JPS558082A - Multi-wiring semiconductor device - Google Patents
Multi-wiring semiconductor deviceInfo
- Publication number
- JPS558082A JPS558082A JP8131278A JP8131278A JPS558082A JP S558082 A JPS558082 A JP S558082A JP 8131278 A JP8131278 A JP 8131278A JP 8131278 A JP8131278 A JP 8131278A JP S558082 A JPS558082 A JP S558082A
- Authority
- JP
- Japan
- Prior art keywords
- dimension
- wire
- length direction
- hole section
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To improve greatly an integrated wiring capacity by differentiating a size an a two-phase insulating film at a length direction of the above-phase wire and by making same dimension at the width direction.
CONSTITUTION: An above-phase wire 3 is formed being adjacent to the first through-hole section which opens the first phase insulating film and the second through-hole section which opens the second phase insulating films. The dimension of the through-hole section 1 wire's width direction in W1, that of its length direction W2, that of the through-hole 2 width direction W3 and that of its length direction W4. The dimension relation is W1=W3, W2>W4. Thus, the above wire's width W5can wiring pitch W2 can maintain the dimension in the through-hole section to make a wiring pitch small and a wiring accumulation improve. Burning out of the above wire can be avoided by making the dimension of the length direction W2>W4.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8131278A JPS558082A (en) | 1978-07-03 | 1978-07-03 | Multi-wiring semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8131278A JPS558082A (en) | 1978-07-03 | 1978-07-03 | Multi-wiring semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS558082A true JPS558082A (en) | 1980-01-21 |
JPS6211505B2 JPS6211505B2 (en) | 1987-03-12 |
Family
ID=13742872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8131278A Granted JPS558082A (en) | 1978-07-03 | 1978-07-03 | Multi-wiring semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558082A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5769759A (en) * | 1980-10-20 | 1982-04-28 | Seiko Epson Corp | Semiconductor device |
JPS60175308U (en) * | 1984-04-27 | 1985-11-20 | パイオニア株式会社 | Car stereo equipment |
JPH0277139A (en) * | 1989-07-31 | 1990-03-16 | Toshiba Corp | Semiconductor device |
-
1978
- 1978-07-03 JP JP8131278A patent/JPS558082A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5769759A (en) * | 1980-10-20 | 1982-04-28 | Seiko Epson Corp | Semiconductor device |
JPS60175308U (en) * | 1984-04-27 | 1985-11-20 | パイオニア株式会社 | Car stereo equipment |
JPH0277139A (en) * | 1989-07-31 | 1990-03-16 | Toshiba Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6211505B2 (en) | 1987-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS558082A (en) | Multi-wiring semiconductor device | |
JPS5363871A (en) | Production of semiconductor device | |
JPS5348670A (en) | Electrode structure of semiconductor element | |
JPS52102691A (en) | Formation of wiring on insulating layer having steps | |
JPS5271978A (en) | Production of semiconductor device | |
JPS52129380A (en) | Semiconductor device | |
JPS5380183A (en) | Semiconductor device | |
JPS54152961A (en) | Semiconductor device | |
JPS52124884A (en) | Production of semiconductor device | |
JPS5326668A (en) | Connection for electronic parts | |
JPS533085A (en) | Production of semiconductor integrated circuit | |
JPS5333077A (en) | Semiconductor integrated circuit | |
JPS5268388A (en) | Semiconductor integrated circuit | |
JPS5462782A (en) | Package method of semiconductor device | |
JPS5317274A (en) | Electrode structure of semiconductor element | |
JPS5432269A (en) | Manufacture for semiconductor device | |
JPS5355992A (en) | Semiconductor device | |
JPS5349972A (en) | Manufacture of semiconductor device | |
JPS5367386A (en) | Semiconductor device | |
JPS52155986A (en) | Semiconductor device | |
JPS5321567A (en) | Connecting terminals of semiconductor devices | |
JPS5513981A (en) | Semiconductor device | |
JPS5353989A (en) | Production of semiconductor device | |
JPS5328390A (en) | Light receiving semicond uctor device | |
JPS5239189A (en) | Manufacturing method of termination processed tape shaped wire |