycle conducts heat. In addition, the fixing member 2 is made of a metal material, and the fixing member 2 is made of a copper material. However, the fixing member 2 may be selected as follows. Any of aluminum, gold, iron, aluminum and alloy. 2, with reference to FIG. 1B, the fixing member 2 is butted on one side of the body 1 and corresponds to the supporting portions 11 in the chamber 10; wherein the fixing member 2 and the body 1 One side of the docking method adopts welding, machining and tip discharge to integrate the fixing member 2 with the body 1. The fixing member 2 has a fixed end 21, a free end 22, and a coupling hole 24 fixed to one side of the body 1 and corresponding to the support portion 11 in the chamber 10, the free end 22 Then extending from the fixed end 21, and the inner side of the coupling hole 24 has an internal thread 26 for locking the corresponding locking member 5 (as shown in FIG. 4). Therefore, the fixing member 2 is disposed on one side of the body 1 through the present invention, and corresponds to the design of the supporting portions 11 in the chamber 10, so that the leakage of the chamber 10 is effectively prevented from affecting the heat transfer efficiency (ie, The airtightness in the chamber 10 is effectively ensured, and the heat dissipating unit can be tightly coupled with other components, thereby achieving a better locking effect. 3, 4, and 5 are schematic views showing a second preferred embodiment of the present invention; the structure and connection relationship and function form number of the preferred embodiment A0101 Page 6 of 15 It is the same as the foregoing first preferred embodiment, so it will not be described again here. The difference between the two is that at least one heat receiving area 13 is disposed on the first body 1 , and the heated area 13 is adjacent to the fixed area. And the body 1 is correspondingly attached to a machine board 4, and the machine board 4 is provided with at least one heating element 41 (such as a central processing unit, a north-south bridge chip, a drawing chip), and the aforementioned heating zone 13 is The heat generating component 41 is attached to the heat generating component 41 on the board 4 to absorb the heat piano generated by the heat generating component 41. « : The free end 22 of the fixing member 2 is in contact with the corresponding side of the plate 4 to pass through the plurality of holes 43 and the plurality of holes 43 in the plate 4 through the plurality of locking members 5 and The coupling holes 24 are locked. The outer side of the locking member 5 has an external thread 51 which is screwed with the inner thread 26 of the coupling hole 24. In addition, referring to the fourth and fifth embodiments, a heat sink 6 is disposed on the other side of the body 1 , and the heat sink 6 has a plurality of heat dissipation fins 61 connected to the body 1 . On the other side, the heat source on the other side of the body 1 is radiated out through the heat dissipating fins 61 to promote the working fluid in the vapor state in the condensation zone (ie, the other body 1) Side) accelerates condensation and converts it into a liquid working fluid. Therefore, through the design of the structure of the present invention, the heat-receiving region 13 and the heat-generating component 41 are closely abutted under the structure without damaging the overall heat-dissipating unit, thereby reducing the generation of the heat resistance and preventing the generation of the chamber 10 more effectively. The leakage affects the heat transfer efficiency (i.e., effectively ensures the airtightness in the chamber 10), and the effect of better lockability is achieved. FIG. 6A and FIG. 6B are views showing a perspective view of a third preferred embodiment of the present invention; the structure and connection relationship and function of the preferred embodiment are substantially the same as those of the second preferred embodiment described above. The difference between the two forms is that the first body 15 and the first plate 15 and the first plate 15 are provided. The second plate body 16 is correspondingly closed and the chamber 10 is defined together. In addition, the support portion 11 is disposed in the chamber 10, and two ends of the support portion 11 abut against the first and second plates 15, 16 respectively to support the first and second plates 15, 16 . The fixing members 2 are butted against the first plate body 15 and correspond to the supporting portions 11 in the chamber 10 of the body 1. Furthermore, the heated area 13 is formed on the other side of the first plate body 15 to be attached to the heat generating component 41 on the corresponding board 4, and is passed through the plurality of locking members 5 The plurality of holes 43 and the coupling holes 24 are locked together; the heat sink 6 is butted on the other side of the second plate 16 to assist in rapid heat dissipation. Therefore, the fixing member 2 is disposed on the first plate body 15 through the present invention, and corresponding to the design of the supporting portions 11 in the chamber 10, so that the heat is effectively prevented from damaging the structure of the overall heat dissipating unit. The region 13 is in close contact with the heating element 41, thereby reducing the generation of thermal resistance, and more effectively preventing the leakage of the chamber 10 from affecting the heat transfer efficiency (ie, effectively ensuring the airtightness in the chamber 10), and further Achieve better locking effect. As described above, the present invention has the following advantages as compared with the prior art: 1. The utility model has the advantages that the fixing structure is disposed thereon without damaging the heat dissipating unit, thereby preventing the leakage of the inner chamber of the heat dissipating unit from affecting the heat transfer efficiency. The effect; 2. Has better locking. It is to be understood that the above-mentioned methods, shapes, structures, and devices of the present invention are all included in the scope of the present invention. Form No. 1010101 Page 8 of 15 M419135 [Simple Description of the Drawings] [0005]. Fig. 1A is a schematic perspective view of the first preferred embodiment of the present invention; 2·-, _ 1B BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is an exploded perspective view of a first preferred embodiment of the present invention; FIG. 3 is a combined perspective view of a second preferred embodiment of the present invention; Figure 2 is an exploded perspective view of a second preferred embodiment of the present invention; Figure 5 is a perspective view of another combination of the second preferred embodiment of the present invention. Figure 6A is a combination of the third preferred embodiment of the present invention. Fig. 6B is a schematic cross-sectional view showing a third preferred embodiment of the present invention. [Main component symbol description] Main body... 1 Internal thread... 26 Chamber... 10 Capillary structure... 3 Supporting part... 11 Plate • · · 4 Heating zone... 13 Heating element... 41 First plate... 15 Hole... 43 Two plates... 16 Locking parts... 5 Fixing parts... 2 External screws... 51 Fixed ends... 21 Heat sinks... 6 Free ends... 22 Heat sink fins... 61 Bonding holes...24 Working fluid... 7 Form number A0101 No. 9 Page / Total 15 pages