JPS5591139A - Production method of and apparatus for semiconductor device - Google Patents
Production method of and apparatus for semiconductor deviceInfo
- Publication number
- JPS5591139A JPS5591139A JP16487478A JP16487478A JPS5591139A JP S5591139 A JPS5591139 A JP S5591139A JP 16487478 A JP16487478 A JP 16487478A JP 16487478 A JP16487478 A JP 16487478A JP S5591139 A JPS5591139 A JP S5591139A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- film
- high pressure
- dice
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE: To improve the production yield by grooving the wafer to the half way with a scribing after water-jet washing under a high pressure exceeding 20kg/cm2 before final division by the mechamical stress, when the wafer having elements thereon is divided into dice.
CONSTITUTION: An electrode wiring Al film 22 is applied on a semiconductor wafer 21 having a plurality of elements thereon and entirely covered with an SiO2 film 23 to protect thereof. Then, for division into dice, the wafer 21 is grooved to the half way one line at a time along the scribe line employing a diamond cutter or a laser beam. Spallings 25 of the wafer yielded on the film 23 is completely by a jet scrubber or a high pressure scrubber using a high pressure water exceeding 20kg/cm2. Thereafter, after dried by blowing hot air or the like, the wafer is broken on a sheet with a roller or the like. This makes the divided pellets sufficiently clean eliminating troubles due to a short- circuit or the like.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16487478A JPS5591139A (en) | 1978-12-27 | 1978-12-27 | Production method of and apparatus for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16487478A JPS5591139A (en) | 1978-12-27 | 1978-12-27 | Production method of and apparatus for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5591139A true JPS5591139A (en) | 1980-07-10 |
Family
ID=15801554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16487478A Pending JPS5591139A (en) | 1978-12-27 | 1978-12-27 | Production method of and apparatus for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5591139A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9400164A (en) * | 1994-02-03 | 1995-09-01 | Drukker Int Bv | Method for laser-cutting a CVD diamond slab, and CVD diamond slab thus obtained |
EP0624423A3 (en) * | 1993-05-11 | 1996-02-14 | Gen Electric | Method of separation of pieces from super hard material. |
KR100475524B1 (en) * | 1996-11-27 | 2005-05-17 | 삼성전자주식회사 | Board Cutting Method |
-
1978
- 1978-12-27 JP JP16487478A patent/JPS5591139A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0624423A3 (en) * | 1993-05-11 | 1996-02-14 | Gen Electric | Method of separation of pieces from super hard material. |
NL9400164A (en) * | 1994-02-03 | 1995-09-01 | Drukker Int Bv | Method for laser-cutting a CVD diamond slab, and CVD diamond slab thus obtained |
KR100475524B1 (en) * | 1996-11-27 | 2005-05-17 | 삼성전자주식회사 | Board Cutting Method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2965006D1 (en) | Method for the selective detection of defects, caused by polishing, on the surface of silicon wafers | |
JPS5591139A (en) | Production method of and apparatus for semiconductor device | |
JPS5434751A (en) | Washing method for silicon wafer | |
JPS57155726A (en) | Manufacture of semiconductor device | |
JPS55102236A (en) | Manufacuturing method of semiconductor device | |
JPS5243360A (en) | Process for production of silicon wafer | |
JPS5238696A (en) | Method and apparatus for yarn-chamfering | |
JPS5245273A (en) | Method for production of semiconductor device | |
JPS5346270A (en) | Production of semiconductor device | |
JPS5315764A (en) | Production of semiconductor device | |
JPS51126760A (en) | Dicing unit | |
JPS5249781A (en) | Process for production of semiconductor device | |
JPS5372295A (en) | Electrical discharge machining method of roll-shaped workpieces | |
JPS5553437A (en) | Semiconductor wafer dividing method and its apparatus | |
JPS5230188A (en) | Process for producing smiconductor device | |
JPS5295167A (en) | Wafer dryer | |
JPS5382174A (en) | Surface processing method for semiconductor device | |
JPS524780A (en) | Manufacturing method of semiconductor equipment | |
JPS5362462A (en) | Production of semiconductor divice | |
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS532074A (en) | Scribing method for semiconductor wafer | |
JPS5259480A (en) | Air conveyor | |
JPS54861A (en) | Scribing method for semiconductor wafer | |
JPS532072A (en) | Manufacture of semiconductor | |
JPS51151072A (en) | Manufacturing method of a silicon semiconductor |