JPS56102597A - Plating device - Google Patents

Plating device

Info

Publication number
JPS56102597A
JPS56102597A JP224280A JP224280A JPS56102597A JP S56102597 A JPS56102597 A JP S56102597A JP 224280 A JP224280 A JP 224280A JP 224280 A JP224280 A JP 224280A JP S56102597 A JPS56102597 A JP S56102597A
Authority
JP
Japan
Prior art keywords
substance
plating solution
block
cathode
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP224280A
Other languages
English (en)
Other versions
JPS5841358B2 (ja
Inventor
Aaru Shieaa Guren
Tasuku Toyama
Tatsuo Wada
Teruaki Yamamoto
Keisuke Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP55002242A priority Critical patent/JPS5841358B2/ja
Priority to US06/223,208 priority patent/US4323441A/en
Priority to FR8100327A priority patent/FR2473559A1/fr
Priority to GB8100769A priority patent/GB2067223B/en
Priority to DE3100634A priority patent/DE3100634C2/de
Publication of JPS56102597A publication Critical patent/JPS56102597A/ja
Publication of JPS5841358B2 publication Critical patent/JPS5841358B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP55002242A 1980-01-12 1980-01-12 メツキ装置 Expired JPS5841358B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP55002242A JPS5841358B2 (ja) 1980-01-12 1980-01-12 メツキ装置
US06/223,208 US4323441A (en) 1980-01-12 1981-01-07 Apparatus for electroplating strip material without current leakage
FR8100327A FR2473559A1 (fr) 1980-01-12 1981-01-09 Appareil pour le placage electrolytique d'un materiau en bande sans dispersion de courant
GB8100769A GB2067223B (en) 1980-01-12 1981-01-12 Apparatus for electroplating strip material without current leakage
DE3100634A DE3100634C2 (de) 1980-01-12 1981-01-12 Vorrichtung zum Galvanisieren eines Bandes aus elektrisch leitendem Material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55002242A JPS5841358B2 (ja) 1980-01-12 1980-01-12 メツキ装置

Publications (2)

Publication Number Publication Date
JPS56102597A true JPS56102597A (en) 1981-08-17
JPS5841358B2 JPS5841358B2 (ja) 1983-09-12

Family

ID=11523880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55002242A Expired JPS5841358B2 (ja) 1980-01-12 1980-01-12 メツキ装置

Country Status (5)

Country Link
US (1) US4323441A (ja)
JP (1) JPS5841358B2 (ja)
DE (1) DE3100634C2 (ja)
FR (1) FR2473559A1 (ja)
GB (1) GB2067223B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211597A (ja) * 1983-05-14 1984-11-30 Kawasaki Steel Corp 合金めつき鋼板の製造方法および装置
JPH01502204A (ja) * 1987-02-13 1989-08-03 サントル・ド・ルシェルシュ・メタリュルジュク 電着による極薄金属薄板の連続製造設備

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107498A (ja) * 1981-12-18 1983-06-27 Fuji Photo Film Co Ltd 帯状金属板の電解処理方法および装置
JPS63140100A (ja) * 1986-12-02 1988-06-11 Kawasaki Steel Corp 電解処理槽
US4915796A (en) * 1988-10-14 1990-04-10 Charles Denofrio Electroplating process
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus
US5344538A (en) * 1993-01-11 1994-09-06 Gould Inc. Thin plate anode
FR2725215B1 (fr) * 1994-09-29 1996-11-22 Lorraine Laminage Cellule d'electrodeposition en continu d'alliages metalliques
US7930815B2 (en) * 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US20060037865A1 (en) * 2004-08-19 2006-02-23 Rucker Michael H Methods and apparatus for fabricating gas turbine engines
US20090078579A1 (en) * 2007-09-20 2009-03-26 Weibezahn Karl S Systems And Methods For Electroplating Embossed Features On Substrates
WO2013004414A1 (en) 2011-07-07 2013-01-10 Nv Bekaert Sa Distribution plate in electrolyte bath
DE102020107907B4 (de) * 2020-03-23 2023-10-26 Jacob Zimmermann Vorrichtung zur elektrochemischen Herstellung dünner Folien und Verfahren zur elektrochemischen Herstellung dünner Folien

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2244423A (en) * 1938-06-28 1941-06-03 Hanson Van Winkle Munning Co Apparatus for strip plating
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
JPS5524141Y2 (ja) * 1976-10-16 1980-06-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211597A (ja) * 1983-05-14 1984-11-30 Kawasaki Steel Corp 合金めつき鋼板の製造方法および装置
JPH01502204A (ja) * 1987-02-13 1989-08-03 サントル・ド・ルシェルシュ・メタリュルジュク 電着による極薄金属薄板の連続製造設備

Also Published As

Publication number Publication date
GB2067223A (en) 1981-07-22
US4323441A (en) 1982-04-06
FR2473559A1 (fr) 1981-07-17
FR2473559B1 (ja) 1983-02-11
JPS5841358B2 (ja) 1983-09-12
GB2067223B (en) 1983-06-02
DE3100634C2 (de) 1984-11-22
DE3100634A1 (de) 1982-02-04

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