JPS5530810A - Automatic bonding system for semiconductor device assembling - Google Patents

Automatic bonding system for semiconductor device assembling

Info

Publication number
JPS5530810A
JPS5530810A JP10281478A JP10281478A JPS5530810A JP S5530810 A JPS5530810 A JP S5530810A JP 10281478 A JP10281478 A JP 10281478A JP 10281478 A JP10281478 A JP 10281478A JP S5530810 A JPS5530810 A JP S5530810A
Authority
JP
Japan
Prior art keywords
seat
auto
bonding
bonder
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10281478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5758055B2 (enrdf_load_stackoverflow
Inventor
Tatsuo Hatanaka
Kyohei Tamaki
Tetsuo Nanbu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10281478A priority Critical patent/JPS5530810A/ja
Priority to US06/069,286 priority patent/US4301958A/en
Publication of JPS5530810A publication Critical patent/JPS5530810A/ja
Publication of JPS5758055B2 publication Critical patent/JPS5758055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
JP10281478A 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling Granted JPS5530810A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling
US06/069,286 US4301958A (en) 1978-08-24 1979-08-24 Arrangement for automatically fabricating and bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling

Publications (2)

Publication Number Publication Date
JPS5530810A true JPS5530810A (en) 1980-03-04
JPS5758055B2 JPS5758055B2 (enrdf_load_stackoverflow) 1982-12-08

Family

ID=14337494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10281478A Granted JPS5530810A (en) 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling

Country Status (1)

Country Link
JP (1) JPS5530810A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (ja) * 1986-12-27 1988-07-09 Shinkawa Ltd インナ−リ−ドボンデイング装置
CN110482153A (zh) * 2019-08-07 2019-11-22 四川大学 一种铅锭自动搬运装置
US10882134B2 (en) * 2017-04-04 2021-01-05 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
CN112193755A (zh) * 2020-09-22 2021-01-08 淮北矿业股份有限公司 一种实现多跨皮带采样煤流集中集料输送的装置及其方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (ja) * 1986-12-27 1988-07-09 Shinkawa Ltd インナ−リ−ドボンデイング装置
US10882134B2 (en) * 2017-04-04 2021-01-05 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
US11364565B2 (en) 2017-04-04 2022-06-21 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
CN110482153A (zh) * 2019-08-07 2019-11-22 四川大学 一种铅锭自动搬运装置
CN110482153B (zh) * 2019-08-07 2024-04-12 四川大学 一种铅锭自动搬运装置
CN112193755A (zh) * 2020-09-22 2021-01-08 淮北矿业股份有限公司 一种实现多跨皮带采样煤流集中集料输送的装置及其方法

Also Published As

Publication number Publication date
JPS5758055B2 (enrdf_load_stackoverflow) 1982-12-08

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