JPS5591139A - Production method of and apparatus for semiconductor device - Google Patents

Production method of and apparatus for semiconductor device

Info

Publication number
JPS5591139A
JPS5591139A JP16487478A JP16487478A JPS5591139A JP S5591139 A JPS5591139 A JP S5591139A JP 16487478 A JP16487478 A JP 16487478A JP 16487478 A JP16487478 A JP 16487478A JP S5591139 A JPS5591139 A JP S5591139A
Authority
JP
Japan
Prior art keywords
wafer
film
high pressure
dice
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16487478A
Other languages
Japanese (ja)
Inventor
Kenzo Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP16487478A priority Critical patent/JPS5591139A/en
Publication of JPS5591139A publication Critical patent/JPS5591139A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To improve the production yield by grooving the wafer to the half way with a scribing after water-jet washing under a high pressure exceeding 20kg/cm2 before final division by the mechamical stress, when the wafer having elements thereon is divided into dice.
CONSTITUTION: An electrode wiring Al film 22 is applied on a semiconductor wafer 21 having a plurality of elements thereon and entirely covered with an SiO2 film 23 to protect thereof. Then, for division into dice, the wafer 21 is grooved to the half way one line at a time along the scribe line employing a diamond cutter or a laser beam. Spallings 25 of the wafer yielded on the film 23 is completely by a jet scrubber or a high pressure scrubber using a high pressure water exceeding 20kg/cm2. Thereafter, after dried by blowing hot air or the like, the wafer is broken on a sheet with a roller or the like. This makes the divided pellets sufficiently clean eliminating troubles due to a short- circuit or the like.
COPYRIGHT: (C)1980,JPO&Japio
JP16487478A 1978-12-27 1978-12-27 Production method of and apparatus for semiconductor device Pending JPS5591139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16487478A JPS5591139A (en) 1978-12-27 1978-12-27 Production method of and apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16487478A JPS5591139A (en) 1978-12-27 1978-12-27 Production method of and apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5591139A true JPS5591139A (en) 1980-07-10

Family

ID=15801554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16487478A Pending JPS5591139A (en) 1978-12-27 1978-12-27 Production method of and apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5591139A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9400164A (en) * 1994-02-03 1995-09-01 Drukker Int Bv Method for laser-cutting a CVD diamond slab, and CVD diamond slab thus obtained
EP0624423A3 (en) * 1993-05-11 1996-02-14 Gen Electric Method of separation of pieces from super hard material.
KR100475524B1 (en) * 1996-11-27 2005-05-17 삼성전자주식회사 Board Cutting Method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0624423A3 (en) * 1993-05-11 1996-02-14 Gen Electric Method of separation of pieces from super hard material.
NL9400164A (en) * 1994-02-03 1995-09-01 Drukker Int Bv Method for laser-cutting a CVD diamond slab, and CVD diamond slab thus obtained
KR100475524B1 (en) * 1996-11-27 2005-05-17 삼성전자주식회사 Board Cutting Method

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