JPS5538015A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5538015A
JPS5538015A JP11050278A JP11050278A JPS5538015A JP S5538015 A JPS5538015 A JP S5538015A JP 11050278 A JP11050278 A JP 11050278A JP 11050278 A JP11050278 A JP 11050278A JP S5538015 A JPS5538015 A JP S5538015A
Authority
JP
Japan
Prior art keywords
circuit
wiring
area
macros
base element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11050278A
Other languages
Japanese (ja)
Inventor
Kenichi Ono
Tooru Hosonaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11050278A priority Critical patent/JPS5538015A/en
Publication of JPS5538015A publication Critical patent/JPS5538015A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To improve design of LSI by Master Slice method of a semiconductor IC, consisting of base element assemblies arranged in a matrix-like configuration, by providing freedom for wiring in all the base element assemblies. CONSTITUTION:An assembly of elements, such as transistors and resistors, etc., capable of composing several kinds of base gate circuits, are arranged on a semiconductor base plate within areas 1-5, which are all located in a base element assembly (macros) M. If required, area 1 is provided with an OR/NOR circuit 11 of 2 inputs, area 2 with a 3-input OR/NOR circuit 12 and area 3 and area 4 with one each of 5-input OR/NOR circuit 13. These are formed in respective areas by wiring of the first layer, and a logic circuit is not provided with unnecessary gate circuit because of no availability of wiring. A plurality of macros M like this are provided on the base plate in a matrix-like configuration, and wirings among these macros are to be made by a wiring of the second layer and above so that a required logic circuit becomes obtainable.
JP11050278A 1978-09-08 1978-09-08 Semiconductor integrated circuit Pending JPS5538015A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11050278A JPS5538015A (en) 1978-09-08 1978-09-08 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11050278A JPS5538015A (en) 1978-09-08 1978-09-08 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5538015A true JPS5538015A (en) 1980-03-17

Family

ID=14537383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11050278A Pending JPS5538015A (en) 1978-09-08 1978-09-08 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5538015A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111044A (en) * 1980-12-27 1982-07-10 Fujitsu Ltd Master-slice type lsi device
JPS57196557A (en) * 1981-05-27 1982-12-02 Nec Corp Semiconductor device
JPS58119647A (en) * 1982-01-09 1983-07-16 Ricoh Co Ltd Lsi master slice chip
JPS59127848A (en) * 1983-01-13 1984-07-23 Seiko Epson Corp Semiconductor device
JPH05198784A (en) * 1992-10-19 1993-08-06 Ricoh Co Ltd Lsi master slice chip

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111044A (en) * 1980-12-27 1982-07-10 Fujitsu Ltd Master-slice type lsi device
JPS57196557A (en) * 1981-05-27 1982-12-02 Nec Corp Semiconductor device
JPS58119647A (en) * 1982-01-09 1983-07-16 Ricoh Co Ltd Lsi master slice chip
JPS59127848A (en) * 1983-01-13 1984-07-23 Seiko Epson Corp Semiconductor device
JPH05198784A (en) * 1992-10-19 1993-08-06 Ricoh Co Ltd Lsi master slice chip

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