JPS5588052A - Developing method for negative type resist - Google Patents
Developing method for negative type resistInfo
- Publication number
- JPS5588052A JPS5588052A JP16151978A JP16151978A JPS5588052A JP S5588052 A JPS5588052 A JP S5588052A JP 16151978 A JP16151978 A JP 16151978A JP 16151978 A JP16151978 A JP 16151978A JP S5588052 A JPS5588052 A JP S5588052A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- pattern
- ray
- negative type
- exposed area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
PURPOSE:To form the same pattern as that of a masking material on a resist material, by performing plasma etching treatment in an atmosphere consisting mainly of oxygen following the development processing in a process for forming a pattern on a negative type resist material by X-ray, ultraviolet ray, or the like. CONSTITUTION:A pattern is formed on resist material 2 by irradiating this on substrate 1 through masking material 4 formed patternwise on mask substrate 3 of glass or quartz by X-ray, electron beam, ultraviolet ray, or the like. After processing material 2 in a developing solution by wet development, it undergoes etching treatment in an atmosphere consisting mainly of oxygen, resulting in removing exposed area 8 of resist 2 of small resist thickness due to Fresnel's diffraction caused by passing of the ray through the pattern and leaving only usual exposed area 7 of large resist thickness, thus permitting the mask pattern to be transferred to resist 2 in high fidelity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16151978A JPS5588052A (en) | 1978-12-26 | 1978-12-26 | Developing method for negative type resist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16151978A JPS5588052A (en) | 1978-12-26 | 1978-12-26 | Developing method for negative type resist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5588052A true JPS5588052A (en) | 1980-07-03 |
Family
ID=15736608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16151978A Pending JPS5588052A (en) | 1978-12-26 | 1978-12-26 | Developing method for negative type resist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5588052A (en) |
-
1978
- 1978-12-26 JP JP16151978A patent/JPS5588052A/en active Pending
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