JPS559420A - Resin shielding type semiconductor device - Google Patents

Resin shielding type semiconductor device

Info

Publication number
JPS559420A
JPS559420A JP8188478A JP8188478A JPS559420A JP S559420 A JPS559420 A JP S559420A JP 8188478 A JP8188478 A JP 8188478A JP 8188478 A JP8188478 A JP 8188478A JP S559420 A JPS559420 A JP S559420A
Authority
JP
Japan
Prior art keywords
resin
heat
contraction
plates
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8188478A
Other languages
Japanese (ja)
Inventor
Akio Yasukawa
Sueo Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8188478A priority Critical patent/JPS559420A/en
Publication of JPS559420A publication Critical patent/JPS559420A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent cracking of a protective film on the surface of a semiconductor element, as well as to prevent from separation of the boundary surface between a resin, and a tab and the element, by plugging up heat-contraction preventing plates in the resin at above and below the element.
CONSTITUTION: A heat-contraction preventing plates 6 are buried in a resin 5 at both above and below a semiconductor pellet 3. These plates 6 restrict contraction of the resin by heat, thus reducing the apparent coefficient of linear expansion of the resin 5 as well as shearing force being applied to the boundary between the resin 5, and a tab 2 and the pellet 3. As for the heat-contraction preventing plates 6, materials which have smaller expansion coefficient and larger elastic modulus than the resin 5 has, such as cobal and phosphor bronze are recommended. The thicker the plate 6 is, the less is the shearing stress. A single heat contraction preventing plate 6 can be used either above or below the semiconductor element.
COPYRIGHT: (C)1980,JPO&Japio
JP8188478A 1978-07-07 1978-07-07 Resin shielding type semiconductor device Pending JPS559420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8188478A JPS559420A (en) 1978-07-07 1978-07-07 Resin shielding type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8188478A JPS559420A (en) 1978-07-07 1978-07-07 Resin shielding type semiconductor device

Publications (1)

Publication Number Publication Date
JPS559420A true JPS559420A (en) 1980-01-23

Family

ID=13758869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8188478A Pending JPS559420A (en) 1978-07-07 1978-07-07 Resin shielding type semiconductor device

Country Status (1)

Country Link
JP (1) JPS559420A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053059A (en) * 1983-09-02 1985-03-26 Hitachi Ltd Resin molded semiconductor device and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053059A (en) * 1983-09-02 1985-03-26 Hitachi Ltd Resin molded semiconductor device and manufacture thereof
JPH0117260B2 (en) * 1983-09-02 1989-03-29 Hitachi Ltd

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