JPS56125866A - Coil - Google Patents

Coil

Info

Publication number
JPS56125866A
JPS56125866A JP2986580A JP2986580A JPS56125866A JP S56125866 A JPS56125866 A JP S56125866A JP 2986580 A JP2986580 A JP 2986580A JP 2986580 A JP2986580 A JP 2986580A JP S56125866 A JPS56125866 A JP S56125866A
Authority
JP
Japan
Prior art keywords
film
conductive layer
metallic
layer patterns
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2986580A
Other languages
Japanese (ja)
Inventor
Hironari Mannami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP2986580A priority Critical patent/JPS56125866A/en
Publication of JPS56125866A publication Critical patent/JPS56125866A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain an inductance element, whose inductance value and a Q value are large, by forming a coil to an integrated circuit. CONSTITUTION:An N type epitaxial layer 2 and an insulating film 3 consisting of silicon oxide are made up on a P type silicon semiconductor substrate 1, and the first conductive layer patterns are built up by metallic film pieces 4 consisting of aluminum. The second conductive layer patterns 8 tilting to the first conductive layer patterns 4 and lead sections 9, 10 are formed by metallic film. A ferromagnetic film 7 being composed of permalloy is made up on an insulating film 5, and the film 7 is further coated with an insulating film 6. A flat shape of the ferromagnetic film 7 is rectangular, and the film 7 forms a closed magnetic path to magnetic flux generated. The end sections of the metallic film pieces 4, 8 are connected by metallic layers in opening sections vertically made up to the insulating films 5, 6, and a coil is built up. Thus, an inductance element is easily formed into an integrated circuit.
JP2986580A 1980-03-10 1980-03-10 Coil Pending JPS56125866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2986580A JPS56125866A (en) 1980-03-10 1980-03-10 Coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2986580A JPS56125866A (en) 1980-03-10 1980-03-10 Coil

Publications (1)

Publication Number Publication Date
JPS56125866A true JPS56125866A (en) 1981-10-02

Family

ID=12287861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2986580A Pending JPS56125866A (en) 1980-03-10 1980-03-10 Coil

Country Status (1)

Country Link
JP (1) JPS56125866A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102011U (en) * 1984-12-11 1986-06-28
JPS61161747A (en) * 1985-01-10 1986-07-22 Matsushita Electronics Corp Semiconductor integrated circuit
JPH054516U (en) * 1991-04-11 1993-01-22 三菱電機株式会社 Inductor
EP0778593A1 (en) * 1995-12-07 1997-06-11 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for realizing magnetic circuits in an integrated circuit
US5760456A (en) * 1995-12-21 1998-06-02 Grzegorek; Andrew Z. Integrated circuit compatible planar inductors with increased Q
JP2018524800A (en) * 2015-06-25 2018-08-30 インテル アイピー コーポレイション WLCSP vertical inductor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102011U (en) * 1984-12-11 1986-06-28
JPS61161747A (en) * 1985-01-10 1986-07-22 Matsushita Electronics Corp Semiconductor integrated circuit
JPH054516U (en) * 1991-04-11 1993-01-22 三菱電機株式会社 Inductor
EP0778593A1 (en) * 1995-12-07 1997-06-11 Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for realizing magnetic circuits in an integrated circuit
US5936298A (en) * 1995-12-07 1999-08-10 Sgs-Thomson Microelectronics S.R.L. Method for realizing magnetic circuits in an integrated circuit
US5760456A (en) * 1995-12-21 1998-06-02 Grzegorek; Andrew Z. Integrated circuit compatible planar inductors with increased Q
JP2018524800A (en) * 2015-06-25 2018-08-30 インテル アイピー コーポレイション WLCSP vertical inductor
US10784033B2 (en) 2015-06-25 2020-09-22 Intel IP Corporation Vertical inductor for WLCSP
US11250981B2 (en) 2015-06-25 2022-02-15 Intel Corporation Vertical inductor for WLCSP
US11984246B2 (en) 2015-06-25 2024-05-14 Intel Corporation Vertical inductor for WLCSP

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