JPS6258153B2 - - Google Patents
Info
- Publication number
- JPS6258153B2 JPS6258153B2 JP792380A JP792380A JPS6258153B2 JP S6258153 B2 JPS6258153 B2 JP S6258153B2 JP 792380 A JP792380 A JP 792380A JP 792380 A JP792380 A JP 792380A JP S6258153 B2 JPS6258153 B2 JP S6258153B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- plating layer
- outer ring
- lead
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 78
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 238000007747 plating Methods 0.000 claims description 46
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 39
- 239000011521 glass Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000587161 Gomphocarpus Species 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4875—Connection or disconnection of other leads to or from bases or plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
本発明はリード線のロウ付け方法に関し、特に
半導体装置などに用いられる気密端子の製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for brazing lead wires, and more particularly to a method for manufacturing airtight terminals used in semiconductor devices and the like.
一般に、例えばソリツドタイプトランジスタに
用いられる気密端子は第１図及び第２図に示すよ
うな構造を有する。つまり、鉄、Fe―Ni―Co合
金等の金属外環１に２つのリード封着孔２，３を
貫通させて設け、この各リード封着孔２，３にエ
ミツタ用とベース用のリード線４，５を挿通して
夫々ガラス６，７で封着固定すると共に、金属外
環１の下面の一部にコレクタ用のリード線８の端
面を固着している。そして、金属外環１の上面に
ペレツト９をマウントしてから、このペレツト９
のエミツタ電極とベース電極を夫々に各リード線
４，５の頂面に金属細線１０，１１で接続し、ペ
レツト９のコレクタ電極はリード線８で取出して
いる。尚、各リード線４，５，８はFe―Ni合金
やFe―Ni―Co合金が使用され、ガラス６，７は
ソーダライムガラス、ソーダバリウムガラスやホ
ウケイ酸ガラスが使用されるのが通常である。
又、端面接続されるリード線８は金属外環１との
固着強度を十分ならしめるため、固着側端部を釘
頭状に拡げて、金属外環１との固着面積を大きく
している。 In general, hermetic terminals used, for example, in solid type transistors have a structure as shown in FIGS. 1 and 2. In other words, two lead sealing holes 2 and 3 are provided through a metal outer ring 1 made of iron, Fe-Ni-Co alloy, etc., and the emitter and base lead wires are inserted into each lead sealing hole 2 and 3. 4 and 5 are inserted and sealed and fixed with glasses 6 and 7, respectively, and the end face of a collector lead wire 8 is fixed to a part of the lower surface of the metal outer ring 1. Then, after mounting the pellet 9 on the upper surface of the metal outer ring 1,
The emitter electrode and base electrode of the pellet 9 are connected to the top surfaces of the lead wires 4 and 5 by thin metal wires 10 and 11, respectively, and the collector electrode of the pellet 9 is taken out by the lead wire 8. Note that lead wires 4, 5, and 8 are usually made of Fe-Ni alloy or Fe-Ni-Co alloy, and glasses 6 and 7 are usually made of soda lime glass, soda barium glass, or borosilicate glass. be.
Furthermore, in order to ensure that the lead wire 8 connected at the end face has sufficient strength of adhesion to the metal outer ring 1, the adhesion side end portion is widened into a nail head shape to increase the area of adhesion to the metal outer ring 1.
ところで、上記タイプの気密端子の製造である
が、これは従来では次の各工程で行つていた。ま
ず第３図に示すように、グラフアイト治具１２上
に金属外環１を位置決め載置しておいて、この金
属外環１の各リード封着孔２，３に筒状のガラス
タブレツト６′，７′を嵌め、更に各ガラスタブレ
ツト６′，７′からグラフアイト治具１２のリード
孔１３，１４に各リード線４，５を挿通して、リ
ード孔１３，１４で各リード線４，５を位置規制
しておく。而して、全体を中性、或は弱還元性雰
囲気内で約1000℃に加熱し、ガラスタブレツト
６′，７′を溶融させて、各リード線４，５を各リ
ード封着孔２，３にガラス封着する。次に、この
金属外環１をグラフアイト治具１２から取出し、
その下面に第４図に示すように残りのリード線８
の１端面をロウ付、或は溶接して固着していた。
つまり、従来はリード線４，５のガラス封着工程
と、リード線８の端面固着工程の２工程を必要と
し、作業性が悪かつた。 By the way, manufacturing of the above-mentioned type of airtight terminal has conventionally been carried out through the following steps. First, as shown in FIG. 3, the metal outer ring 1 is positioned and placed on the graphite jig 12, and a cylindrical glass tablet is inserted into each lead sealing hole 2, 3 of the metal outer ring 1. 6' and 7', and then insert the lead wires 4 and 5 from each glass tablet 6' and 7' into the lead holes 13 and 14 of the graphite jig 12. The positions of wires 4 and 5 are regulated. Then, the whole is heated to about 1000°C in a neutral or slightly reducing atmosphere to melt the glass tablets 6' and 7', and each lead wire 4 and 5 is inserted into each lead sealing hole 2. , 3 is sealed with glass. Next, this metal outer ring 1 is taken out from the graphite jig 12,
The remaining lead wire 8 is attached to the bottom surface as shown in FIG.
It was fixed by brazing or welding one end face of it.
In other words, the conventional method requires two steps: a glass sealing step for the lead wires 4 and 5, and a step for fixing the end face of the lead wire 8, resulting in poor workability.
そこで、上記方法を改良したものとして、リー
ド線４，５のガラス封着と同時にリード線８の固
着を行い、気密端子の製造を１工程で行う次の製
造方法が知られている。これは本発明の先行技術
で、例えば第５図に示すように、グラフアイトか
らなる下型治具１５と上型治具１６を使用し、更
に金属外環１に端面固着するリード線８の固着側
先端部の全表面に無電解ニツケルメツキ層１７を
予め被着形成して、次のように行なう方法であ
る。即ち、下型治具１５と上型治具１６で金属外
環１とガラスタブレツト６′，７′及びリード線
４，５を上下逆にして所定の配置で支持しておく
と共に、リード線８を金属外環１の裏面の一部に
無電解ニツケルメツキ層１７のある端面を当接さ
せて、上型治具１６で支持しておく。このリード
線８の支持は無電解ニツケルメツキ層１７から上
の部分を上型治具１６に穿設したリード挿入孔１
８に挿通して行ない、リード線８の無電解ニツケ
ルメツキ層１７のある先端部は上型治具１６の空
間部１９内にフリーに位置させる。尚、金属外環
１の表面には予め銅メツキ層２０を被着形成し
て、後の高温加熱時にグラフアイトの治具１５，
１６からの浸炭現象を防止し、後述の仕上メツキ
を可能ならしめている。次に、第５図のように各
部品の位置決めが完了すると、全体を中性、或は
弱還元性の雰囲気内で約1000℃に加熱する。する
と、ガラスタブレツト６′，７′が溶融して各リー
ド線４，５を金属外環１にガラス封着すると同時
に、リード線８の無電解ニツケルメツキ層１７も
溶けて、第６図に示すように端面部分が金属外環
１の裏面に接着固定される。後は各治具１５，１
６を外し、金属外環１表面の銅メツキ層２０を除
去してから、全体をニツケルメツキして仕上げ、
更に高信頼性を得る場合は金メツキして最終的な
仕上げをしている。 Therefore, as an improvement on the above method, the following manufacturing method is known in which the lead wires 8 are fixed at the same time as the glass sealing of the lead wires 4 and 5, and the airtight terminal is manufactured in one step. This is a prior art of the present invention, which uses a lower mold jig 15 and an upper mold jig 16 made of graphite, and furthermore, as shown in FIG. This is a method in which an electroless nickel plating layer 17 is previously deposited on the entire surface of the tip on the fixed side, and the process is carried out as follows. That is, the metal outer ring 1, the glass tablets 6', 7', and the lead wires 4, 5 are supported in a predetermined position upside down by the lower mold jig 15 and the upper mold jig 16, and the lead wires are 8 is supported by an upper die jig 16 with the end surface having the electroless nickel plating layer 17 in contact with a part of the back surface of the metal outer ring 1. The lead wire 8 is supported by a lead insertion hole 1 formed in the upper die jig 16 above the electroless nickel plating layer 17.
8 , and the tip of the lead wire 8 having the electroless nickel plating layer 17 is freely positioned within the space 19 of the upper mold jig 16 . A copper plating layer 20 is formed on the surface of the metal outer ring 1 in advance, and a graphite jig 15,
This prevents the carburization phenomenon from 16 and enables the finish plating described later. Next, when the positioning of each part is completed as shown in FIG. 5, the whole is heated to about 1000° C. in a neutral or weakly reducing atmosphere. Then, the glass tablets 6' and 7' are melted and the lead wires 4 and 5 are glass-sealed to the metal outer ring 1, and at the same time, the electroless nickel plating layer 17 of the lead wire 8 is also melted, as shown in FIG. The end face portion is adhesively fixed to the back surface of the metal outer ring 1 as shown in FIG. After that, each jig 15,1
6 is removed, the copper plating layer 20 on the surface of the metal outer ring 1 is removed, and the whole is finished with nickel plating.
For even higher reliability, the final finish is gold plating.
ところで、上記リード線８の無電解ニツケルメ
ツキ層１７を加熱溶融させると、その溶融ニツケ
ルの大部分はリード線８に沿つて自重で少し垂れ
下るが、一部の溶融ニツケルはリード線８に沿つ
て這い上り、上型治具１６のリード挿入孔１８の
下端部に喰い込む不良が発生することがあつた。
この溶融ニツケルの上型治具１６への接着を防止
する工夫として、例えばリード線８の無電解ニツ
ケルメツキ層１７の長さをh1とし、上型治具１６
の空間部１９の高さh2、上型治具１６自体の高さ
をh3として、h2≫h1とすることが考えられる。つ
まり、無電解ニツケルメツキ層１７からリード挿
入孔１８までの距離（h2−h1）を大きく設けて、
溶融ニツケルが多少這い上つてもリード挿入孔１
８まで届かないようにする。しかし、このように
するとh2が大きくなつてリード挿入孔１８の長さ
（h3−h2）が短くなり、リード線８の垂直支持が不
安定となつてリード線８が傾く恐れが生じる。
又、h3を大きくして（h3−h2）の長さをリード線
８の支持に十分な大きさにすることも考えられる
が、h3が大きくなると上型治具１６が大型化して
材料費が高くなり、コスト的に不利である。 By the way, when the electroless nickel plating layer 17 of the lead wire 8 is heated and melted, most of the molten nickel hangs down a little along the lead wire 8 due to its own weight, but some of the molten nickel hangs down along the lead wire 8. There have been cases where the lead has climbed up and bit into the lower end of the lead insertion hole 18 of the upper die jig 16, causing a defect.
As a measure to prevent this molten nickel from adhering to the upper mold jig 16, for example, the length of the electroless nickel plating layer 17 of the lead wire 8 is set to h1 , and the upper mold jig 16
It is conceivable that h 2 is the height of the space 19 and h 3 is the height of the upper die jig 16 itself, and that h 2 ≫ h 1 . In other words, by providing a large distance (h 2 - h 1 ) from the electroless nickel plating layer 17 to the lead insertion hole 18,
Even if some molten nickel creeps up, the lead insertion hole 1
Make sure it doesn't reach 8. However, if this is done, h 2 becomes larger and the length (h 3 - h 2 ) of the lead insertion hole 18 becomes shorter, which may make the vertical support of the lead wire 8 unstable and cause the lead wire 8 to tilt. .
It is also possible to increase h 3 so that the length (h 3 − h 2 ) is large enough to support the lead wire 8, but if h 3 increases, the upper die jig 16 will become larger. This increases the material cost and is disadvantageous in terms of cost.
本発明は上記溶融ニツケルの這い上りによる問
題点に鑑み、これを解決したもので、リード線の
無電解ニツケルメツキ層形成部分を除く部分に溶
融ニツケルの這い上りを防止する金属メツキ層を
被着形成して製造する方法を提案する。例えば、
上記したトランジスタの製造に適用した場合、本
発明は第７図に示すように、リード線８に無電解
ニツケルメツキ層１７を形成すると共に、残りの
リード線素地上に前記の金属メツキ層２１を被着
形成する。この金属メツキ層２１は溶融ニツケル
が流れにくい金属であればよく、例えば銅メツキ
で形成する。又、各メツキ層１７，２１の形成は
第８図に示す要領で行なえばよい。即ち、ストレ
ートなリード線８′の全面に金属メツキ層２１′を
形成してから、リード線８′の１端を釘状に変形
させる（ヘツデイング）。次に無電解ニツケルメ
ツキ層形成部分の金属メツキ層２１″を溶解液で
除去してから、この除去されたリード線先端部の
素地上に無電解ニツケルメツキ層１７を形成す
る。尚、ストレートなリード線８′をヘツデイン
グしてから全面に金属メツキ層２１′を形成して
いくようにしてもよい。 The present invention has been developed in view of the problem caused by the creeping up of molten nickel, and has solved this problem by depositing a metal plating layer on the lead wire excluding the part where the electroless nickel plating layer is formed to prevent molten nickel from creeping up. We propose a manufacturing method using for example,
When applied to the manufacture of the above transistor, the present invention forms an electroless nickel plating layer 17 on the lead wire 8 and covers the remaining lead wire base with the metal plating layer 21, as shown in FIG. Form a deposit. This metal plating layer 21 may be any metal that does not allow molten nickel to flow easily, and may be formed of copper plating, for example. Further, each plating layer 17, 21 may be formed in the manner shown in FIG. That is, after forming a metal plating layer 21' on the entire surface of a straight lead wire 8', one end of the lead wire 8' is deformed into a nail shape (heading). Next, the metal plating layer 21'' in the area where the electroless nickel plating layer is to be formed is removed using a solution, and then the electroless nickel plating layer 17 is formed on the base of the removed lead wire tip. Alternatively, the metal plating layer 21' may be formed on the entire surface after hedding 8'.
このように金属メツキ層２１を追加形成したリ
ード線８は第９図に示すように、第５図の場合と
同様に上型治具１６のリード挿入孔１８で支持し
て金属外環１上に配置する。そして、第９図の状
態で全体を中性、或は弱還元性の雰囲気内で約
1000℃に加熱して、他のリード線４，５のガラス
封着と同時にリード線８の無電解ニツケルメツキ
層１７を溶融して、リード線８を金属外環１に接
着固定する。この時、無電為ニツケルメツキ層１
７の上端に銅等の金属メツキ層２１があるため、
溶融ニツケルが這い上ろうとしても金属メツキ層
２１で阻止され、ために溶融ニツケルはリード線
８に沿つて下方にのみ流れる（第１０図参照）。
従つて溶融ニツケルが上型治具１６のリード挿入
孔１８に接着する恐れがなくなる。而も、溶融ニ
ツケルは全て下方へ流れるため、リード線８の先
端部分に溶融ニツケルが多く集まり、金属外環１
との接着強度が増大する。又、金属外環１上には
銅メツキ層２０が予め形成されているため、この
銅メツキ層２０によつて溶融ニツケルの拡散が押
えられるから、リード線８と金属外環１との接着
強度は更に増大する。 As shown in FIG. 9, the lead wire 8 on which the metal plating layer 21 has been additionally formed is supported by the lead insertion hole 18 of the upper die jig 16 and placed on the metal outer ring 1, as in the case of FIG. Place it in Then, in the state shown in Figure 9, the entire body is placed in a neutral or weakly reducing atmosphere.
The lead wire 8 is heated to 1000 DEG C., the electroless nickel plating layer 17 of the lead wire 8 is melted at the same time as the other lead wires 4 and 5 are sealed with glass, and the lead wire 8 is adhesively fixed to the metal outer ring 1. At this time, the electroless nickel plating layer 1
Since there is a metal plating layer 21 such as copper on the upper end of 7,
Even if the molten nickel tries to climb up, it is blocked by the metal plating layer 21, so that the molten nickel only flows downward along the lead wire 8 (see FIG. 10).
Therefore, there is no possibility that molten nickel will adhere to the lead insertion hole 18 of the upper die jig 16. However, since all of the molten nickel flows downward, a large amount of molten nickel gathers at the tip of the lead wire 8, and the metal outer ring 1
The adhesive strength with the material increases. In addition, since the copper plating layer 20 is previously formed on the metal outer ring 1, the diffusion of molten nickel is suppressed by the copper plating layer 20, so that the adhesive strength between the lead wire 8 and the metal outer ring 1 is improved. will further increase.
尚、金属メツキ層２１は後工程の仕上メツキの
前に金属外環１の銅メツキ層２０と共に除去され
る。又、無電解ニツケルメツキ層１７は例えば２
〜４mmの長さで15〜30μの厚さで形成し、対する
金属メツキ層２１は0.1〜1.0μ程度の厚さで形成
することが望ましい。 Note that the metal plating layer 21 is removed together with the copper plating layer 20 of the metal outer ring 1 before finishing plating in a later step. Further, the electroless nickel plating layer 17 has, for example, 2
It is preferable that the metal plating layer 21 be formed with a length of ~4 mm and a thickness of 15 to 30 μm, while the metal plating layer 21 is preferably formed with a thickness of about 0.1 to 1.0 μm.
以上説明したように、本発明によればリード線
の無電解ニツケルメツキ層を加熱溶融して金属外
環に接着させる際、溶融ニツケルの上方への這い
上りが金属メツキ層で防止され、下方にのみ流れ
るから、溶融ニツケルのカーボン治具への喰い付
きがなくなり、金属外環との接着強度が増し、常
に安定した製造が可能で、且つ気密端子の良品率
の向上が図れる。又、溶融ニツケルのカーボン治
具への喰い付きがなくなるので、カーボン治具を
より小型化することが可能となる。 As explained above, according to the present invention, when the electroless nickel plating layer of the lead wire is heated and melted and bonded to the metal outer ring, the metal plating layer prevents the molten nickel from creeping upward, and the molten nickel only flows downward. Because it flows, the molten nickel does not stick to the carbon jig, increasing the adhesive strength with the metal outer ring, allowing stable manufacturing at all times, and improving the yield of airtight terminals. Furthermore, since the molten nickel does not bite into the carbon jig, the carbon jig can be made more compact.
第１図はトランジスタを例にした気密端子の平
面図、第２図は第１図Ａ―Ａ線に治う断面図、第
３図及び第４図は従来の気密端子の製造方法を説
明するための各工程での断面図、第５図は本発明
の前提となる気密端子の製造方法を説明するため
の断面図、第６図は第５図要部の加熱後の拡大断
面図、第７図は本発明で用いるリード線の一例を
示す一部断面側面図、第８図は第７図のリード線
の製造方法例の説明図、第９図は本発明によるロ
ウ付け方法を実施する装置の例を示す断面図、第
１０図は第９図要部の加熱後の拡大断面図であ
る。
１……金属体（金属外環）、４，５……他のリ
ード線、６，７……ガラス、８……リード線、１
７……無電解ニツケルメツキ層、２１……金属メ
ツキ層。
Fig. 1 is a plan view of a hermetic terminal using a transistor as an example, Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1, and Figs. 3 and 4 explain a conventional manufacturing method of an airtight terminal. 5 is a sectional view for explaining the manufacturing method of an airtight terminal, which is the premise of the present invention. FIG. 6 is an enlarged sectional view of the main part of FIG. 5 after heating. FIG. 7 is a partially cross-sectional side view showing an example of the lead wire used in the present invention, FIG. 8 is an explanatory diagram of an example of the method for manufacturing the lead wire shown in FIG. 7, and FIG. 9 is a diagram for implementing the brazing method according to the present invention. FIG. 10 is an enlarged sectional view of the main part of FIG. 9 after heating. 1... Metal body (metal outer ring), 4, 5... Other lead wires, 6, 7... Glass, 8... Lead wire, 1
7... Electroless nickel plating layer, 21... Metal plating layer.
Claims (1)
ルメツキ層を形成したリード線の端面を突き合せ
て、前記無電解ニツケルメツキ層を加熱溶融する
ことにより、リード線を金属体に固着するように
したロウ付け方法に於いて、前記リード線の無電
解ニツケルメツキ層形成部分を除く部分に溶融ニ
ツケルの這い上りを阻止する金属メツキ層を予め
被着形成しておくことを特徴とするリード線のロ
ウ付け方法。 ２ 前記金属体は金属外環であり、この金属外環
に設けた透孔にガラスタブレツトおよび他のリー
ド線が挿通され、前記リード線の金属体へのロウ
付けと同時に前記他のリード線が金属外環にガラ
ス封着される特許請求の範囲第１項記載のリード
線のロウ付け方法。[Scope of Claims] 1. The lead wire is made by abutting the end face of a lead wire having an electroless nickel plating layer formed on the fixed end against a part of a metal body and heating and melting the electroless nickel plating layer. In the brazing method for fixing the lead wire to a metal body, a metal plating layer to prevent molten nickel from creeping up is formed in advance on the portion of the lead wire other than the portion where the electroless nickel plating layer is formed. Characteristic lead wire brazing method. 2. The metal body is a metal outer ring, and a glass tablet and other lead wires are inserted into the through holes provided in the metal outer ring, and the other lead wires are simultaneously brazed to the metal body. A lead wire brazing method according to claim 1, wherein the lead wire is glass-sealed to a metal outer ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP792380A JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP792380A JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56105655A JPS56105655A (en) | 1981-08-22 |
| JPS6258153B2 true JPS6258153B2 (en) | 1987-12-04 |
Family
ID=11679041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP792380A Granted JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56105655A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62103258U (en) * | 1985-12-19 | 1987-07-01 |
-
1980
- 1980-01-25 JP JP792380A patent/JPS56105655A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56105655A (en) | 1981-08-22 |
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