JPS5576064A - Monitor unit for continuous formation of multi-layer coating - Google Patents

Monitor unit for continuous formation of multi-layer coating

Info

Publication number
JPS5576064A
JPS5576064A JP14801978A JP14801978A JPS5576064A JP S5576064 A JPS5576064 A JP S5576064A JP 14801978 A JP14801978 A JP 14801978A JP 14801978 A JP14801978 A JP 14801978A JP S5576064 A JPS5576064 A JP S5576064A
Authority
JP
Japan
Prior art keywords
substrate
coating
hole
thickness
metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14801978A
Other languages
Japanese (ja)
Inventor
Hiroki Nakajima
Masao Ichiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14801978A priority Critical patent/JPS5576064A/en
Publication of JPS5576064A publication Critical patent/JPS5576064A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Filters (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make it possible to monitor and to measure the thickness of coating easily and correctly, by installing a making means between a rotatable holder provided with plural sample- attaching holes in circumferential direction and an evaporation source for coating material, the masking means shielding the portions excepting the sample-attaching holes. CONSTITUTION:A substrate 16 made of, e.g., glass etc. is placed on each of sample-attaching holes 83... made in a rotatable holder 8, then a motor 13 is operated so as to position a predetermined hole 83 on a mask hole 15. Monochromic light is irradiated on the substrate 16 placed on the hole 15 through a window 17 of a bell jar 3, and the reflected light thereof is detected by a light detector S1 or the transmitted light thereof is detected by another light detector S2. Vacuum metallizing on the substrate 5 is conducted while monitoring the thickness of the metallized coating. Hereby, when the thickness of the first coating is increased to a predetermined thickness, more formation of coating on the substrate 5 and 16 is prevented by closing a shutter or by other means. Then the holder 8 is rotated by one pitch, and the substrate 16 on the hole 83 is transferred to the hole 15, simultaneously, the evaporation material is changed and the second coating is metallized while being monitored. Similarly, the holder 8 is driven after completion of metallizing of each layer so as to renew the substrate 16, and metallizing is conducted while being monitored.
JP14801978A 1978-11-30 1978-11-30 Monitor unit for continuous formation of multi-layer coating Pending JPS5576064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14801978A JPS5576064A (en) 1978-11-30 1978-11-30 Monitor unit for continuous formation of multi-layer coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14801978A JPS5576064A (en) 1978-11-30 1978-11-30 Monitor unit for continuous formation of multi-layer coating

Publications (1)

Publication Number Publication Date
JPS5576064A true JPS5576064A (en) 1980-06-07

Family

ID=15443278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14801978A Pending JPS5576064A (en) 1978-11-30 1978-11-30 Monitor unit for continuous formation of multi-layer coating

Country Status (1)

Country Link
JP (1) JPS5576064A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188225A (en) * 1986-02-13 1987-08-17 Rohm Co Ltd Sputtering method
FR2816714A1 (en) * 2000-11-16 2002-05-17 Shakticom Optical filter thin layer deposition method having thin deposition layers several substrates deposited and luminous beams produced optically controlling substrate thickness

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035075A (en) * 1973-08-01 1975-04-03
JPS5135679A (en) * 1974-09-21 1976-03-26 Ulvac Corp TASOSUMAKUKEISEISOCHINIOKERU MAKUATSUKANSHISOCHI
JPS54131578A (en) * 1978-04-05 1979-10-12 Ulvac Corp Monitoring device for continuous film former

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035075A (en) * 1973-08-01 1975-04-03
JPS5135679A (en) * 1974-09-21 1976-03-26 Ulvac Corp TASOSUMAKUKEISEISOCHINIOKERU MAKUATSUKANSHISOCHI
JPS54131578A (en) * 1978-04-05 1979-10-12 Ulvac Corp Monitoring device for continuous film former

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188225A (en) * 1986-02-13 1987-08-17 Rohm Co Ltd Sputtering method
FR2816714A1 (en) * 2000-11-16 2002-05-17 Shakticom Optical filter thin layer deposition method having thin deposition layers several substrates deposited and luminous beams produced optically controlling substrate thickness
WO2002040737A1 (en) * 2000-11-16 2002-05-23 Highwave Optical Technologies Marseille Method and device for depositing thin films
US6620249B2 (en) 2000-11-16 2003-09-16 Highwave Optical Technologies Method and apparatus for depositing thin layers

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