JPS57101688A - Control of plating adhesion amount - Google Patents
Control of plating adhesion amountInfo
- Publication number
- JPS57101688A JPS57101688A JP17750980A JP17750980A JPS57101688A JP S57101688 A JPS57101688 A JP S57101688A JP 17750980 A JP17750980 A JP 17750980A JP 17750980 A JP17750980 A JP 17750980A JP S57101688 A JPS57101688 A JP S57101688A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- strip
- plating
- barrier
- effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To control a turn-round amount to an exposed surface when one surface is plated to a minimum degree in carrying out continuous electroplating of a strip, by providing a first and a second barrier plates specifically to make a plating adhesion amount uniform.
CONSTITUTION: In continuously electroplating a strip 1 by using an anode 4 and a plating liquid with a liquid surface 5, in the vicinity of the anode 4 provided to both side end parts of the strip 1, a first electrically insulative barrier plate 2 is arranged almost in parallel therewith. In order to further improve barrier effect, a second barrier plate 3 almost parallel with the plate 2 is arranged. When the plate 3 is positioned at a height same as that of the strip, maximum barrier effect is obtained but it may be positioned a little closer to the side of the anode 4 and, as it is brought closer to the plate 2, said effect is reduced. In plating both surfaces of the strip 1, if a distance between both plates 3 is narrow, effect perfectly same with that when one plate is used is obtained. Further, in plating one side of the strip 1, at each side surfaces, one plate may be used but, if two plates are used, both surface plating can be carried out.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17750980A JPS57101688A (en) | 1980-12-15 | 1980-12-15 | Control of plating adhesion amount |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17750980A JPS57101688A (en) | 1980-12-15 | 1980-12-15 | Control of plating adhesion amount |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57101688A true JPS57101688A (en) | 1982-06-24 |
Family
ID=16032142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17750980A Pending JPS57101688A (en) | 1980-12-15 | 1980-12-15 | Control of plating adhesion amount |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57101688A (en) |
-
1980
- 1980-12-15 JP JP17750980A patent/JPS57101688A/en active Pending
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