JPH01173702A - Inductance element - Google Patents
Inductance elementInfo
- Publication number
- JPH01173702A JPH01173702A JP33199787A JP33199787A JPH01173702A JP H01173702 A JPH01173702 A JP H01173702A JP 33199787 A JP33199787 A JP 33199787A JP 33199787 A JP33199787 A JP 33199787A JP H01173702 A JPH01173702 A JP H01173702A
- Authority
- JP
- Japan
- Prior art keywords
- inductance
- resin film
- magnetic
- substrate
- inductance element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000696 magnetic material Substances 0.000 claims abstract description 10
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 17
- 239000000919 ceramic Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/045—Trimming
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、民生用及び産業用の各種電子回路に用いるイ
ンダクタンス素子に関するものであり、特に薄形、小形
をめざした平面形のインダクタンス素子に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an inductance element used in various electronic circuits for consumer and industrial use, and particularly relates to a planar inductance element that aims to be thin and small. be.
従来の技術
従来の平面形インダクタンス素子は、第４図に示すよう
な構造がよく知られている。第４図の従来のインダクタ
ンス素子は、基板４１の一方の主面にスパイラル状の導
体４２を設け、その一端を外部端子の一つとして用い、
他端はスルーホール４３を介して基板６１の他方の主面
に導出し、もう一方の外部端子となる導体４４に接続し
ている。2. Description of the Related Art A conventional planar inductance element having a structure as shown in FIG. 4 is well known. In the conventional inductance element shown in FIG. 4, a spiral conductor 42 is provided on one main surface of a substrate 41, and one end of the spiral conductor 42 is used as one of the external terminals.
The other end is led out to the other main surface of the substrate 61 via the through hole 43 and connected to a conductor 44 that becomes the other external terminal.
また、より大きなインダクタンスを得るために、基板４
１の両生面にスパイラル状導体４２を設け、これをスル
ーホール４３で接続した構造もよく知られている。Also, in order to obtain larger inductance, the substrate 4
A structure in which a spiral conductor 42 is provided on both sides of the conductor 1 and connected through a through hole 43 is also well known.
なお、導体４２．４３は通常Ａｇ、ムｇ−Ｐｄ 等の
ペーストを印刷した後これを規き付ける工法が用いられ
る。Note that the conductors 42 and 43 are usually formed by printing a paste of Ag, Mug-Pd, etc. and then fixing it.
発明が解決しようとする問題点
以上述べた従来のインダクタンス素子は平面上でインダ
クタが構成でき、世のすう勢である高密度実装化、それ
に伴なうＨＩＣ化に対応したインダクタである。Problems to be Solved by the Invention The conventional inductance element described above allows an inductor to be constructed on a plane, and is an inductor compatible with the trend toward high-density packaging and the accompanying HIC.
しかしながら、上述した構造からも明らかなように、ス
パイラル状の導体４２の巻き回数に制限があるため大き
なインダクタンスが得られない欠点を有していた。また
、大きなインダクタンスを得るために導体の幅及び導体
間隙を狭くすると、断線やショートが発生しやすく信頼
性に乏しいという欠点を有していた。However, as is clear from the above-described structure, there is a limit to the number of turns of the spiral conductor 42, which has the disadvantage that a large inductance cannot be obtained. Furthermore, when the width of the conductor and the gap between the conductors are narrowed in order to obtain a large inductance, there is a drawback that disconnections and short circuits are likely to occur and reliability is poor.
本発明の目的は、このような従来のインダクタンス素子
の欠点を改善し、大きなインダクタンスとＱを実現し、
かつ信頼性の高いインダクタンス素子を提供することに
ある。The purpose of the present invention is to improve the drawbacks of such conventional inductance elements, realize large inductance and Q,
Another object of the present invention is to provide an inductance element that is also highly reliable.
問題点を解決するための手段
上述した問題点を解決するため本発明は、基板の平担な
面に所定のインダクタンスが得られるコイル部を設け、
このコイル部を含む前記平担な面に磁性粒子と樹脂の混
合物からなる磁性樹脂膜を設けたことを特徴としたもの
であり、大きなインダクタンスを有し、かつ信頼性の高
いインダクタンス素子を提供するものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a coil portion capable of obtaining a predetermined inductance on a flat surface of a substrate,
The present invention is characterized in that a magnetic resin film made of a mixture of magnetic particles and resin is provided on the flat surface including the coil portion, and an inductance element having a large inductance and high reliability is provided. It is something.
作用
本発明は、平担なコイル部に磁性樹脂の膜を設けること
により磁束の集中化を図り、磁性樹脂膜の実効的な透磁
率μに応じた大きいインダクタンスが得られる。Effect of the present invention By providing a magnetic resin film on a flat coil portion, magnetic flux is concentrated, and a large inductance corresponding to the effective magnetic permeability μ of the magnetic resin film can be obtained.
実施例 以下に本発明を実施例に基づいて詳細に説明する。Example The present invention will be explained in detail below based on examples.
第１図は本発明の一実施例を示す透過斜視図であり、１
はアルミナ等のセラミック基板であり、その平担な面に
導体３をつづら折れ状に設はコイル部を形成している。FIG. 1 is a transparent perspective view showing one embodiment of the present invention.
is a ceramic substrate made of alumina or the like, and the conductor 3 is arranged in a zigzag manner on its flat surface to form a coil portion.
２は磁性樹脂の膜であり、この磁性樹脂２は面実装を考
慮してエポキシ樹脂等の耐熱性の高い樹脂に、磁性体と
してフェライトを分散させである。磁性体としてはフェ
ライトの他にアモルファス磁性体を用いると、より大き
なインダクタンスが得られる。また、熱的に安定なフェ
ライトとアモルファス磁性体とを混合して用いることに
より、大きなインダクタンスが得られかつ温度特性に優
れたインダクタンス素子とすることができる。Reference numeral 2 denotes a magnetic resin film, and the magnetic resin 2 is made by dispersing ferrite as a magnetic substance in a highly heat-resistant resin such as epoxy resin in consideration of surface mounting. If an amorphous magnetic material is used in addition to ferrite as the magnetic material, a larger inductance can be obtained. Further, by using a mixture of thermally stable ferrite and an amorphous magnetic material, it is possible to obtain a large inductance and an inductance element with excellent temperature characteristics.
なお、磁性体の含有量は重量比にて６０％〜９６チが好
ましい。これは、含有量が６０％に満たないと磁性体の
効果が薄く、９６チ以上では均一に分散させることが困
難であり、また樹脂としての適切な粘度が得られないた
め作業性が悪くなる。The content of the magnetic material is preferably 60% to 96% by weight. This is because if the content is less than 60%, the effect of the magnetic material will be weak, and if it is more than 96%, it will be difficult to disperse it uniformly, and the workability will be poor because the appropriate viscosity as a resin cannot be obtained. .
第２図に本実施例における磁性樹脂膜２（磁性体として
Ｎｉ −Ｚｎ系フェライトを重量比で８０％含有。）の
効果を、空芯状態（すなわち、磁性樹脂膜のない場合。FIG. 2 shows the effect of the magnetic resin film 2 (containing 80% by weight of Ni-Zn ferrite as the magnetic material) in this example in an air-core state (that is, when there is no magnetic resin film).
〕に対するインダクタンスのｕｐ率として示す。図示し
たように磁性樹脂膜２を厚くすることによって空芯状態
に比べ約６０％の高いインダクタンスを得ることができ
る。また図から明らかなように、磁性樹脂膜２の厚さを
変えることによりインダクタンスの微調整が可能であり
、さらには、導体３のパターンを変えることなくインダ
クタンスの粗調整が可能である。これは、従来のインダ
クタンス素子では、要求されるインダクタンス値に対応
した導体パターンを全て準備しなければならないのに対
し、本発明のインダクタンス素子は、一定の間隔でパタ
ーンを準備すればよく、パターンコスト、パターン取替
え工数の低減等の製造コストを大幅に低減できる。] is shown as the inductance up rate. As shown in the figure, by increasing the thickness of the magnetic resin film 2, it is possible to obtain an inductance approximately 60% higher than that in an air-core state. Further, as is clear from the figure, fine adjustment of the inductance is possible by changing the thickness of the magnetic resin film 2, and furthermore, coarse adjustment of the inductance is possible without changing the pattern of the conductor 3. This is because, while conventional inductance elements require the preparation of all conductor patterns corresponding to the required inductance value, the inductance element of the present invention only needs to prepare patterns at fixed intervals, which reduces the pattern cost. , manufacturing costs such as reduction in pattern replacement man-hours can be significantly reduced.
第３図に本発明の他の実施例を透過斜視図で示す。FIG. 3 shows another embodiment of the present invention in a transparent perspective view.
第３図において、１は基板であり、本実施例ではポリエ
ステルフィルム等の耐熱性の高いフィルムを用いた。２
は磁性樹脂膜であり、基板１の両側に設けた。基板１の
両方の平担な面には導体３によってスパイラル状のコイ
ル部（片面のみ図示、他面は図示せず。）が設けてあり
、両コイル部はスルーホール４により電気的に接続して
いる。導体３の各々の一端は磁性樹脂膜２の両端面に露
出しており、この端面に各々銀ペースト等の導電性樹脂
ペーストをコーティングして外部端子とすることにより
、面実装用のチップインダクタとして使用できる。In FIG. 3, reference numeral 1 denotes a substrate, and in this example, a highly heat-resistant film such as a polyester film was used. 2
are magnetic resin films, which were provided on both sides of the substrate 1. A spiral coil portion (only one side is shown, the other side is not shown) is provided on both flat surfaces of the substrate 1 by a conductor 3, and both coil portions are electrically connected through a through hole 4. ing. One end of each conductor 3 is exposed on both end faces of the magnetic resin film 2, and by coating each end face with a conductive resin paste such as silver paste to form an external terminal, it can be used as a chip inductor for surface mounting. Can be used.
以上本発明を実施例に基づいて説明したが、本発明は上
述した実施例に限定されるものではなく、例えばコイル
部を形成する導体３の形状はフープ状、スパイラル状、
つづら折れ状等各種の形状を用いることができる。また
、コイル部及び磁性樹脂膜２は各々基板１の片面のみな
らず両面に設けても良い。さらには、実施例では基板１
を個片で示したがこれは連続した基板１でも良い。すな
わち、Ｌ、Ｃ，Ｒ等による電子回路を形成した基板１上
のＬ部に用いることができ、また、電子回路の総合特性
上問題がなければ他の部品も含めて磁性樹脂膜２を設け
ても良い。Although the present invention has been described above based on the embodiments, the present invention is not limited to the embodiments described above. For example, the shape of the conductor 3 forming the coil portion may be a hoop shape, a spiral shape,
Various shapes such as a zigzag shape can be used. Further, the coil portion and the magnetic resin film 2 may be provided not only on one side of the substrate 1 but also on both sides. Furthermore, in the embodiment, the substrate 1
Although the substrate 1 is shown as an individual piece, it may be a continuous substrate 1. That is, the magnetic resin film 2 can be used on the L portion of the substrate 1 on which an electronic circuit is formed using L, C, R, etc., and if there is no problem in terms of the overall characteristics of the electronic circuit, the magnetic resin film 2 can be provided on other parts as well. It's okay.
発明の効果
以上述べたように本発明によるインダクタンス素子は基
板の平担な面に設けたコイル部を磁性樹脂膜で覆うこと
により、小形、薄形で大きなインダクタンスが得られま
た磁性樹脂膜の厚みを変えることにより、インダクタン
スの調整（粗調整及び微調整）ができ、製造歩留が高く
、同一形状のパターンで数ランクのインダクタンス素子
が得られるため製造コストが低減できる。Effects of the Invention As described above, the inductance element according to the present invention can obtain a large inductance with a small size and thinness by covering the coil portion provided on the flat surface of the substrate with a magnetic resin film. By changing the inductance, the inductance can be adjusted (rough adjustment and fine adjustment), the manufacturing yield is high, and the manufacturing cost can be reduced because several ranks of inductance elements can be obtained with the same pattern.
またコイル部を磁性樹脂膜で覆うことにより、磁気シー
ルドの機能をもったインダクタンス素子となる。Furthermore, by covering the coil portion with a magnetic resin film, it becomes an inductance element with a magnetic shielding function.
第１図、第３図は本発明の一実施例を示す透過斜視図、
第２図は本発明の効果の一例を示す図、第４図は従来の
インダクタンス素子を示す斜視図である。
１・・・・・・基板、２・・・・・・磁性樹脂膜、３・
・・・・・導体、４・・・・・・スルーホール。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
囚
第 ２（２Ｉ
７＠本生１け脂層の）ｉみ ＣメＬ７〕第 ３ 図
４ スクレーノ丁（−）ν1 and 3 are transparent perspective views showing one embodiment of the present invention,
FIG. 2 is a diagram showing an example of the effect of the present invention, and FIG. 4 is a perspective view showing a conventional inductance element. 1...Substrate, 2...Magnetic resin film, 3.
...Conductor, 4...Through hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Prisoner No. 2 (2I 7 @ Honshu 1 fat layer) Imi Cme L7] No. 3 Figure 4 Sklenocho (-) ν
Claims (5)
るコイル部を設け、このコイル部を含む前記平担な面に
磁性樹脂膜を設けたことを特徴とするインダクタンス素
子。(1) An inductance element characterized in that a coil portion capable of obtaining a predetermined inductance is provided on a flat surface of a substrate, and a magnetic resin film is provided on the flat surface including the coil portion.
することを特徴とする特許請求の範囲第１項記載のイン
ダクタンス素子。(2) The inductance element according to claim 1, wherein the inductance is adjusted by changing the thickness of the magnetic resin film.
とを特徴とする特許請求の範囲第１項記載のインダクタ
ンス素子。(3) The inductance element according to claim 1, wherein the magnetic material contained in the magnetic resin is ferrite.
ことを特徴とする特許請求の範囲第１項記載のインダク
タンス素子。(4) The inductance element according to claim 1, wherein the magnetic material contained in the magnetic resin is amorphous.
ファスの混合物であることを特徴とする特許請求の範囲
第１項記載のインダクタンス素子。(5) The inductance element according to claim 1, wherein the magnetic material contained in the magnetic resin is a mixture of ferrite and amorphous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33199787A JPH01173702A (en) | 1987-12-28 | 1987-12-28 | Inductance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33199787A JPH01173702A (en) | 1987-12-28 | 1987-12-28 | Inductance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173702A true JPH01173702A (en) | 1989-07-10 |
Family
ID=18249984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33199787A Pending JPH01173702A (en) | 1987-12-28 | 1987-12-28 | Inductance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173702A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0594180A2 (en) * | 1992-10-21 | 1994-04-27 | Matsushita Electric Industrial Co., Ltd. | A mechanical sensor |
| EP0694933A1 (en) * | 1994-07-29 | 1996-01-31 | Plessey Semiconductors Limited | Trimmable inductor structure |
| WO1999016091A1 (en) * | 1997-09-19 | 1999-04-01 | Institut für Halbleiterphysik Frankfurt (Oder) GmbH | Planar inductance geometry |
| US6136458A (en) * | 1997-09-13 | 2000-10-24 | Kabushiki Kaisha Toshiba | Ferrite magnetic film structure having magnetic anisotropy |
| JP2008041833A (en) * | 2006-08-03 | 2008-02-21 | Sony Corp | Planar-inductor manufacturing method, and planar-inductor inspection method |
| US20140285304A1 (en) * | 2013-03-25 | 2014-09-25 | Samsung Electro-Mechanics Co., Ltd. | Inductor and method for manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5846417B2 (en) * | 1980-07-11 | 1983-10-17 | 東洋製罐株式会社 | Can lid feeding device |
-
1987
- 1987-12-28 JP JP33199787A patent/JPH01173702A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5846417B2 (en) * | 1980-07-11 | 1983-10-17 | 東洋製罐株式会社 | Can lid feeding device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0594180A2 (en) * | 1992-10-21 | 1994-04-27 | Matsushita Electric Industrial Co., Ltd. | A mechanical sensor |
| EP0594180A3 (en) * | 1992-10-21 | 1995-02-15 | Matsushita Electric Ind Co Ltd | A mechanical sensor. |
| US5450755A (en) * | 1992-10-21 | 1995-09-19 | Matsushita Electric Industrial Co., Ltd. | Mechanical sensor having a U-shaped planar coil and a magnetic layer |
| EP0694933A1 (en) * | 1994-07-29 | 1996-01-31 | Plessey Semiconductors Limited | Trimmable inductor structure |
| GB2292015B (en) * | 1994-07-29 | 1998-07-22 | Plessey Semiconductors Ltd | Trimmable inductor structure |
| US6005466A (en) * | 1994-07-29 | 1999-12-21 | Mitel Semiconductor Limited | Trimmable inductor structure |
| US6136458A (en) * | 1997-09-13 | 2000-10-24 | Kabushiki Kaisha Toshiba | Ferrite magnetic film structure having magnetic anisotropy |
| US6335050B1 (en) | 1997-09-13 | 2002-01-01 | Kabushiki Kaisha Toshiba | Method of manufacturing a ferrite magnetic film structure having magnetic anisotropy |
| US6611035B2 (en) | 1997-09-13 | 2003-08-26 | Kabushiki Kaisha Toshiba | Ferrite magnetic film structure having magnetic anisotropy, method of manufacturing the same, and planar magnetic device employing ferrite magnetic film structure having magenetic anisotropy |
| WO1999016091A1 (en) * | 1997-09-19 | 1999-04-01 | Institut für Halbleiterphysik Frankfurt (Oder) GmbH | Planar inductance geometry |
| JP2008041833A (en) * | 2006-08-03 | 2008-02-21 | Sony Corp | Planar-inductor manufacturing method, and planar-inductor inspection method |
| US20140285304A1 (en) * | 2013-03-25 | 2014-09-25 | Samsung Electro-Mechanics Co., Ltd. | Inductor and method for manufacturing the same |
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