JPS56112923A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS56112923A JPS56112923A JP1574680A JP1574680A JPS56112923A JP S56112923 A JPS56112923 A JP S56112923A JP 1574680 A JP1574680 A JP 1574680A JP 1574680 A JP1574680 A JP 1574680A JP S56112923 A JPS56112923 A JP S56112923A
- Authority
- JP
- Japan
- Prior art keywords
- acid ester
- polyfunctional
- anhydride
- cyanic acid
- curing agents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1574680A JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1574680A JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56112923A true JPS56112923A (en) | 1981-09-05 |
JPS6248683B2 JPS6248683B2 (pt) | 1987-10-15 |
Family
ID=11897322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1574680A Granted JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56112923A (pt) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000336245A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
JP2000336246A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
JP2002317085A (ja) * | 2001-01-30 | 2002-10-31 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその使用 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01134385U (pt) * | 1988-03-08 | 1989-09-13 | ||
JPH08106966A (ja) * | 1994-10-05 | 1996-04-23 | Daiichi Denso Buhin Kk | 接続具の取付け構成体 |
EP3168263B1 (en) * | 2015-02-03 | 2019-06-12 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board |
-
1980
- 1980-02-12 JP JP1574680A patent/JPS56112923A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000336245A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
JP2000336246A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
JP2002317085A (ja) * | 2001-01-30 | 2002-10-31 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその使用 |
Also Published As
Publication number | Publication date |
---|---|
JPS6248683B2 (pt) | 1987-10-15 |
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