JPS5579899A - Plating device - Google Patents

Plating device

Info

Publication number
JPS5579899A
JPS5579899A JP15339878A JP15339878A JPS5579899A JP S5579899 A JPS5579899 A JP S5579899A JP 15339878 A JP15339878 A JP 15339878A JP 15339878 A JP15339878 A JP 15339878A JP S5579899 A JPS5579899 A JP S5579899A
Authority
JP
Japan
Prior art keywords
plating
cell
way
solution level
holding jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15339878A
Other languages
Japanese (ja)
Other versions
JPS5931599B2 (en
Inventor
Takao Tokunaga
Shunichi Kamimura
Shigeyuki Nango
Toshinobu Banjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15339878A priority Critical patent/JPS5931599B2/en
Publication of JPS5579899A publication Critical patent/JPS5579899A/en
Publication of JPS5931599B2 publication Critical patent/JPS5931599B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To let selective plating be accomplished automatically without requiring conventional laborious processes by disposing as specified a plating material holding jig having holed parts formed at desired patterns, an anode plate, a plating solution vertically moving means, etc. in a plating cell.
CONSTITUTION: A holding jig 12 which is formed with holed parts 13 at specified patterns by insulating material and which is placed and mounted with the work 9 together with a retainer plate 15 is removably provided to the top of the opening of a plating cell 10 and an anode plate 14 is provided in mutual opposition thereto. An auxiliary plating cell 18 which controls the plating solution level between h1 and h2 by way of a pipe 19 and pump 20 is disposed to the cell 1. With the plating solution level being kept at h2, the voltage is applied between the plating material 9 which is fixed horizontally and the anode 14 by way of leads 16, 17 and selective plating is done according to the hole parts 13. Upon ending of the plating, the solution level is lowered to h1 and the plated material 9 is taken out. In this way, a series of the abovementioned processes are sequentially controlled and their automation is made possible.
COPYRIGHT: (C)1980,JPO&Japio
JP15339878A 1978-12-06 1978-12-06 plating device Expired JPS5931599B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15339878A JPS5931599B2 (en) 1978-12-06 1978-12-06 plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15339878A JPS5931599B2 (en) 1978-12-06 1978-12-06 plating device

Publications (2)

Publication Number Publication Date
JPS5579899A true JPS5579899A (en) 1980-06-16
JPS5931599B2 JPS5931599B2 (en) 1984-08-02

Family

ID=15561614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15339878A Expired JPS5931599B2 (en) 1978-12-06 1978-12-06 plating device

Country Status (1)

Country Link
JP (1) JPS5931599B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384096B (en) * 2008-11-04 2013-02-01 Metal Ind Res & Dev Ct Electrochemical process of the processing electrode, the preparation method and manufacturing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384096B (en) * 2008-11-04 2013-02-01 Metal Ind Res & Dev Ct Electrochemical process of the processing electrode, the preparation method and manufacturing equipment

Also Published As

Publication number Publication date
JPS5931599B2 (en) 1984-08-02

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