JPS56146242A - Positioning method of bonding position at fixed position on substrate - Google Patents

Positioning method of bonding position at fixed position on substrate

Info

Publication number
JPS56146242A
JPS56146242A JP4922380A JP4922380A JPS56146242A JP S56146242 A JPS56146242 A JP S56146242A JP 4922380 A JP4922380 A JP 4922380A JP 4922380 A JP4922380 A JP 4922380A JP S56146242 A JPS56146242 A JP S56146242A
Authority
JP
Japan
Prior art keywords
substrate
bonding position
target marks
fixed
observed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4922380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320379B2 (https=
Inventor
Toshimitsu Hamada
Mikio Hongo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4922380A priority Critical patent/JPS56146242A/ja
Publication of JPS56146242A publication Critical patent/JPS56146242A/ja
Publication of JPS6320379B2 publication Critical patent/JPS6320379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Die Bonding (AREA)
JP4922380A 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate Granted JPS56146242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4922380A JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4922380A JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Publications (2)

Publication Number Publication Date
JPS56146242A true JPS56146242A (en) 1981-11-13
JPS6320379B2 JPS6320379B2 (https=) 1988-04-27

Family

ID=12824928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4922380A Granted JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Country Status (1)

Country Link
JP (1) JPS56146242A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887838A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 位置認識方法
JPS58147037A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 混成集積回路
JPS60262432A (ja) * 1984-06-11 1985-12-25 Toshiba Corp マウント装置
JPS62155600A (ja) * 1985-12-27 1987-07-10 松下電器産業株式会社 電子部品実装方法
JPH02146832U (https=) * 1990-05-10 1990-12-13
JP2015525477A (ja) * 2012-06-06 2015-09-03 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法
JP2017183735A (ja) * 2017-05-10 2017-10-05 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887838A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 位置認識方法
JPS58147037A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 混成集積回路
JPS60262432A (ja) * 1984-06-11 1985-12-25 Toshiba Corp マウント装置
JPS62155600A (ja) * 1985-12-27 1987-07-10 松下電器産業株式会社 電子部品実装方法
JPH02146832U (https=) * 1990-05-10 1990-12-13
JP2015525477A (ja) * 2012-06-06 2015-09-03 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法
US10134622B2 (en) 2012-06-06 2018-11-20 Ev Group E. Thallner Gmbh Apparatus and method for ascertaining orientation errors
US10410896B2 (en) 2012-06-06 2019-09-10 Ev Group E. Thallner Gmbh Apparatus and method for ascertaining orientation errors
JP2017183735A (ja) * 2017-05-10 2017-10-05 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法

Also Published As

Publication number Publication date
JPS6320379B2 (https=) 1988-04-27

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