JPS56118395A - Method of forming multilayer wire - Google Patents
Method of forming multilayer wireInfo
- Publication number
- JPS56118395A JPS56118395A JP2182380A JP2182380A JPS56118395A JP S56118395 A JPS56118395 A JP S56118395A JP 2182380 A JP2182380 A JP 2182380A JP 2182380 A JP2182380 A JP 2182380A JP S56118395 A JPS56118395 A JP S56118395A
- Authority
- JP
- Japan
- Prior art keywords
- forming multilayer
- multilayer wire
- wire
- forming
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2182380A JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2182380A JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56118395A true JPS56118395A (en) | 1981-09-17 |
| JPS646030B2 JPS646030B2 (enrdf_load_stackoverflow) | 1989-02-01 |
Family
ID=12065776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2182380A Granted JPS56118395A (en) | 1980-02-23 | 1980-02-23 | Method of forming multilayer wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56118395A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194397A (ja) * | 1982-05-10 | 1983-11-12 | 日本電気株式会社 | 銅厚膜ペ−ストによる多層配線基板の製造方法 |
| JPS6010697A (ja) * | 1983-06-29 | 1985-01-19 | 三洋電機株式会社 | 多層配線基板の製造方法 |
| JPS60167497A (ja) * | 1984-02-10 | 1985-08-30 | 松下電器産業株式会社 | 多層回路基板の製造方法 |
| JPS617697A (ja) * | 1984-06-22 | 1986-01-14 | 富士通株式会社 | 多層配線基板及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4963962A (enrdf_load_stackoverflow) * | 1972-10-27 | 1974-06-20 | ||
| JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
| JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
-
1980
- 1980-02-23 JP JP2182380A patent/JPS56118395A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4963962A (enrdf_load_stackoverflow) * | 1972-10-27 | 1974-06-20 | ||
| JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
| JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194397A (ja) * | 1982-05-10 | 1983-11-12 | 日本電気株式会社 | 銅厚膜ペ−ストによる多層配線基板の製造方法 |
| JPS6010697A (ja) * | 1983-06-29 | 1985-01-19 | 三洋電機株式会社 | 多層配線基板の製造方法 |
| JPS60167497A (ja) * | 1984-02-10 | 1985-08-30 | 松下電器産業株式会社 | 多層回路基板の製造方法 |
| JPS617697A (ja) * | 1984-06-22 | 1986-01-14 | 富士通株式会社 | 多層配線基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS646030B2 (enrdf_load_stackoverflow) | 1989-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5730348A (en) | Method of forming mutual connection wire | |
| JPS5771190A (en) | Method of fabricating cadmium-mercury- tellurium | |
| JPS5745925A (en) | Method of forming conductor | |
| JPS57102036A (en) | Method of forming wire bond | |
| JPS5633899A (en) | Method of forming multilayer wire | |
| EP0107363A3 (en) | Method of producing anisotropically-conducting layers | |
| DE3160829D1 (en) | Method of making clayware | |
| JPS56111296A (en) | Method of forming multilayer wire | |
| JPS56118395A (en) | Method of forming multilayer wire | |
| JPS5723298A (en) | Method of producing printed wire | |
| JPS5734614A (en) | Method of producing taped wire | |
| JPS5618499A (en) | Method of bonding multilayer wires | |
| JPS56158498A (en) | Method of forming via-hole | |
| JPS56169390A (en) | Method of connecting wire | |
| JPS5734605A (en) | Method of producing conductor | |
| JPS5755721A (en) | Method of forming time limiting property | |
| JPS5730215A (en) | Method of producing insulated wire | |
| JPS5761214A (en) | Method of producing insulated wire | |
| JPS56112019A (en) | Method of manufacturing enameled wire | |
| JPS5778784A (en) | Method of producing micropin | |
| JPS5778785A (en) | Method of producing micropin | |
| JPS5732513A (en) | Method of producing taped wire | |
| JPS56140691A (en) | Method of forming wire | |
| JPS56132719A (en) | Method of producing multilayer contact | |
| JPS56165215A (en) | Method of producing corona preventing wire |