JPS5561336A - Production of circuit pattern blanking die - Google Patents

Production of circuit pattern blanking die

Info

Publication number
JPS5561336A
JPS5561336A JP13278578A JP13278578A JPS5561336A JP S5561336 A JPS5561336 A JP S5561336A JP 13278578 A JP13278578 A JP 13278578A JP 13278578 A JP13278578 A JP 13278578A JP S5561336 A JPS5561336 A JP S5561336A
Authority
JP
Japan
Prior art keywords
resist
etching
circuit pattern
negative
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13278578A
Other languages
Japanese (ja)
Other versions
JPS5810990B2 (en
Inventor
Yoshihisa Takase
Kunio Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP13278578A priority Critical patent/JPS5810990B2/en
Publication of JPS5561336A publication Critical patent/JPS5561336A/en
Publication of JPS5810990B2 publication Critical patent/JPS5810990B2/en
Expired legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE: To etch easily without requiring complicated processes such as filling and removing of acidproof resin, by forming etching resists of lower layer and upper layer differing in properties by means of circuit pattern photo masks.
CONSTITUTION: From one original drawing, photo masks A3 and A4 corresponding to desired circuit pattern are made by varying the amount of exposure by using a camera for photomechanical process. An organic solvent type photo resist of negative-positive type is spread and printed on a metal negative 22, and the mask A3 is put there on to form an etching resist 23. Then, a water soluble photo resist of negative-positive type is spread and printed thereon, and the mask A4 is put on it to form a resist 24. After etching deeply, the resist 24 is released by using a releasing agent such as aqueous solution of caustic soda. Next, after etching shallowly, the resist 23 is released by using a special releasing agent, and a desired die may be obtained.
COPYRIGHT: (C)1980,JPO&Japio
JP13278578A 1978-10-27 1978-10-27 Manufacturing method for circuit pattern punching mold Expired JPS5810990B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13278578A JPS5810990B2 (en) 1978-10-27 1978-10-27 Manufacturing method for circuit pattern punching mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13278578A JPS5810990B2 (en) 1978-10-27 1978-10-27 Manufacturing method for circuit pattern punching mold

Publications (2)

Publication Number Publication Date
JPS5561336A true JPS5561336A (en) 1980-05-09
JPS5810990B2 JPS5810990B2 (en) 1983-02-28

Family

ID=15089478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13278578A Expired JPS5810990B2 (en) 1978-10-27 1978-10-27 Manufacturing method for circuit pattern punching mold

Country Status (1)

Country Link
JP (1) JPS5810990B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62181628U (en) * 1986-05-02 1987-11-18

Also Published As

Publication number Publication date
JPS5810990B2 (en) 1983-02-28

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