JPS5598841A - Electroconductive structure for semiconductor device - Google Patents
Electroconductive structure for semiconductor deviceInfo
- Publication number
- JPS5598841A JPS5598841A JP693079A JP693079A JPS5598841A JP S5598841 A JPS5598841 A JP S5598841A JP 693079 A JP693079 A JP 693079A JP 693079 A JP693079 A JP 693079A JP S5598841 A JPS5598841 A JP S5598841A
- Authority
- JP
- Japan
- Prior art keywords
- unit
- insulating plate
- frame
- leads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To make the mounting of a semiconductor device flexible, by providing an insulating plate, which supports the semiconductor device when it is installed in a lead frame and whose size is smaller than that of the device, and connecting the leads of the frame to the electrodes on the board of the device.
CONSTITUTION: An insulating plate 1, which is smaller than an IC unit 5 which is positioned in the opening of a lead frame 7, is provided in the opening of the frame. The opening has a prescribed size. The IC unit is fixed on the insulating plate 1. Electrode connection leads 3 provided on the unit 5 and projecting from the insulating plate 1 are coupled to copper leads 4 through copper wirings 2. The ends of the copper leads 4 are fixed on the external leads 9 of the frame 7. Positioning holes 8 are provided in the four corners of the frame to facilitate positioning to a package or the like. Such a construction is equivalent to the case that an auxiliary wiring layer is provided on the unit, because the area of the insulating plate 1 is smaller than that of the unit 5. This results in raising the flexibility of bonding.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP693079A JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP693079A JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5598841A true JPS5598841A (en) | 1980-07-28 |
JPS624854B2 JPS624854B2 (en) | 1987-02-02 |
Family
ID=11651956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP693079A Granted JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5598841A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113362U (en) * | 1988-01-25 | 1989-07-31 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105969A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Manufacture of connection structure and wiring for semiconductor device |
-
1979
- 1979-01-23 JP JP693079A patent/JPS5598841A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105969A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Manufacture of connection structure and wiring for semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113362U (en) * | 1988-01-25 | 1989-07-31 |
Also Published As
Publication number | Publication date |
---|---|
JPS624854B2 (en) | 1987-02-02 |
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