JPS5561349A - Resin mold model and production thereof - Google Patents

Resin mold model and production thereof

Info

Publication number
JPS5561349A
JPS5561349A JP13405078A JP13405078A JPS5561349A JP S5561349 A JPS5561349 A JP S5561349A JP 13405078 A JP13405078 A JP 13405078A JP 13405078 A JP13405078 A JP 13405078A JP S5561349 A JPS5561349 A JP S5561349A
Authority
JP
Japan
Prior art keywords
layer
melting point
low melting
mold
point alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13405078A
Other languages
Japanese (ja)
Inventor
Takehisa Nishimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP13405078A priority Critical patent/JPS5561349A/en
Publication of JPS5561349A publication Critical patent/JPS5561349A/en
Pending legal-status Critical Current

Links

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  • Molds, Cores, And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE: To greatly increase the durability of model, by forming a low melting point alloy layer on the surface of a resin mold model.
CONSTITUTION: The cavity surface of a negative mold model 5 formed with wooden mold, metal mold, resin mold or the like is spread with a releasing agent such as wax, and a low melting point alloy made from 43% tin and 57% bismuth in molten state is sprayed by a spray gun to form a low melting point alloy layer 1. After spreading a gel coat layer 2, a laminated layer 3 having glass cloth impregnated in epoxy resin or the like is formed, then a backing layer 4 is injected. When each layer is solidified, the resin mold model is taken out from the negative mold 5. The low melting point alloy layer 1 may be formed in a thickness of about 0.2mm. When a plated layer of Ni-P, Ni, Cu, Cr, or the like is further formed on the surface, the wear resistance and releasing properties may be further improved.
COPYRIGHT: (C)1980,JPO&Japio
JP13405078A 1978-10-31 1978-10-31 Resin mold model and production thereof Pending JPS5561349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13405078A JPS5561349A (en) 1978-10-31 1978-10-31 Resin mold model and production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13405078A JPS5561349A (en) 1978-10-31 1978-10-31 Resin mold model and production thereof

Publications (1)

Publication Number Publication Date
JPS5561349A true JPS5561349A (en) 1980-05-09

Family

ID=15119186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13405078A Pending JPS5561349A (en) 1978-10-31 1978-10-31 Resin mold model and production thereof

Country Status (1)

Country Link
JP (1) JPS5561349A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152347U (en) * 1981-03-17 1982-09-24
JPH04125671U (en) * 1991-05-08 1992-11-16 日興電機工業株式会社 starter protection device
GB2575045A (en) * 2018-06-25 2020-01-01 Rawwater Engineering Company Ltd Sealing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152347U (en) * 1981-03-17 1982-09-24
JPH04125671U (en) * 1991-05-08 1992-11-16 日興電機工業株式会社 starter protection device
GB2575045A (en) * 2018-06-25 2020-01-01 Rawwater Engineering Company Ltd Sealing device
GB2575045B (en) * 2018-06-25 2022-12-21 Rawwater Engineering Company Ltd Sealing device

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