JPS5610969A - Semiconductor controlled rectifier - Google Patents
Semiconductor controlled rectifierInfo
- Publication number
- JPS5610969A JPS5610969A JP8627579A JP8627579A JPS5610969A JP S5610969 A JPS5610969 A JP S5610969A JP 8627579 A JP8627579 A JP 8627579A JP 8627579 A JP8627579 A JP 8627579A JP S5610969 A JPS5610969 A JP S5610969A
- Authority
- JP
- Japan
- Prior art keywords
- ring
- insulating
- controlled rectifier
- gate spring
- semiconductor controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To enhance the reliability of the semiconductor controlled rectifier by arranging an Mo ring positioned through an insulating guide ring within an insulating cylinder, inserting an insulating ring within the inner peripheral portion of the ring and engaging a gate spring with the hole of the insulating ring to make the gate spring with an electrode. CONSTITUTION:An insulating ring 18 is urged by a copper block 13 positioned by an Mo ring 15 within an insulating cylinder 8. A gate spring 16 is inserted at the end into the hole 18a of the ring 18 to be retained therewith to make contact with a metallized layer as the third electrode. The gate spring 16 is set directly above the metallized layer according to this configuration, and is not accordingly disengaged due to the external vibration and impact so as to improve the reliability of the semiconductor controlled rectifier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8627579A JPS5610969A (en) | 1979-07-06 | 1979-07-06 | Semiconductor controlled rectifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8627579A JPS5610969A (en) | 1979-07-06 | 1979-07-06 | Semiconductor controlled rectifier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5610969A true JPS5610969A (en) | 1981-02-03 |
Family
ID=13882267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8627579A Pending JPS5610969A (en) | 1979-07-06 | 1979-07-06 | Semiconductor controlled rectifier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5610969A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219962A (en) * | 1983-05-27 | 1984-12-11 | Fuji Electric Corp Res & Dev Ltd | Semiconductor device |
EP0921565A3 (en) * | 1997-12-08 | 2005-07-27 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
-
1979
- 1979-07-06 JP JP8627579A patent/JPS5610969A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219962A (en) * | 1983-05-27 | 1984-12-11 | Fuji Electric Corp Res & Dev Ltd | Semiconductor device |
EP0921565A3 (en) * | 1997-12-08 | 2005-07-27 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
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