JPS56108272A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56108272A
JPS56108272A JP1075480A JP1075480A JPS56108272A JP S56108272 A JPS56108272 A JP S56108272A JP 1075480 A JP1075480 A JP 1075480A JP 1075480 A JP1075480 A JP 1075480A JP S56108272 A JPS56108272 A JP S56108272A
Authority
JP
Japan
Prior art keywords
layer
source
type
gate
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1075480A
Other languages
Japanese (ja)
Inventor
Eiji Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tohoku Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Metal Industries Ltd filed Critical Tohoku Metal Industries Ltd
Priority to JP1075480A priority Critical patent/JPS56108272A/en
Publication of JPS56108272A publication Critical patent/JPS56108272A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1066Gate region of field-effect devices with PN junction gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To decrease the junction capacitance between the source and the gate in a semiconductor device in which a gate layers of semiconductor with the first conductivity type are buried between the drain and source layers of semiconductor with the second conductivity type, by removing the portions unnecessary for operation from the junction portions between the source and gate layers. CONSTITUTION:On an N<+> type Si substrate 1', an N<-> type epitaxial layer 2' to be a drain layer is grown, and in the surface layer thereof a plurality of P<+> type gate layers 3 are formed at given intervals by diffusion. Then, an N type epitaxial source layer 4' is grown on the whole surface including them and all coated with an N<+> type source ohmic contact layer 5'. Then, of the P-N junctions on the layer 3', the layer 5' and 4' not participating in operation are removed by plasma etching having directivity so that only P-N junction portions A' between the remaining layers 3' and 4' are allowed to participate in the capacity value. Thereby, the junction capacitance between the source and the gate is decreased so that a high power and high speed device can be obtained.
JP1075480A 1980-01-31 1980-01-31 Semiconductor device Pending JPS56108272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1075480A JPS56108272A (en) 1980-01-31 1980-01-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1075480A JPS56108272A (en) 1980-01-31 1980-01-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56108272A true JPS56108272A (en) 1981-08-27

Family

ID=11759099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1075480A Pending JPS56108272A (en) 1980-01-31 1980-01-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56108272A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5343483A (en) * 1976-10-01 1978-04-19 Handotai Kenkyu Shinkokai Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5343483A (en) * 1976-10-01 1978-04-19 Handotai Kenkyu Shinkokai Semiconductor device

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