JPS62103258U - - Google Patents
Info
- Publication number
- JPS62103258U JPS62103258U JP19531385U JP19531385U JPS62103258U JP S62103258 U JPS62103258 U JP S62103258U JP 19531385 U JP19531385 U JP 19531385U JP 19531385 U JP19531385 U JP 19531385U JP S62103258 U JPS62103258 U JP S62103258U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- metal
- metal stem
- plate
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 241000587161 Gomphocarpus Species 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
Description
第１図は本考案による金属ステムの一実施例の
正面図、第２図は第１図のＡ―Ａ断面図、第３図
は本考案による金属ステムの一実施例のプリント
板搭載の側断面図、第４図は従来の金属ステムの
側断面図、第５図は従来の金属ステムのプリント
板搭載の側断面図である。
主要部分の符号の説明、１……ガラス端子、２
……ネイルヘツドリード（頂部形状が釘状のリー
ド線）、３……ベース板、４……釘状頂部、５…
…プリント板、１０……リード線。
FIG. 1 is a front view of an embodiment of the metal stem according to the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 4 is a side sectional view of a conventional metal stem, and FIG. 5 is a side sectional view of a conventional metal stem mounted on a printed board. Explanation of symbols of main parts, 1...Glass terminal, 2
... Nail head lead (lead wire with a nail-shaped top), 3... Base plate, 4... Nail-shaped top, 5...
...Printed board, 10...Lead wire.
Claims (1)
けられたガラス端子とを有する金属ステムであつ
て、前記ベース板に所定厚さの板状頭部を有する
リード線が取付けられていることを特徴とする金
属ステム。 A metal stem having a metal base plate and a glass terminal attached perpendicularly to the base plate, characterized in that a lead wire having a plate-shaped head having a predetermined thickness is attached to the base plate. metal stem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19531385U JPS62103258U (en) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19531385U JPS62103258U (en) | 1985-12-19 | 1985-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62103258U true JPS62103258U (en) | 1987-07-01 |
Family
ID=31153088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19531385U Pending JPS62103258U (en) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103258U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105655A (en) * | 1980-01-25 | 1981-08-22 | Nec Home Electronics Ltd | Soldering method of lead wire |
-
1985
- 1985-12-19 JP JP19531385U patent/JPS62103258U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105655A (en) * | 1980-01-25 | 1981-08-22 | Nec Home Electronics Ltd | Soldering method of lead wire |
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