JPS56116872A - Evaporation apparatus - Google Patents
Evaporation apparatusInfo
- Publication number
- JPS56116872A JPS56116872A JP1757680A JP1757680A JPS56116872A JP S56116872 A JPS56116872 A JP S56116872A JP 1757680 A JP1757680 A JP 1757680A JP 1757680 A JP1757680 A JP 1757680A JP S56116872 A JPS56116872 A JP S56116872A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- semiconductor wafers
- collided
- dish
- rotated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To form a uniform evaporated film, in evaporation of a wiring metal material such as Al or the like to a surface of a semiconductor substrate in a vacuum bell jar, by limiting an injecting angle of evaporating metal particles against the surface of said substrate to a specific value or below. CONSTITUTION:A metal evaporation source 12 such as Al or the like is placed in the vacuum bell jar 10 and Al particles 8a-8f are collided to semiconductor wafers 20a-20f by irradiating electron beam to deposit Al as the wiring metal material. In this case, the semiconductor wafers 20a-20f are attached to a dish 18 rotating to a B direction by a rotary shaft 18a and said dish 18 itself is attached to a cone shaped holder 16 revolving to an A direcdion by a motor 14. Therefore, the semiconductor wafers are rotated to upward and downward directions as well as also rotated to the A direction. The Al particles 8a-8f are collided to said wafers but a shield body 22 is placed to an upper part so as to adjust an angle theta formed by the direction of said Al particles and wafer surfaces to 45 deg. or below to prevent the generation of abnormal evaporated parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1757680A JPS56116872A (en) | 1980-02-15 | 1980-02-15 | Evaporation apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1757680A JPS56116872A (en) | 1980-02-15 | 1980-02-15 | Evaporation apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56116872A true JPS56116872A (en) | 1981-09-12 |
Family
ID=11947730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1757680A Pending JPS56116872A (en) | 1980-02-15 | 1980-02-15 | Evaporation apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56116872A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365071A (en) * | 1986-09-05 | 1988-03-23 | Nec Corp | Sputtering device |
-
1980
- 1980-02-15 JP JP1757680A patent/JPS56116872A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365071A (en) * | 1986-09-05 | 1988-03-23 | Nec Corp | Sputtering device |
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