JPS6455396A - Electrodeposition method for metal - Google Patents

Electrodeposition method for metal

Info

Publication number
JPS6455396A
JPS6455396A JP21128987A JP21128987A JPS6455396A JP S6455396 A JPS6455396 A JP S6455396A JP 21128987 A JP21128987 A JP 21128987A JP 21128987 A JP21128987 A JP 21128987A JP S6455396 A JPS6455396 A JP S6455396A
Authority
JP
Japan
Prior art keywords
cathode
mother board
electrodeposited
plates
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21128987A
Other languages
Japanese (ja)
Other versions
JPH0564719B2 (en
Inventor
Yoshio Kawasumi
Takashi Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP21128987A priority Critical patent/JPS6455396A/en
Publication of JPS6455396A publication Critical patent/JPS6455396A/en
Publication of JPH0564719B2 publication Critical patent/JPH0564719B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To form plural electrodeposited metal plates with the excellent dimensional precision of the prescribed shape and having uniform thickness by forming plural electrodeposition surfaces from a cathode mother board surface by an insulating band, and providing a specified current distribution control plate between the electrodeposition surface and the anode surface at the time of forming plural metal electrodeposited plates on one cathode mother board. CONSTITUTION:When plural electrodeposited plates of Cu, Zn, Ni, Co, Cd, etc., are formed on the surface of the cathode mother board consisting of Cu, Ti, Zn, Pb, stainless steel, etc., the surface of the cathode mother board is covered with an insulating tape while leaving the effective electrodeposition surface, a current is applied between the anode and cathode by a diaphragm electrolytic system, and the metal is electrodeposited on the plural exposed parts on the cathode mother board surface. In this case, >=2 current distribution control plates for uniformizing the current distribution are interposed between the cathode and anode plates. A hole having a width smaller than that of the electrodeposited metal plate on the cathode mother board and corresponding to the electrodeposited metal part on the cathode surface is provided to the current distribution control plate. As a result, plural metal electrodeposited plates having uniform thickness and free of the protrusions on the left, right, upper, and lower ends is obtained on the cathode mother board.
JP21128987A 1987-08-27 1987-08-27 Electrodeposition method for metal Granted JPS6455396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21128987A JPS6455396A (en) 1987-08-27 1987-08-27 Electrodeposition method for metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21128987A JPS6455396A (en) 1987-08-27 1987-08-27 Electrodeposition method for metal

Publications (2)

Publication Number Publication Date
JPS6455396A true JPS6455396A (en) 1989-03-02
JPH0564719B2 JPH0564719B2 (en) 1993-09-16

Family

ID=16603466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21128987A Granted JPS6455396A (en) 1987-08-27 1987-08-27 Electrodeposition method for metal

Country Status (1)

Country Link
JP (1) JPS6455396A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373894A (en) * 1989-08-15 1991-03-28 Central Res Inst Of Electric Power Ind Fused salt electrolysis refining device
JP2002513860A (en) * 1998-05-06 2002-05-14 エルテック・システムズ・コーポレーション Improved lead electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373894A (en) * 1989-08-15 1991-03-28 Central Res Inst Of Electric Power Ind Fused salt electrolysis refining device
JP2002513860A (en) * 1998-05-06 2002-05-14 エルテック・システムズ・コーポレーション Improved lead electrode

Also Published As

Publication number Publication date
JPH0564719B2 (en) 1993-09-16

Similar Documents

Publication Publication Date Title
ES8701242A1 (en) Anodic aluminium oxide film and method of forming it.
ES8404769A1 (en) Electroplating non-metallic surfaces
JPS6455396A (en) Electrodeposition method for metal
GB1189718A (en) Re-Preparable Negative Master Plates for Making Perforated Foils by Electro-Deposition.
ES8503989A1 (en) Method for repairing a mold for continuous casting of steel
JPS55152200A (en) Electroplating
DE3262272D1 (en) Process for the galvanic deposit of a zinc-nickel-alloy layer on a metal object, in particular on steel strip
JPS56119792A (en) Electroplating method
JPS57207192A (en) Production of steel plate plated with zinc-nikel alloy on both sides
JPS54159341A (en) Plating method
EP0711102A4 (en) Method for forming conductive circuit on surface of molded product, and component having conduction circuit
US4559703A (en) Process for silver plating rotary contact assemblies
JPS57165196A (en) Foil-like nickel-phosphor alloy brazing filler metal
Terakado et al. A New Alternative to the Hull Cell
DE3064251D1 (en) A strip of electrical terminals electroplated with contact metal and a method of, and apparatus for, plating such a strip
JPS5346004A (en) Manufacture of press.master for video disk
GB757892A (en) Improvements relating to the electrolytic production of copper foils
ES2012606A6 (en) Method of eliminating a fern-like pattern during electroplating of metal strip.
JPS5794600A (en) Method for replenishing anode material in copper sulfate plating bath
JPS5763694A (en) Plating method for forming case for electromagnetic shield
JPS5330406A (en) Depositing method for metal from solution of metal salt by electrolysis
JPS56140353A (en) Suspended metallic mask screen plate
JPS53131235A (en) Manufacture of one-side plated strip steel sheet
JPS57199156A (en) Dome-like-mesh electrode and its manufacture
JPS57125053A (en) Manufacturing of screen mask

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees