JPS5541767A - Fixing semiconductor wafer to jig - Google Patents

Fixing semiconductor wafer to jig

Info

Publication number
JPS5541767A
JPS5541767A JP11535078A JP11535078A JPS5541767A JP S5541767 A JPS5541767 A JP S5541767A JP 11535078 A JP11535078 A JP 11535078A JP 11535078 A JP11535078 A JP 11535078A JP S5541767 A JPS5541767 A JP S5541767A
Authority
JP
Japan
Prior art keywords
jig
wax
resin
stuck
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11535078A
Other languages
Japanese (ja)
Inventor
Yukio Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11535078A priority Critical patent/JPS5541767A/en
Publication of JPS5541767A publication Critical patent/JPS5541767A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To prevent the degradation of pressure resistance characteristics, electrical characteristics, and the like by covering the surface of a semiconductor wafer to which a jig is stuck and from which it is removed by the use of wax; and by preventing the contamination generated at the time of said process.
CONSTITUTION: Quick drying resin 4 whose thickness is about 100μm is uniformly applied on the surface of a semiconductor wafer 1. A fixing jig 2 for abrasion is heated to about 80°C and low-melting-point wax 3 is melted on the surface of the jig 2. Then, the surface of the resin 4 on the wafer 1 is pressed onto the wax 3 and closely contacted by cooling them to a room temperature. Thereafter, the specified abrasive process is performed and abrasive material stuck to the jig 2 is removed by sufficiently washing it by water. Then, the jig 2 is heated to 80°C again to melt the wax 3 and remove the wafer 1 with the resin still being stuck thereto. Then, the resin 4 is removed from the wafer 1, together with the wax 3 which is stuck to the resin 4, and ultra-sonic wave cleaning is performed in organic solvent.
COPYRIGHT: (C)1980,JPO&Japio
JP11535078A 1978-09-19 1978-09-19 Fixing semiconductor wafer to jig Pending JPS5541767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11535078A JPS5541767A (en) 1978-09-19 1978-09-19 Fixing semiconductor wafer to jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11535078A JPS5541767A (en) 1978-09-19 1978-09-19 Fixing semiconductor wafer to jig

Publications (1)

Publication Number Publication Date
JPS5541767A true JPS5541767A (en) 1980-03-24

Family

ID=14660339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11535078A Pending JPS5541767A (en) 1978-09-19 1978-09-19 Fixing semiconductor wafer to jig

Country Status (1)

Country Link
JP (1) JPS5541767A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137097U (en) * 1983-03-01 1984-09-12 有限会社佐藤キヤスト decorative body
JPS62203364A (en) * 1986-03-03 1987-09-08 Nec Corp Manufacture of semiconductor device
JPH0278610A (en) * 1988-09-13 1990-03-19 Yukiko Hiyougo Coating agent for preventing dermatitis caused by metallic accessory
JP2012151275A (en) * 2011-01-19 2012-08-09 Disco Abrasive Syst Ltd Resin peeling device and grinding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137097U (en) * 1983-03-01 1984-09-12 有限会社佐藤キヤスト decorative body
JPS62203364A (en) * 1986-03-03 1987-09-08 Nec Corp Manufacture of semiconductor device
JPH0278610A (en) * 1988-09-13 1990-03-19 Yukiko Hiyougo Coating agent for preventing dermatitis caused by metallic accessory
JP2012151275A (en) * 2011-01-19 2012-08-09 Disco Abrasive Syst Ltd Resin peeling device and grinding device

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