JPS5579899A - Plating device - Google Patents
Plating deviceInfo
- Publication number
- JPS5579899A JPS5579899A JP15339878A JP15339878A JPS5579899A JP S5579899 A JPS5579899 A JP S5579899A JP 15339878 A JP15339878 A JP 15339878A JP 15339878 A JP15339878 A JP 15339878A JP S5579899 A JPS5579899 A JP S5579899A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cell
- way
- solution level
- holding jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To let selective plating be accomplished automatically without requiring conventional laborious processes by disposing as specified a plating material holding jig having holed parts formed at desired patterns, an anode plate, a plating solution vertically moving means, etc. in a plating cell.
CONSTITUTION: A holding jig 12 which is formed with holed parts 13 at specified patterns by insulating material and which is placed and mounted with the work 9 together with a retainer plate 15 is removably provided to the top of the opening of a plating cell 10 and an anode plate 14 is provided in mutual opposition thereto. An auxiliary plating cell 18 which controls the plating solution level between h1 and h2 by way of a pipe 19 and pump 20 is disposed to the cell 1. With the plating solution level being kept at h2, the voltage is applied between the plating material 9 which is fixed horizontally and the anode 14 by way of leads 16, 17 and selective plating is done according to the hole parts 13. Upon ending of the plating, the solution level is lowered to h1 and the plated material 9 is taken out. In this way, a series of the abovementioned processes are sequentially controlled and their automation is made possible.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15339878A JPS5931599B2 (en) | 1978-12-06 | 1978-12-06 | plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15339878A JPS5931599B2 (en) | 1978-12-06 | 1978-12-06 | plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5579899A true JPS5579899A (en) | 1980-06-16 |
JPS5931599B2 JPS5931599B2 (en) | 1984-08-02 |
Family
ID=15561614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15339878A Expired JPS5931599B2 (en) | 1978-12-06 | 1978-12-06 | plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5931599B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384096B (en) * | 2008-11-04 | 2013-02-01 | Metal Ind Res & Dev Ct | Electrochemical process of the processing electrode, the preparation method and manufacturing equipment |
-
1978
- 1978-12-06 JP JP15339878A patent/JPS5931599B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384096B (en) * | 2008-11-04 | 2013-02-01 | Metal Ind Res & Dev Ct | Electrochemical process of the processing electrode, the preparation method and manufacturing equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS5931599B2 (en) | 1984-08-02 |
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