JPS5588339A - Controlling method for lead frame transport in semiconductor device assembly and stocker therefor - Google Patents

Controlling method for lead frame transport in semiconductor device assembly and stocker therefor

Info

Publication number
JPS5588339A
JPS5588339A JP15985978A JP15985978A JPS5588339A JP S5588339 A JPS5588339 A JP S5588339A JP 15985978 A JP15985978 A JP 15985978A JP 15985978 A JP15985978 A JP 15985978A JP S5588339 A JPS5588339 A JP S5588339A
Authority
JP
Japan
Prior art keywords
frame
stocker
stage
lead frame
magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15985978A
Other languages
Japanese (ja)
Other versions
JPS6339481B2 (en
Inventor
Tsutomu Mimata
Masakazu Ozawa
Osamu Sumiya
Takeshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15985978A priority Critical patent/JPS5588339A/en
Publication of JPS5588339A publication Critical patent/JPS5588339A/en
Publication of JPS6339481B2 publication Critical patent/JPS6339481B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Warehouses Or Storage Devices (AREA)

Abstract

PURPOSE: To prevent deterioration of operation rate according to a variant cycle of work of individual device by arranging a stocker provided with lead frame magazines to control an overall flow of lead frames covering full transport line.
CONSTITUTION: When a basic-sized lead frame 12 for which wire bonding has been over is transported to come near a stocker at its tip, a frame horizontal feed pin 21 draws the frame 12 into a frame magazine 18. Next, the magazine 18 is moved down stage by stage by a vertical feed screw 15, and the frame 12 is enclosed at the next stage. To deliver the lead frame 12 to the next process, the magazine 18 is moved upward, and the frame 12 fed in at first is delivered by the horizontal feed pin 21. Then, enclosed stage No. and disclosed stage No. for the frame 12 are stored to control, thus preventing some frames 12 from being left in the stocker for a long time.
COPYRIGHT: (C)1980,JPO&Japio
JP15985978A 1978-12-27 1978-12-27 Controlling method for lead frame transport in semiconductor device assembly and stocker therefor Granted JPS5588339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15985978A JPS5588339A (en) 1978-12-27 1978-12-27 Controlling method for lead frame transport in semiconductor device assembly and stocker therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15985978A JPS5588339A (en) 1978-12-27 1978-12-27 Controlling method for lead frame transport in semiconductor device assembly and stocker therefor

Publications (2)

Publication Number Publication Date
JPS5588339A true JPS5588339A (en) 1980-07-04
JPS6339481B2 JPS6339481B2 (en) 1988-08-05

Family

ID=15702778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15985978A Granted JPS5588339A (en) 1978-12-27 1978-12-27 Controlling method for lead frame transport in semiconductor device assembly and stocker therefor

Country Status (1)

Country Link
JP (1) JPS5588339A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147306U (en) * 1988-03-31 1989-10-12
EP1109206A1 (en) * 1999-12-16 2001-06-20 Infineon Technologies AG Apparatus and process for mounting of lead frames

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51108468A (en) * 1975-03-19 1976-09-25 Tadashi Amano ITAZAIKAKUNO SOCHI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51108468A (en) * 1975-03-19 1976-09-25 Tadashi Amano ITAZAIKAKUNO SOCHI

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147306U (en) * 1988-03-31 1989-10-12
EP1109206A1 (en) * 1999-12-16 2001-06-20 Infineon Technologies AG Apparatus and process for mounting of lead frames

Also Published As

Publication number Publication date
JPS6339481B2 (en) 1988-08-05

Similar Documents

Publication Publication Date Title
JPS5588339A (en) Controlling method for lead frame transport in semiconductor device assembly and stocker therefor
JPS5530810A (en) Automatic bonding system for semiconductor device assembling
JPS57180507A (en) Magazine exchange apparatus
JPS5352066A (en) Bonding unit
JPS5372456A (en) Glass sealing semiconductor device
EP0349852A3 (en) Method for the automatic feed of combing machines
JPS642940A (en) Lead frame magazine feeder
JPS54105478A (en) Manufacture unit of resin sealed type semiconductor device
JPS52137166A (en) Automatic solid waste inlet amount control device for vacuum conveying apparatus
JPS56148162A (en) Winding device for multilayer-multipolar continuous winding
JPS53122095A (en) Neutron-flux detecting system
JPS54152964A (en) Automatic assembling machine for semiconductor device
JP3145790B2 (en) Pellet bonding method
JPS5839019A (en) Semiconductor die-bonding device
JPS5739543A (en) Manufacture of semiconductor device
JPS5681402A (en) Apparatus for feeding and carrying-out of sample
JPS575345A (en) Isolating and picking up method for pellet
JPS5586124A (en) Assembly method for semiconductor device
JPS57169250A (en) Bonding method for pellet
JPS6063937A (en) Assembling device for electronic component
JPS5793825A (en) Separative feeder of work
JPH0131688B2 (en)
JPS5535781A (en) Automatic threading method of coil end in coil carrying line utilizing down loop
JPS5596644A (en) Method of bonding semiconductor device
JPS54137976A (en) Carriage method of semiconductor integrated-circuit device