JPS5553450A - Semiconductor device with resin enclosure - Google Patents

Semiconductor device with resin enclosure

Info

Publication number
JPS5553450A
JPS5553450A JP12624778A JP12624778A JPS5553450A JP S5553450 A JPS5553450 A JP S5553450A JP 12624778 A JP12624778 A JP 12624778A JP 12624778 A JP12624778 A JP 12624778A JP S5553450 A JPS5553450 A JP S5553450A
Authority
JP
Japan
Prior art keywords
tab
hole
semiconductor device
resin enclosure
occurence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12624778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249742B2 (oth
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12624778A priority Critical patent/JPS5553450A/ja
Publication of JPS5553450A publication Critical patent/JPS5553450A/ja
Publication of JPS6249742B2 publication Critical patent/JPS6249742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP12624778A 1978-10-16 1978-10-16 Semiconductor device with resin enclosure Granted JPS5553450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12624778A JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12624778A JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Publications (2)

Publication Number Publication Date
JPS5553450A true JPS5553450A (en) 1980-04-18
JPS6249742B2 JPS6249742B2 (oth) 1987-10-21

Family

ID=14930433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12624778A Granted JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Country Status (1)

Country Link
JP (1) JPS5553450A (oth)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
JPS619840U (ja) * 1984-02-24 1986-01-21 新電元工業株式会社 樹脂封止型半導体装置
JPS6280342U (oth) * 1985-11-08 1987-05-22
JPS6329956U (oth) * 1986-08-08 1988-02-27
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
US4884124A (en) * 1986-08-19 1989-11-28 Mitsubishi Denki Kabushiki Kaisha Resin-encapsulated semiconductor device
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
US5023699A (en) * 1980-09-01 1991-06-11 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5583381A (en) * 1980-09-01 1996-12-10 Hitachi, Ltd. Resin molded type-semiconductor device having a conductor film
US5753969A (en) * 1995-08-15 1998-05-19 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US5986333A (en) * 1997-02-27 1999-11-16 Oki Electric Industry Co., Ltd. Semiconductor apparatus and method for fabricating the same
US6844615B1 (en) * 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583381A (en) * 1980-09-01 1996-12-10 Hitachi, Ltd. Resin molded type-semiconductor device having a conductor film
US5023699A (en) * 1980-09-01 1991-06-11 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
US5010390A (en) * 1983-08-31 1991-04-23 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
JPS619840U (ja) * 1984-02-24 1986-01-21 新電元工業株式会社 樹脂封止型半導体装置
JPS6280342U (oth) * 1985-11-08 1987-05-22
JPS6329956U (oth) * 1986-08-08 1988-02-27
US4884124A (en) * 1986-08-19 1989-11-28 Mitsubishi Denki Kabushiki Kaisha Resin-encapsulated semiconductor device
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
US5753969A (en) * 1995-08-15 1998-05-19 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US6326243B1 (en) * 1995-08-15 2001-12-04 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US5986333A (en) * 1997-02-27 1999-11-16 Oki Electric Industry Co., Ltd. Semiconductor apparatus and method for fabricating the same
US6844615B1 (en) * 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices

Also Published As

Publication number Publication date
JPS6249742B2 (oth) 1987-10-21

Similar Documents

Publication Publication Date Title
JPS5553450A (en) Semiconductor device with resin enclosure
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS5343477A (en) Semiconductor device
JPS53134062A (en) Multi-layer molded artice, its molding and device
JPS5347164A (en) Washing machine
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS5329459A (en) Lublicant to be used when manufacturing zinc can for dry battery
JPS5275180A (en) Package for integrated circuits
JPS5380000A (en) Process for curing epoxy compound
JPS51112273A (en) Lead frame for resin mold type semiconductor device
GB890771A (en) A building element for making model building structures
JPS53104171A (en) Mold for semiconductor device
JPS5387173A (en) Molding mold
JPS5636145A (en) Thin semiconductor integrated circuit device and its manufacture
JPS538570A (en) Semiconductor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS6425445A (en) Resin-sealed electronic component device
JPS5394368A (en) Structure of mold of buss part in plastic molded products
JPS5380970A (en) Manufacture of resin shield type semiconductor device
JPS5332674A (en) Sealing structure of semiconductor device and its production
JPS5363980A (en) Semiconductor device
JPS5329463A (en) Lublicant to be used when manufacturing zinc can for dry battery
JPS53147765A (en) Resin injection molding
JPS52106678A (en) Resin sealed type semiconductor device
JPS5721843A (en) Semiconductor device