JPS5551845B2 - - Google Patents

Info

Publication number
JPS5551845B2
JPS5551845B2 JP7565177A JP7565177A JPS5551845B2 JP S5551845 B2 JPS5551845 B2 JP S5551845B2 JP 7565177 A JP7565177 A JP 7565177A JP 7565177 A JP7565177 A JP 7565177A JP S5551845 B2 JPS5551845 B2 JP S5551845B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7565177A
Other versions
JPS535098A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS535098A publication Critical patent/JPS535098A/ja
Publication of JPS5551845B2 publication Critical patent/JPS5551845B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
JP7565177A 1976-07-02 1977-06-27 Process for preparing silicon dioxide Granted JPS535098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2629709A DE2629709C2 (de) 1976-07-02 1976-07-02 Verfahren zur Herstellung eines metallionenfreien amorphen Siliciumdioxids und daraus hergestelltes Poliermittel zum mechanischen Polieren von Halbleiteroberflächen

Publications (2)

Publication Number Publication Date
JPS535098A JPS535098A (en) 1978-01-18
JPS5551845B2 true JPS5551845B2 (ja) 1980-12-26

Family

ID=5982012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7565177A Granted JPS535098A (en) 1976-07-02 1977-06-27 Process for preparing silicon dioxide

Country Status (7)

Country Link
US (1) US4117093A (ja)
JP (1) JPS535098A (ja)
CA (1) CA1106143A (ja)
DE (1) DE2629709C2 (ja)
FR (1) FR2356595A1 (ja)
GB (1) GB1540798A (ja)
IT (1) IT1114887B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4421527A (en) * 1977-12-20 1983-12-20 J. M. Huber Corporation High fluoride compatibility dentifrice abrasives and compositions
US4169337A (en) * 1978-03-30 1979-10-02 Nalco Chemical Company Process for polishing semi-conductor materials
AT391122B (de) * 1978-05-24 1990-08-27 Grace W R & Co Verfahren zur herstellung eines siliciumdioxidhydrogels
DE2909930C2 (de) * 1979-03-14 1984-05-10 Basf Ag, 6700 Ludwigshafen Neue kristalline SiO↓2↓-Modifikation und Verfahren zu ihrer Herstellung
JPS5845050B2 (ja) * 1979-12-28 1983-10-06 富士通株式会社 バス集中監視方式
JPS5696310A (en) * 1979-12-28 1981-08-04 Fujitsu Ltd Centralized control system of bus
AU568400B2 (en) * 1983-08-31 1987-12-24 E.I. Du Pont De Nemours And Company Preparation of silica polymorphs from silicon
JPS6244855A (ja) * 1985-08-22 1987-02-26 Panafacom Ltd メモリ・アクセス制御方式
JPH0686144U (ja) * 1991-10-01 1994-12-13 株式会社ピーエフユー メモリ・アクセス制御装置
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
FR2761629B1 (fr) * 1997-04-07 1999-06-18 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
AU7147798A (en) * 1997-04-23 1998-11-13 Advanced Chemical Systems International, Inc. Planarization compositions for cmp of interlayer dielectrics
DE10060343A1 (de) * 2000-12-04 2002-06-06 Bayer Ag Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen
US7001827B2 (en) * 2003-04-15 2006-02-21 International Business Machines Corporation Semiconductor wafer front side protection
JP5972660B2 (ja) * 2012-03-28 2016-08-17 株式会社アドマテックス コロイドシリカの製造方法及びｃｍｐ用スラリーの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744001A (en) * 1950-09-08 1956-05-01 Rare Earths Inc Polishing material and method of making same
NL213258A (ja) * 1955-12-22
US3208823A (en) * 1958-10-20 1965-09-28 Philadelphia Quartz Co Finely divided silica product and its method of preparation
US3715842A (en) * 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
US3922393A (en) * 1974-07-02 1975-11-25 Du Pont Process for polishing silicon and germanium semiconductor materials

Also Published As

Publication number Publication date
FR2356595A1 (fr) 1978-01-27
US4117093A (en) 1978-09-26
CA1106143A (en) 1981-08-04
IT1114887B (it) 1986-01-27
DE2629709A1 (de) 1978-01-05
GB1540798A (en) 1979-02-14
FR2356595B1 (ja) 1979-03-09
JPS535098A (en) 1978-01-18
DE2629709C2 (de) 1982-06-03

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