JPS559642A - Production of heat-resistant resin paste - Google Patents
Production of heat-resistant resin pasteInfo
- Publication number
- JPS559642A JPS559642A JP8212278A JP8212278A JPS559642A JP S559642 A JPS559642 A JP S559642A JP 8212278 A JP8212278 A JP 8212278A JP 8212278 A JP8212278 A JP 8212278A JP S559642 A JPS559642 A JP S559642A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- parts
- solvent
- aromatic
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 2
- 239000002798 polar solvent Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004962 Polyamide-imide Substances 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000011133 lead Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212278A JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212278A JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS559642A true JPS559642A (en) | 1980-01-23 |
| JPS6157865B2 JPS6157865B2 (enExample) | 1986-12-09 |
Family
ID=13765601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8212278A Granted JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS559642A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (ja) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | 導電性接着剤組成物 |
| JPS61168881A (ja) * | 1985-01-21 | 1986-07-30 | 三菱電機株式会社 | 圧接端子構造 |
| JPS62106960A (ja) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | 耐熱性樹脂組成物 |
| JPS62179564A (ja) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | 耐熱性フレキシブル樹脂組成物 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01118586A (ja) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH04222889A (ja) * | 1990-12-25 | 1992-08-12 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペースト |
-
1978
- 1978-07-07 JP JP8212278A patent/JPS559642A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (ja) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | 導電性接着剤組成物 |
| JPS61168881A (ja) * | 1985-01-21 | 1986-07-30 | 三菱電機株式会社 | 圧接端子構造 |
| JPS62106960A (ja) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | 耐熱性樹脂組成物 |
| JPS62179564A (ja) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | 耐熱性フレキシブル樹脂組成物 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01118586A (ja) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH04222889A (ja) * | 1990-12-25 | 1992-08-12 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペースト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157865B2 (enExample) | 1986-12-09 |
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