JPS56120135A - Manufacture of composite integrated circuit - Google Patents

Manufacture of composite integrated circuit

Info

Publication number
JPS56120135A
JPS56120135A JP2354580A JP2354580A JPS56120135A JP S56120135 A JPS56120135 A JP S56120135A JP 2354580 A JP2354580 A JP 2354580A JP 2354580 A JP2354580 A JP 2354580A JP S56120135 A JPS56120135 A JP S56120135A
Authority
JP
Japan
Prior art keywords
substrate
integrated circuit
split
composite integrated
split groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2354580A
Other languages
Japanese (ja)
Inventor
Kiyohiko Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2354580A priority Critical patent/JPS56120135A/en
Publication of JPS56120135A publication Critical patent/JPS56120135A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide highly packed mounting and miniaturization by soldering mountings including external terminals on a substrate, coating the substrate with silicon resin, curing through drying and splitting it along a split groove. CONSTITUTION:A substrate 1 contains a blook 1-a formed in such pattern as to have the effective function of a composite integrated circuit and the edge 1-b of the substrate itself. On this substrate 1, mounting parts 3 including esternal therminals are mounted with solder on each block 1-a. Next, the substrate 1 is coated over together with mounting parts 3 by means of silicon resin 2 modified at viscosity of approximately 3,000 centipoise. Then the coat is cured through drying in an atmosphere at 101-150 deg.C. Later the processed substrate 1 is split by a split groove preset along a boundary 1-c. The resin 2 is also split almost vertically with the split groove, thus providing a completed composite integrated circuit.
JP2354580A 1980-02-27 1980-02-27 Manufacture of composite integrated circuit Pending JPS56120135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2354580A JPS56120135A (en) 1980-02-27 1980-02-27 Manufacture of composite integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2354580A JPS56120135A (en) 1980-02-27 1980-02-27 Manufacture of composite integrated circuit

Publications (1)

Publication Number Publication Date
JPS56120135A true JPS56120135A (en) 1981-09-21

Family

ID=12113437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2354580A Pending JPS56120135A (en) 1980-02-27 1980-02-27 Manufacture of composite integrated circuit

Country Status (1)

Country Link
JP (1) JPS56120135A (en)

Similar Documents

Publication Publication Date Title
BR8105765A (en) PROCESS FOR MANUFACTURING A COATING COMPOSITION, AND FOR COVERING A RIGID SUBSTRATE
AU502251B2 (en) Resin coating metal substrate
US3158503A (en) Metallizing holes
JPS56120135A (en) Manufacture of composite integrated circuit
JPS5650546A (en) Semiconductor device
JPS55138240A (en) Manufacture of semiconductor device
JPS5530951A (en) Manufacturing of copper-lined insulation substrate
JPS5782485A (en) Formation of electrode
JPS56133857A (en) Manufacture of hybrid ic
JPS5393819A (en) Photosensitive resin composition for coating hybrid integrated circuit
JPH06224675A (en) Production of electronic parts
JPS6464298A (en) Hybrid integrated circuit
JPS55124244A (en) Method of fabricating chip component
JPS5739545A (en) Semiconductor device
JPS558115A (en) Manufacture of voice coil for speaker
JPS6124258A (en) Enclosure construction of electronic parts
JPS55124253A (en) Package and method of fabricating the same
JPS5760845A (en) Manufacture of hybrid ic
JPS6142415B2 (en)
JPS531226A (en) Resin compositions for powder coating
JPH0239546A (en) Manufacture of hybrid integrated circuit
JPH0445273Y2 (en)
JPS57134942A (en) Hybrid integrated circuit
GB661739A (en) Electric circuit assembly and method of making same
KR960007844B1 (en) Manufacturing process of the thick film chip condensor