JPS56105655A - Soldering method of lead wire - Google Patents

Soldering method of lead wire

Info

Publication number
JPS56105655A
JPS56105655A JP792380A JP792380A JPS56105655A JP S56105655 A JPS56105655 A JP S56105655A JP 792380 A JP792380 A JP 792380A JP 792380 A JP792380 A JP 792380A JP S56105655 A JPS56105655 A JP S56105655A
Authority
JP
Japan
Prior art keywords
lead wire
jig
layer
cleeping
nonelectrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP792380A
Other languages
Japanese (ja)
Other versions
JPS6258153B2 (en
Inventor
Masao Nishiyama
Masatoshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP792380A priority Critical patent/JPS56105655A/en
Publication of JPS56105655A publication Critical patent/JPS56105655A/en
Publication of JPS6258153B2 publication Critical patent/JPS6258153B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4875—Connection or disconnection of other leads to or from bases or plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To prevent a fused Ni from cleeping up on soldering by attaching in advance a prescribed metal to a part except an Ni-plated part of the lead wire. CONSTITUTION:The lead wire 8' is provided with a plated layer 21 of Cu or the like to be applied a heading. The layer 21' is removed by resolving a part 21'' to form a nonelectrolytic Ni-layer 17. The formed lead wire 8 is inserted in a hole 18 of a jig 16 and arranged on a metallic outer ring 1 of a transistor. A heat treatment is applied at 1,000 deg.C in the neutral air to cause the lead wire to be glass-sealed, the nonelectrolytic Ni17 to be fused at the same time, and the lead wire 8 and the metallic outer ring 1 to be fixed. At this time, due to the presence of the Cu film 21, the Ni flows downward without being capable of climbing up and adheres no longer to the hole 18 of the jig 16. In addition, the Ni is collected at the top end of the lead wire to increase the adhesive strength. Further, the jig can be made small for the absence of the cleeping-up of Ni.
JP792380A 1980-01-25 1980-01-25 Soldering method of lead wire Granted JPS56105655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Publications (2)

Publication Number Publication Date
JPS56105655A true JPS56105655A (en) 1981-08-22
JPS6258153B2 JPS6258153B2 (en) 1987-12-04

Family

ID=11679041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP792380A Granted JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Country Status (1)

Country Link
JP (1) JPS56105655A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (en) * 1985-12-19 1987-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (en) * 1985-12-19 1987-07-01

Also Published As

Publication number Publication date
JPS6258153B2 (en) 1987-12-04

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