JPS56120150A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS56120150A JPS56120150A JP2308180A JP2308180A JPS56120150A JP S56120150 A JPS56120150 A JP S56120150A JP 2308180 A JP2308180 A JP 2308180A JP 2308180 A JP2308180 A JP 2308180A JP S56120150 A JPS56120150 A JP S56120150A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- convex
- base
- glass
- tube body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Joining Of Glass To Other Materials (AREA)
- Glass Melting And Manufacturing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55023081A JPS6050340B2 (ja) | 1980-02-26 | 1980-02-26 | 半導体素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55023081A JPS6050340B2 (ja) | 1980-02-26 | 1980-02-26 | 半導体素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56120150A true JPS56120150A (en) | 1981-09-21 |
| JPS6050340B2 JPS6050340B2 (ja) | 1985-11-08 |
Family
ID=12100460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55023081A Expired JPS6050340B2 (ja) | 1980-02-26 | 1980-02-26 | 半導体素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050340B2 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010760A (ja) * | 1983-06-30 | 1985-01-19 | Sumitomo Electric Ind Ltd | ダイオ−ド電極部品 |
| JPS61125160A (ja) * | 1984-11-22 | 1986-06-12 | Toshiba Corp | リ−ドレス形ガラス封止ダイオ−ド |
| JPS62128646U (ja) * | 1986-02-06 | 1987-08-14 |
-
1980
- 1980-02-26 JP JP55023081A patent/JPS6050340B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010760A (ja) * | 1983-06-30 | 1985-01-19 | Sumitomo Electric Ind Ltd | ダイオ−ド電極部品 |
| JPS6347341B2 (ja) * | 1983-06-30 | 1988-09-21 | Sumitomo Electric Industries | |
| JPS61125160A (ja) * | 1984-11-22 | 1986-06-12 | Toshiba Corp | リ−ドレス形ガラス封止ダイオ−ド |
| JPS62128646U (ja) * | 1986-02-06 | 1987-08-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6050340B2 (ja) | 1985-11-08 |
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