JPS5931599B2 - plating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating apparatus using electrodeposition by electrolysis, and particularly to a plating apparatus suitable for performing selective plating.

Conventionally, in this type of plating apparatus, as shown in FIG. By immersing the object 9 in the plating process and applying a voltage with the polarity shown between the object 9 and the anode plate 3, the object 9 to be plated can be immersed using electrodeposition caused by electrolysis of the plating solution 2. The surface of the material is selectively coated with a thin metal layer.

In this case, the object to be plated 9 is held by a hooking jig 4, and this jig 4 is fixed to a support rod 05.
Reference numeral 6 denotes support rods for fixing the anode plate 3, and a predetermined voltage is supplied to these support rods 5 and 6 from a power source (not shown) via lead wires.

However, in such plating equipment, when performing selective plating, it is necessary to cover the parts that are not to be plated with an insulating material T such as vinyl tape with adhesive, which is a cumbersome process. It also had the disadvantage of being time consuming.

Furthermore, each time plating is performed, the object to be plated 9 held by the hooking jig 4 must be taken in and out of the plating tank 1, which impairs the workability. The present invention has been made in order to eliminate the drawbacks of the conventional apparatus as described above, and its purpose is to provide a plating apparatus that can perform plating easily and automatically. In order to achieve this purpose,
The present invention provides a holding jig to hold the object to be plated horizontally on the upper surface of a plating tank containing a plating solution, and an anode plate is arranged in the plating tank opposite to this holding jig, The plating liquid is brought into contact with the surface of the object to be plated by moving the liquid level of the plating liquid up and down and applying a voltage between the object to be plated placed on the holding jig and the anode plate. The plating is performed in a state where the

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a basic configuration diagram showing an embodiment of a plating device according to the present invention.

In FIG. 2, 10 is a plating tank in which plating liquid 11 is stored at a predetermined height, and 12 is a mask jig as a holding jig that is detachably fixed to the upper part of the opening of the plating tank 10. The jig 12 has perforations 13 formed in a predetermined pattern made of an insulating material, and is mounted so that the object 9 to be plated can be placed horizontally. 14 is an anode plate installed in the plating tank 10 facing the mask jig 12; 15 is a presser plate for pressing the object to be plated 9 placed on the mask jig 12; The plate 15 is supported so as to move up and down in the direction of the arrow shown.

A pair of leads 16 and 17 are provided between the object to be plated 9 and the anode plate 14 to supply a predetermined voltage from a power source (not shown), and 18 is at the same height as the plating tank 10 and has an open top surface. This auxiliary plating tank 18 is communicated with the plating tank 10 through a communication pipe 19.

20 is a pump for transferring the plating liquid in the auxiliary plating tank 18 to the plating tank 10;
The communication pipe 19 and the pump 20 raise the liquid level of the plating liquid 11 previously stored in the plating tank 10 from the initial value h1 to H2 when the pump 20 is operated, and return the liquid level to the original position when the pump 20 is stopped. It is configured to return to.

Next, the operation of the above embodiment will be explained.

Here, the amount of the plating liquid 11 is adjusted to a height h1 so as not to come into contact with the mask jig 12 attached to the upper surface of the plating tank 10, and the liquid level is controlled by the communication pipe 19 to the auxiliary plating tank. It is assumed that the liquid level is maintained at the same level as 18. first,
A predetermined mask jig 12 is attached to the top surface of the plating tank 10,
After placing the object 9 to be plated on the mask jig 12, the object 9 to be plated is pressed by the presser plate 15, and the mask jig 1
2. Fix horizontally on top. Next, the object to be plated 9 and the anode plate 1
When the pump 20 is driven after applying a voltage with the illustrated polarity through each lead 16 and 17 during the period 4, the plating liquid 11 in the auxiliary plating tank 18 is transferred into the plating tank 10 by the pump 20. , the level of the plating liquid 11 in the plating tank 10 rises. At this time, the liquid level is at a height H2
When the plating liquid 11 reaches this point, the plating liquid 11 comes into contact with the surface of the object 9 to be plated through the perforation 13 formed in the mask jig 12, and as a result, the surface of the object 9 to be plated is coated with electrolysis of the plating liquid. Plating is selectively performed according to the perforations 13 of the mask jig 12. After this plating is completed, the voltage applied between the object to be plated 9 and the anode plate 14 is cut off, and the pump 2
When the drive of the plating tank 10 is stopped, the plating liquid level in the plating tank 10 drops and returns to its original position, and at the same time, by raising the holding plate 15, the object to be plated 9 is removed and replaced. It will be done. Therefore, by controlling such a series of processes in a sequence, automation can be easily performed, and compared to the conventional immersion method, it is easier to take the objects to be plated into and out of the plating tank, and to control the objects to be plated. Since there is no need to cover the insulator with adhesive or the like, it is possible to save labor in the plating process. Note that if a soluble material is used as the anode plate 14, the precipitated metal ions are replenished, so there is no need to replenish the metal salt from the outside.

In the above embodiment, the case of selective plating was described, but
It goes without saying that the present invention can be applied not only to single-sided full-surface plating, but also to acid treatment, alkaline degreasing, and the like.

As described above, according to the present invention, the object to be plated is horizontally fixed on the upper surface of the plating tank, and the level of the plating liquid stored in the plating tank is moved up and down, thereby increasing the plating liquid level. Since the plating is performed by contacting the surface of the object to be plated, automation is possible due to the simple structure, and there is an effect that labor saving in the plating process is achieved.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an example of a conventional plating device, and FIG. 2 is a fundamental diagram showing an embodiment of a plating device according to the present invention. 9...Object to be plated, 10...Plating tank, 11...Plating liquid, 12...Mask jig, 13...Drilling Part, 14... Anode plate, 15... Pressing plate, 16, 17...
Lead, 18...Auxiliary plating tank, 19...
...Communication pipe, 20...Pump.

Claims (1)

[Scope of Claims] 1. A plating tank containing a plating solution, a holding jig provided to horizontally arrange and hold an object to be plated on the upper surface of the opening of the plating tank, and a An anode plate installed opposite to the holding jig, and a means for moving the liquid level of the plating solution up and down, and by applying a voltage between the object to be plated and the anode plate, the plated object can be plated. A plating apparatus characterized in that plating is performed while bringing the plating solution into contact with the surface of an object. 2. The plating apparatus according to claim 1, wherein the holding jig has perforations formed in a desired pattern.