JPS56148847A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56148847A
JPS56148847A JP5309480A JP5309480A JPS56148847A JP S56148847 A JPS56148847 A JP S56148847A JP 5309480 A JP5309480 A JP 5309480A JP 5309480 A JP5309480 A JP 5309480A JP S56148847 A JPS56148847 A JP S56148847A
Authority
JP
Japan
Prior art keywords
polycrystalline silicon
layer
silicon layer
length
superposed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5309480A
Other languages
Japanese (ja)
Inventor
Kenjirou Mitake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5309480A priority Critical patent/JPS56148847A/en
Publication of JPS56148847A publication Critical patent/JPS56148847A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To make a polycrystalline silicon layer conductive by the introduction of impurity by one time by shortening the length of the superposed part of the polycrystalline silicon layers when a mutlilayer wire is formed using the polycrstalline silicon layer. CONSTITUTION:A field insulating film 2 is selectively formed on a P type silicon substrate 1, and a gate oxide film 3 is formed in the active region to form a transistor. After the first polycrystalline silicon layer 4 is patteered by a photoetching step, an insulating film 5 having a thickness of apporx. 0.5mum is formed on the layer 4. Subsequently, the second polycrystalline silicon layer 6 is covered on the entire surface, and when the layer 6 is patterned by a photoetching step, the length of the superposed part of the firt and the second polycrystalline silicon layers is shortened less than 5mum. When impurity is eventually introduced by an ion implantation, a diffusion or the like, the impuirty can be, since the length of the superposed part is short, uniformly introduced into the first and the second polycrystalline silicons.
JP5309480A 1980-04-22 1980-04-22 Manufacture of semiconductor device Pending JPS56148847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5309480A JPS56148847A (en) 1980-04-22 1980-04-22 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5309480A JPS56148847A (en) 1980-04-22 1980-04-22 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56148847A true JPS56148847A (en) 1981-11-18

Family

ID=12933189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5309480A Pending JPS56148847A (en) 1980-04-22 1980-04-22 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56148847A (en)

Similar Documents

Publication Publication Date Title
JPS5736844A (en) Semiconductor device
JPS5696850A (en) Semiconductor device and manufacture thereof
US3600642A (en) Mos structure with precisely controlled channel length and method
JPS56148847A (en) Manufacture of semiconductor device
JPS5742169A (en) Production of semiconductor device
JPS55165681A (en) Preparation of semiconductor device
JPS56125875A (en) Semiconductor integrated circuit device
EP0002107A3 (en) Method of making a planar semiconductor device
JPS55107229A (en) Method of manufacturing semiconductor device
JPS54107270A (en) Semiconductor device and its production
JPS577153A (en) Preparation of semiconductor device
JPS567482A (en) Manufacturing of semiconductor device
JPS5721865A (en) Manufacture of semiconductor device
JPS5522885A (en) Insulation gate type field effect semiconductor device
JPS55160455A (en) Manufacture of insulated gate type field effect semiconductor device
JPS6465875A (en) Thin film transistor and manufacture thereof
JPS5753958A (en) Semiconductor device
JPS6441245A (en) Manufacture of semiconductor device
JPS5522878A (en) Insulation gate type field effect semiconductor device
JPS568846A (en) Semiconductor integrated circuit
JPS52146568A (en) Production of silicon gate mos type semiconductor integrated circuit device
JPS57106150A (en) Manufacture of semiconductor device
JPS5513967A (en) Semiconductor integrated circuit device
JPS5739579A (en) Mos semiconductor device and manufacture thereof
JPS5578541A (en) Manufacture of semiconductor device