JPS56122140A - Gold wire for bonding semiconductor element and semiconductor element - Google Patents

Gold wire for bonding semiconductor element and semiconductor element

Info

Publication number
JPS56122140A
JPS56122140A JP2547380A JP2547380A JPS56122140A JP S56122140 A JPS56122140 A JP S56122140A JP 2547380 A JP2547380 A JP 2547380A JP 2547380 A JP2547380 A JP 2547380A JP S56122140 A JPS56122140 A JP S56122140A
Authority
JP
Japan
Prior art keywords
semiconductor element
gold wire
bonding
gold
5ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2547380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258535B2 (cg-RX-API-DMAC10.html
Inventor
Shozo Hayashi
Susumu Tomiyama
Yasuo Fukui
Masairi Minayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP2547380A priority Critical patent/JPS56122140A/ja
Publication of JPS56122140A publication Critical patent/JPS56122140A/ja
Publication of JPS6258535B2 publication Critical patent/JPS6258535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP2547380A 1980-02-29 1980-02-29 Gold wire for bonding semiconductor element and semiconductor element Granted JPS56122140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2547380A JPS56122140A (en) 1980-02-29 1980-02-29 Gold wire for bonding semiconductor element and semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2547380A JPS56122140A (en) 1980-02-29 1980-02-29 Gold wire for bonding semiconductor element and semiconductor element

Publications (2)

Publication Number Publication Date
JPS56122140A true JPS56122140A (en) 1981-09-25
JPS6258535B2 JPS6258535B2 (cg-RX-API-DMAC10.html) 1987-12-07

Family

ID=12167001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2547380A Granted JPS56122140A (en) 1980-02-29 1980-02-29 Gold wire for bonding semiconductor element and semiconductor element

Country Status (1)

Country Link
JP (1) JPS56122140A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618945A1 (fr) * 1986-05-26 1989-02-03 Shoei Chemical Ind Co Fil de liaison destine a etre utilise dans un dispositif semi-conducteur
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
CN106298721A (zh) * 2016-08-19 2017-01-04 广东佳博电子科技有限公司 一种键合金丝及其制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2618945A1 (fr) * 1986-05-26 1989-02-03 Shoei Chemical Ind Co Fil de liaison destine a etre utilise dans un dispositif semi-conducteur
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
CN106298721A (zh) * 2016-08-19 2017-01-04 广东佳博电子科技有限公司 一种键合金丝及其制备方法

Also Published As

Publication number Publication date
JPS6258535B2 (cg-RX-API-DMAC10.html) 1987-12-07

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