JPS5561336A - Production of circuit pattern blanking die - Google Patents
Production of circuit pattern blanking dieInfo
- Publication number
- JPS5561336A JPS5561336A JP13278578A JP13278578A JPS5561336A JP S5561336 A JPS5561336 A JP S5561336A JP 13278578 A JP13278578 A JP 13278578A JP 13278578 A JP13278578 A JP 13278578A JP S5561336 A JPS5561336 A JP S5561336A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- etching
- circuit pattern
- negative
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE: To etch easily without requiring complicated processes such as filling and removing of acidproof resin, by forming etching resists of lower layer and upper layer differing in properties by means of circuit pattern photo masks.
CONSTITUTION: From one original drawing, photo masks A3 and A4 corresponding to desired circuit pattern are made by varying the amount of exposure by using a camera for photomechanical process. An organic solvent type photo resist of negative-positive type is spread and printed on a metal negative 22, and the mask A3 is put there on to form an etching resist 23. Then, a water soluble photo resist of negative-positive type is spread and printed thereon, and the mask A4 is put on it to form a resist 24. After etching deeply, the resist 24 is released by using a releasing agent such as aqueous solution of caustic soda. Next, after etching shallowly, the resist 23 is released by using a special releasing agent, and a desired die may be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13278578A JPS5810990B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13278578A JPS5810990B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5561336A true JPS5561336A (en) | 1980-05-09 |
JPS5810990B2 JPS5810990B2 (en) | 1983-02-28 |
Family
ID=15089478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13278578A Expired JPS5810990B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5810990B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62181628U (en) * | 1986-05-02 | 1987-11-18 |
-
1978
- 1978-10-27 JP JP13278578A patent/JPS5810990B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5810990B2 (en) | 1983-02-28 |
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