JPS5530951A - Manufacturing of copper-lined insulation substrate - Google Patents

Manufacturing of copper-lined insulation substrate

Info

Publication number
JPS5530951A
JPS5530951A JP10442878A JP10442878A JPS5530951A JP S5530951 A JPS5530951 A JP S5530951A JP 10442878 A JP10442878 A JP 10442878A JP 10442878 A JP10442878 A JP 10442878A JP S5530951 A JPS5530951 A JP S5530951A
Authority
JP
Japan
Prior art keywords
percent
resin
frame body
hardening
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10442878A
Other languages
English (en)
Other versions
JPS6246332B2 (ja
Inventor
Hiroshi Shiba
Katsuhiro Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Graphite Industries Ltd
Original Assignee
Nippon Graphite Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Graphite Industries Ltd filed Critical Nippon Graphite Industries Ltd
Priority to JP10442878A priority Critical patent/JPS5530951A/ja
Publication of JPS5530951A publication Critical patent/JPS5530951A/ja
Publication of JPS6246332B2 publication Critical patent/JPS6246332B2/ja
Granted legal-status Critical Current

Links

JP10442878A 1978-08-29 1978-08-29 Manufacturing of copper-lined insulation substrate Granted JPS5530951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10442878A JPS5530951A (en) 1978-08-29 1978-08-29 Manufacturing of copper-lined insulation substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10442878A JPS5530951A (en) 1978-08-29 1978-08-29 Manufacturing of copper-lined insulation substrate

Publications (2)

Publication Number Publication Date
JPS5530951A true JPS5530951A (en) 1980-03-05
JPS6246332B2 JPS6246332B2 (ja) 1987-10-01

Family

ID=14380401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10442878A Granted JPS5530951A (en) 1978-08-29 1978-08-29 Manufacturing of copper-lined insulation substrate

Country Status (1)

Country Link
JP (1) JPS5530951A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296178A (en) * 1991-12-25 1994-03-22 Chugoku Kako Co., Ltd. Method of making a mold by spraying metal using a particulate mold release agent
EP1023980A1 (en) * 1999-01-28 2000-08-02 Fujifilm Electronic Imaging Limited Method of creating a locating or load bearing surface
CN111761763A (zh) * 2020-05-25 2020-10-13 余姚市远东化工有限公司 一种可以重复脱模的轮胎脱模剂及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296178A (en) * 1991-12-25 1994-03-22 Chugoku Kako Co., Ltd. Method of making a mold by spraying metal using a particulate mold release agent
EP1023980A1 (en) * 1999-01-28 2000-08-02 Fujifilm Electronic Imaging Limited Method of creating a locating or load bearing surface
CN111761763A (zh) * 2020-05-25 2020-10-13 余姚市远东化工有限公司 一种可以重复脱模的轮胎脱模剂及其制备方法
CN111761763B (zh) * 2020-05-25 2022-04-19 余姚市远东化工有限公司 一种可以重复脱模的轮胎脱模剂及其制备方法

Also Published As

Publication number Publication date
JPS6246332B2 (ja) 1987-10-01

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