JPS5724550A - Manufacture of airtight terminal - Google Patents

Manufacture of airtight terminal

Info

Publication number
JPS5724550A
JPS5724550A JP9912380A JP9912380A JPS5724550A JP S5724550 A JPS5724550 A JP S5724550A JP 9912380 A JP9912380 A JP 9912380A JP 9912380 A JP9912380 A JP 9912380A JP S5724550 A JPS5724550 A JP S5724550A
Authority
JP
Japan
Prior art keywords
heat
nickel
sink
plating
cupper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9912380A
Other languages
Japanese (ja)
Other versions
JPS6041866B2 (en
Inventor
Koichi Komoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP9912380A priority Critical patent/JPS6041866B2/en
Publication of JPS5724550A publication Critical patent/JPS5724550A/en
Publication of JPS6041866B2 publication Critical patent/JPS6041866B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To manufacture easily and at lowcost stems by nickel-electroplating and then heat-treating the whole surface of a tentatively assembled object after chemically nickel-plating at least either the iron or cupper parts scheduled for brazing. CONSTITUTION:At least one of an iron flange 1 or cupper heat-sinle 5 which is scheduled for brazing e.g., the side face of the heat sink 5 is chemically nickel- plated. In this case, 5-15mu thick chemical nickel plating 10 is put on the side of the heat- sink 5. Then, fit the heat-sink 5 is fitted into a heat-sink fixing hole 2 of the flange 1, and a tentatively assembled component 11 is made by calking mechanically. Then, it is electroplated by nickel on the whole surface by 2-8mu thick. Subsequently a glass tablet 7a in inserted into a lead line plugging hole 3, and a nickel-electroplated lead line 6 is passed through it. Lastly, it is heated in a neutral or weakly reductive atmosphere at about 1,000 deg.C, and the glass tablet 7a and the chemical nickel plating 10 fuse together to become a unitary body.
JP9912380A 1980-07-18 1980-07-18 Manufacturing method for airtight terminals Expired JPS6041866B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9912380A JPS6041866B2 (en) 1980-07-18 1980-07-18 Manufacturing method for airtight terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9912380A JPS6041866B2 (en) 1980-07-18 1980-07-18 Manufacturing method for airtight terminals

Publications (2)

Publication Number Publication Date
JPS5724550A true JPS5724550A (en) 1982-02-09
JPS6041866B2 JPS6041866B2 (en) 1985-09-19

Family

ID=14238984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9912380A Expired JPS6041866B2 (en) 1980-07-18 1980-07-18 Manufacturing method for airtight terminals

Country Status (1)

Country Link
JP (1) JPS6041866B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61250984A (en) * 1985-04-30 1986-11-08 株式会社山武 Manufacture of airtight terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61250984A (en) * 1985-04-30 1986-11-08 株式会社山武 Manufacture of airtight terminal
JPH0379836B2 (en) * 1985-04-30 1991-12-20 Yamatake Honeywell Co Ltd

Also Published As

Publication number Publication date
JPS6041866B2 (en) 1985-09-19

Similar Documents

Publication Publication Date Title
JPS5724550A (en) Manufacture of airtight terminal
JPS57132334A (en) Soldering method
US4408900A (en) Joint structure of bezel and watch body
JPS5724551A (en) Manufacture of airtight terminal
DK445184D0 (en) ELECTRONIC APPLIANCE, ELECTRONIC COMPONENT AND PROCEDURE FOR THE MANUFACTURING OF SUCH APPLIANCE AND SUCH COMPONENT
EP0048403A3 (en) Process for joining metallic sectional parts by soldering
JPS53149384A (en) Production of stress detector
JPS56168958A (en) Manufacture of heat exchanger made of aluminum
IT8125429A0 (en) INTEGRATED CIRCUIT DEVICE INTERCONNECTION METAL NETWORK AND MANUFACTURING PROCEDURE OF THIS DEVICE.
JPS567456A (en) Manufacture of airtight sealing body
JPS53138531A (en) Preparation of cartridge heater
JPS555173A (en) Brazing method by nickel-phosphorus alloy
JPS57211762A (en) Lead frame for semiconductor
JPS56105655A (en) Soldering method of lead wire
JPS5766604A (en) Surface treatment for rare-earth cobalt magnet
KR800001155Y1 (en) Stem for semiconductor device
IT1195541B (en) METHOD OF MANUFACTURE OF RECTIFIER ELEMENTS
GB2015405A (en) Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate
JPS57122547A (en) Stem and manufacture thereof
JPS55140252A (en) Header
JPS577951A (en) Manufacture of stem for semiconductor device needing no whole surface finishing nickel plating process
JPS56129349A (en) Method of manufacturing airtight terminal
JPS56103380A (en) Production of timepiece parts
JPS52110063A (en) Securing an arbor pipe to a watch case
JPS57197843A (en) Lead pin for integrated circuit device