JPS5562680A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS5562680A
JPS5562680A JP10416679A JP10416679A JPS5562680A JP S5562680 A JPS5562680 A JP S5562680A JP 10416679 A JP10416679 A JP 10416679A JP 10416679 A JP10416679 A JP 10416679A JP S5562680 A JPS5562680 A JP S5562680A
Authority
JP
Japan
Prior art keywords
wire
conductor
applying
wire bonding
bonding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10416679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5642114B2 (cg-RX-API-DMAC10.html
Inventor
Chiyaudari Purabiin
Buratsudofuoodo Kiizurin Jiyon
Yakobu Paaruman Deebitsudo
Edowaado Teinan Yuujin
Yakobu Fuon Gatsutofue Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5562680A publication Critical patent/JPS5562680A/ja
Publication of JPS5642114B2 publication Critical patent/JPS5642114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H10W72/07125—
    • H10W72/07535—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/952—
    • H10W74/00—

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10416679A 1978-10-31 1979-08-17 Wire bonding method Granted JPS5562680A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95615878A 1978-10-31 1978-10-31

Publications (2)

Publication Number Publication Date
JPS5562680A true JPS5562680A (en) 1980-05-12
JPS5642114B2 JPS5642114B2 (cg-RX-API-DMAC10.html) 1981-10-02

Family

ID=25497833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10416679A Granted JPS5562680A (en) 1978-10-31 1979-08-17 Wire bonding method

Country Status (5)

Country Link
EP (1) EP0010610B1 (cg-RX-API-DMAC10.html)
JP (1) JPS5562680A (cg-RX-API-DMAC10.html)
CA (1) CA1135871A (cg-RX-API-DMAC10.html)
DE (1) DE2965205D1 (cg-RX-API-DMAC10.html)
IT (1) IT1165447B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3370240D1 (en) * 1982-12-06 1987-04-16 Welding Inst Bonding leads to semiconductor devices
JPS60500204A (ja) * 1983-01-24 1985-02-21 フオ−ド　モ−タ−　カンパニ− レ−ザはんだ付け法
IT1195117B (it) * 1986-08-01 1988-10-12 Vallko Srl Tettuccio apribile di autoveicolo
US4928384A (en) * 1987-03-24 1990-05-29 Cooper Industries, Inc. Method of making a wire bonded microfuse
US5093988A (en) * 1991-01-24 1992-03-10 Kohler Co. Method for attaching a flexible connector
DE69430151T2 (de) * 1993-05-21 2002-08-22 Toyota Jidosha K.K., Toyota Laserschweissverfahren
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung

Also Published As

Publication number Publication date
EP0010610B1 (fr) 1983-04-13
IT7926086A0 (it) 1979-09-28
CA1135871A (en) 1982-11-16
JPS5642114B2 (cg-RX-API-DMAC10.html) 1981-10-02
IT1165447B (it) 1987-04-22
EP0010610A1 (fr) 1980-05-14
DE2965205D1 (en) 1983-05-19

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