JPS5538002A - Dicing line monitoring device - Google Patents
Dicing line monitoring deviceInfo
- Publication number
- JPS5538002A JPS5538002A JP10962078A JP10962078A JPS5538002A JP S5538002 A JPS5538002 A JP S5538002A JP 10962078 A JP10962078 A JP 10962078A JP 10962078 A JP10962078 A JP 10962078A JP S5538002 A JPS5538002 A JP S5538002A
- Authority
- JP
- Japan
- Prior art keywords
- line
- dicing
- light
- dicing line
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10962078A JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10962078A JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5538002A true JPS5538002A (en) | 1980-03-17 |
JPS617020B2 JPS617020B2 (US08188275-20120529-C00054.png) | 1986-03-03 |
Family
ID=14514899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10962078A Granted JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5538002A (US08188275-20120529-C00054.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01209104A (ja) * | 1988-02-17 | 1989-08-22 | Disco Abrasive Syst Ltd | 加工装置 |
JP2011222846A (ja) * | 2010-04-13 | 2011-11-04 | Tokyo Seimitsu Co Ltd | ダイシング装置による検査方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0371607U (US08188275-20120529-C00054.png) * | 1989-11-15 | 1991-07-19 | ||
CN103522434A (zh) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | 基于红外技术的晶圆切割在线检测系统 |
-
1978
- 1978-09-08 JP JP10962078A patent/JPS5538002A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01209104A (ja) * | 1988-02-17 | 1989-08-22 | Disco Abrasive Syst Ltd | 加工装置 |
JP2011222846A (ja) * | 2010-04-13 | 2011-11-04 | Tokyo Seimitsu Co Ltd | ダイシング装置による検査方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS617020B2 (US08188275-20120529-C00054.png) | 1986-03-03 |
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