JPS56102577A - Method and device for forming thin film - Google Patents
Method and device for forming thin filmInfo
- Publication number
- JPS56102577A JPS56102577A JP495480A JP495480A JPS56102577A JP S56102577 A JPS56102577 A JP S56102577A JP 495480 A JP495480 A JP 495480A JP 495480 A JP495480 A JP 495480A JP S56102577 A JPS56102577 A JP S56102577A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- reaction tube
- thin film
- flow
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
Abstract
PURPOSE:To obtain a favourable amorphous silicon thin film with controlling a rate of ionization by introducing the preliminarliy ionized gas in a preionization chamber into a main reaction vessel. CONSTITUTION:A substrate 6 is heated by a heater 5 in a reaction tube 1. Nonionized mixed gas of SiH3 gas, PH3, B2H6, CF4 diluted respectively by hydrogen from cylinders 15, 16, 17, 18 is fed from a gas supply port 19 into the reaction tube 1 by means of a mass-flow controller 20. On the other hand, in a preionization chamber 10, the mixed gas is inonized by the plasma generated by a high-frequency coil 9, and scattered inside of the reaction tube 1 by a sprayer 8. At the same time, in the reaction tube 1, high-frequency power is supplied through plate electrodes set in parallel by a high-frequency electric source 4, generating plasma. And flow rates of gas entering the reaction tube 1 and preionization chamber 10 are made to have an optimum ratio of flow rate by mass-flow controllers 20, 21, thus resulting in the effective utilization of the gas and formation of the desirable thin film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP495480A JPS56102577A (en) | 1980-01-18 | 1980-01-18 | Method and device for forming thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP495480A JPS56102577A (en) | 1980-01-18 | 1980-01-18 | Method and device for forming thin film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56102577A true JPS56102577A (en) | 1981-08-17 |
Family
ID=11597963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP495480A Pending JPS56102577A (en) | 1980-01-18 | 1980-01-18 | Method and device for forming thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56102577A (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149465A (en) * | 1981-03-12 | 1982-09-16 | Canon Inc | Formation of accumulated film |
JPS59131511A (en) * | 1983-01-17 | 1984-07-28 | Zenko Hirose | Formation of film of amorphous silicon |
EP0120307A2 (en) * | 1983-02-25 | 1984-10-03 | Toyota Jidosha Kabushiki Kaisha | Apparatus and method for plasma treatment of resin material |
FR2545984A1 (en) * | 1983-05-11 | 1984-11-16 | Semiconductor Res Found | METHOD FOR DRY FABRICATION OF A SEMICONDUCTOR DEVICE BY PHOTOCHEMICAL REACTION AND APPARATUS FOR CARRYING OUT SAID METHOD |
FR2555614A1 (en) * | 1983-08-16 | 1985-05-31 | Canon Kk | PROCESS FOR FORMING A FILM ON A SUBSTRATE BY VAPOR PHASE DECOMPOSITION |
JPS60131970A (en) * | 1983-12-20 | 1985-07-13 | Canon Inc | Formation of deposited film |
JPS60200523A (en) * | 1984-03-26 | 1985-10-11 | Agency Of Ind Science & Technol | Manufacture of silicon thin film |
JPS6188522A (en) * | 1984-10-08 | 1986-05-06 | Canon Inc | Formation of deposited film |
JPS61238965A (en) * | 1985-04-16 | 1986-10-24 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming thin film |
JPS6286166A (en) * | 1985-10-14 | 1987-04-20 | Semiconductor Energy Lab Co Ltd | Formation of thin film |
JPS6289874A (en) * | 1985-10-14 | 1987-04-24 | Semiconductor Energy Lab Co Ltd | Formation of thin film |
EP1118691A1 (en) * | 2000-01-20 | 2001-07-25 | Micro C Technologies, Inc. | Reactor with remote plasma system and method of processing a semiconductor substrate |
EP1155164A4 (en) * | 1999-01-05 | 2005-04-06 | Ronal Systems Corp | In situ chemical generator and method |
US7375035B2 (en) | 2003-04-29 | 2008-05-20 | Ronal Systems Corporation | Host and ancillary tool interface methodology for distributed processing |
US7563328B2 (en) * | 2001-01-19 | 2009-07-21 | Tokyo Electron Limited | Method and apparatus for gas injection system with minimum particulate contamination |
CN114645261A (en) * | 2020-12-17 | 2022-06-21 | 新奥科技发展有限公司 | Pretreatment device for boronizing internal chamber of fusion device and application thereof |
-
1980
- 1980-01-18 JP JP495480A patent/JPS56102577A/en active Pending
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6362591B2 (en) * | 1981-03-12 | 1988-12-02 | ||
JPS57149465A (en) * | 1981-03-12 | 1982-09-16 | Canon Inc | Formation of accumulated film |
JPS59131511A (en) * | 1983-01-17 | 1984-07-28 | Zenko Hirose | Formation of film of amorphous silicon |
JPH0411626B2 (en) * | 1983-01-17 | 1992-03-02 | Zenko Hirose | |
EP0120307A2 (en) * | 1983-02-25 | 1984-10-03 | Toyota Jidosha Kabushiki Kaisha | Apparatus and method for plasma treatment of resin material |
EP0120307A3 (en) * | 1983-02-25 | 1989-05-03 | Toyota Jidosha Kabushiki Kaisha | Apparatus and method for plasma treatment of resin material |
FR2545984A1 (en) * | 1983-05-11 | 1984-11-16 | Semiconductor Res Found | METHOD FOR DRY FABRICATION OF A SEMICONDUCTOR DEVICE BY PHOTOCHEMICAL REACTION AND APPARATUS FOR CARRYING OUT SAID METHOD |
FR2555614A1 (en) * | 1983-08-16 | 1985-05-31 | Canon Kk | PROCESS FOR FORMING A FILM ON A SUBSTRATE BY VAPOR PHASE DECOMPOSITION |
JPS60131970A (en) * | 1983-12-20 | 1985-07-13 | Canon Inc | Formation of deposited film |
JPH0517312B2 (en) * | 1983-12-20 | 1993-03-08 | Canon Kk | |
JPS60200523A (en) * | 1984-03-26 | 1985-10-11 | Agency Of Ind Science & Technol | Manufacture of silicon thin film |
JPS6188522A (en) * | 1984-10-08 | 1986-05-06 | Canon Inc | Formation of deposited film |
JPS61238965A (en) * | 1985-04-16 | 1986-10-24 | Matsushita Electric Ind Co Ltd | Method and apparatus for forming thin film |
JPS6289874A (en) * | 1985-10-14 | 1987-04-24 | Semiconductor Energy Lab Co Ltd | Formation of thin film |
JPS6286166A (en) * | 1985-10-14 | 1987-04-20 | Semiconductor Energy Lab Co Ltd | Formation of thin film |
JPH0474431B2 (en) * | 1985-10-14 | 1992-11-26 | ||
JPH0474432B2 (en) * | 1985-10-14 | 1992-11-26 | ||
US7033952B2 (en) | 1999-01-05 | 2006-04-25 | Berg & Berg Enterprises, Llc | Apparatus and method using a remote RF energized plasma for processing semiconductor wafers |
EP1155164A4 (en) * | 1999-01-05 | 2005-04-06 | Ronal Systems Corp | In situ chemical generator and method |
KR100755122B1 (en) * | 1999-01-05 | 2007-09-04 | 버그 앤 버그 엔터프라이즈, 엘엘씨 | In situ chemical generator and method |
US6783627B1 (en) * | 2000-01-20 | 2004-08-31 | Kokusai Semiconductor Equipment Corporation | Reactor with remote plasma system and method of processing a semiconductor substrate |
EP1118691A1 (en) * | 2000-01-20 | 2001-07-25 | Micro C Technologies, Inc. | Reactor with remote plasma system and method of processing a semiconductor substrate |
US7563328B2 (en) * | 2001-01-19 | 2009-07-21 | Tokyo Electron Limited | Method and apparatus for gas injection system with minimum particulate contamination |
US7375035B2 (en) | 2003-04-29 | 2008-05-20 | Ronal Systems Corporation | Host and ancillary tool interface methodology for distributed processing |
CN114645261A (en) * | 2020-12-17 | 2022-06-21 | 新奥科技发展有限公司 | Pretreatment device for boronizing internal chamber of fusion device and application thereof |
CN114645261B (en) * | 2020-12-17 | 2024-04-09 | 新奥科技发展有限公司 | Pretreatment device for boride of internal cavity of fusion device and application thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56102577A (en) | Method and device for forming thin film | |
EP0074212B1 (en) | Apparatus for forming thin film | |
CN100462475C (en) | Apparatus and method for plasma processing | |
TW261689B (en) | Method and apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | |
KR920010777A (en) | Substrate Processing Equipment and Substrate Processing Method | |
TW494143B (en) | Annealing an amorphous film using microwave energy | |
TWI548017B (en) | Apparatus for treating a gas stream | |
KR100457455B1 (en) | Chemical Vapor Deposition Apparatus which deposition-speed control is possible | |
JPS5927212B2 (en) | plasma reactor | |
JPS61263125A (en) | Dry etching apparatus | |
JPS5778546A (en) | Production of photoconductive silicon layer | |
JPS57192258A (en) | Film forming apparatus using glow discharge | |
JPS5756923A (en) | Manufacture of thin film | |
JPS6423537A (en) | Plasma processing device | |
JPS6439379A (en) | Method and device for producing thin film forming parts | |
JPS5713746A (en) | Vapor-phase growing apparatus | |
CN111446844B (en) | Alternating-current high-power MW-level constant-temperature voltage-regulating automatic control plasma power supply | |
JPS57113214A (en) | Manufacture of amorphous semiconductor film | |
JPS57187935A (en) | Forming of fine crystalline amorphous silicon film | |
JPS57204119A (en) | Forming method for amorphous thin-film | |
JPS56147831A (en) | Modifying method of plastic surface | |
JPS55100204A (en) | Treating method for ozone generating liquid | |
RU2031985C1 (en) | Method and apparatus to produce polycrystalline zinc selenide | |
JPH01218024A (en) | Dry etching apparatus | |
JPS6329735Y2 (en) |