JPS5537229A - Lapping method of wafer - Google Patents

Lapping method of wafer

Info

Publication number
JPS5537229A
JPS5537229A JP10779678A JP10779678A JPS5537229A JP S5537229 A JPS5537229 A JP S5537229A JP 10779678 A JP10779678 A JP 10779678A JP 10779678 A JP10779678 A JP 10779678A JP S5537229 A JPS5537229 A JP S5537229A
Authority
JP
Japan
Prior art keywords
lapping
wafer
sides
simultaneous
warp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10779678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317590B2 (enExample
Inventor
Tsuneo Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP10779678A priority Critical patent/JPS5537229A/ja
Publication of JPS5537229A publication Critical patent/JPS5537229A/ja
Publication of JPS6317590B2 publication Critical patent/JPS6317590B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP10779678A 1978-09-01 1978-09-01 Lapping method of wafer Granted JPS5537229A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10779678A JPS5537229A (en) 1978-09-01 1978-09-01 Lapping method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10779678A JPS5537229A (en) 1978-09-01 1978-09-01 Lapping method of wafer

Publications (2)

Publication Number Publication Date
JPS5537229A true JPS5537229A (en) 1980-03-15
JPS6317590B2 JPS6317590B2 (enExample) 1988-04-14

Family

ID=14468243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10779678A Granted JPS5537229A (en) 1978-09-01 1978-09-01 Lapping method of wafer

Country Status (1)

Country Link
JP (1) JPS5537229A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10210023A1 (de) * 2002-03-07 2003-05-28 Wacker Siltronic Halbleitermat Siliciumscheibe und Verfahren zu ihrer Herstellung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140356U (enExample) * 1974-04-27 1975-11-19
JPS5123896A (en) * 1974-08-21 1976-02-26 Hitachi Electronics Usuitazaino shiagekakohoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140356U (enExample) * 1974-04-27 1975-11-19
JPS5123896A (en) * 1974-08-21 1976-02-26 Hitachi Electronics Usuitazaino shiagekakohoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10210023A1 (de) * 2002-03-07 2003-05-28 Wacker Siltronic Halbleitermat Siliciumscheibe und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
JPS6317590B2 (enExample) 1988-04-14

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