JPS56103452A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56103452A JPS56103452A JP600180A JP600180A JPS56103452A JP S56103452 A JPS56103452 A JP S56103452A JP 600180 A JP600180 A JP 600180A JP 600180 A JP600180 A JP 600180A JP S56103452 A JPS56103452 A JP S56103452A
- Authority
- JP
- Japan
- Prior art keywords
- container
- parts
- glass
- rays radiated
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W42/25—
-
- H10W70/682—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/756—
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600180A JPS56103452A (en) | 1980-01-22 | 1980-01-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600180A JPS56103452A (en) | 1980-01-22 | 1980-01-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56103452A true JPS56103452A (en) | 1981-08-18 |
| JPS628032B2 JPS628032B2 (index.php) | 1987-02-20 |
Family
ID=11626510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP600180A Granted JPS56103452A (en) | 1980-01-22 | 1980-01-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56103452A (index.php) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
| WO1996022669A3 (en) * | 1995-01-13 | 1996-09-26 | Space Electronics Inc | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| US6261508B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
| US6262362B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6368899B1 (en) | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
| US6455864B1 (en) | 1994-04-01 | 2002-09-24 | Maxwell Electronic Components Group, Inc. | Methods and compositions for ionizing radiation shielding |
| US6613978B2 (en) | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| US7382043B2 (en) | 2002-09-25 | 2008-06-03 | Maxwell Technologies, Inc. | Method and apparatus for shielding an integrated circuit from radiation |
| US7696610B2 (en) | 2003-07-16 | 2010-04-13 | Maxwell Technologies, Inc. | Apparatus for shielding integrated circuit devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4710169U (index.php) * | 1971-02-25 | 1972-10-06 | ||
| JPS5652415A (en) * | 1979-10-03 | 1981-05-11 | Hitachi Ltd | Temperature control unit |
-
1980
- 1980-01-22 JP JP600180A patent/JPS56103452A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4710169U (index.php) * | 1971-02-25 | 1972-10-06 | ||
| JPS5652415A (en) * | 1979-10-03 | 1981-05-11 | Hitachi Ltd | Temperature control unit |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
| US6858795B2 (en) | 1993-06-18 | 2005-02-22 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6613978B2 (en) | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6261508B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
| US6262362B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6455864B1 (en) | 1994-04-01 | 2002-09-24 | Maxwell Electronic Components Group, Inc. | Methods and compositions for ionizing radiation shielding |
| US5635754A (en) * | 1994-04-01 | 1997-06-03 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| WO1996022669A3 (en) * | 1995-01-13 | 1996-09-26 | Space Electronics Inc | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| US6368899B1 (en) | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
| US6963125B2 (en) | 2000-03-08 | 2005-11-08 | Sony Corporation | Electronic device packaging |
| US7382043B2 (en) | 2002-09-25 | 2008-06-03 | Maxwell Technologies, Inc. | Method and apparatus for shielding an integrated circuit from radiation |
| US7696610B2 (en) | 2003-07-16 | 2010-04-13 | Maxwell Technologies, Inc. | Apparatus for shielding integrated circuit devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628032B2 (index.php) | 1987-02-20 |
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