JPS5523463B2 - - Google Patents

Info

Publication number
JPS5523463B2
JPS5523463B2 JP1460274A JP1460274A JPS5523463B2 JP S5523463 B2 JPS5523463 B2 JP S5523463B2 JP 1460274 A JP1460274 A JP 1460274A JP 1460274 A JP1460274 A JP 1460274A JP S5523463 B2 JPS5523463 B2 JP S5523463B2
Authority
JP
Japan
Prior art keywords
terminal
semi
chip
conductor
degrees
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1460274A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5061980A (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5061980A publication Critical patent/JPS5061980A/ja
Publication of JPS5523463B2 publication Critical patent/JPS5523463B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W70/461—
    • H10W70/481—
    • H10W72/0198—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1460274A 1973-09-26 1974-02-06 Expired JPS5523463B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT29390/73A IT993429B (it) 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori

Publications (2)

Publication Number Publication Date
JPS5061980A JPS5061980A (cg-RX-API-DMAC10.html) 1975-05-27
JPS5523463B2 true JPS5523463B2 (cg-RX-API-DMAC10.html) 1980-06-23

Family

ID=11226889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1460274A Expired JPS5523463B2 (cg-RX-API-DMAC10.html) 1973-09-26 1974-02-06

Country Status (8)

Country Link
US (1) US4032706A (cg-RX-API-DMAC10.html)
JP (1) JPS5523463B2 (cg-RX-API-DMAC10.html)
DE (1) DE2364837A1 (cg-RX-API-DMAC10.html)
ES (1) ES199183Y (cg-RX-API-DMAC10.html)
FR (1) FR2245084B1 (cg-RX-API-DMAC10.html)
GB (1) GB1467054A (cg-RX-API-DMAC10.html)
IT (1) IT993429B (cg-RX-API-DMAC10.html)
NL (1) NL7400553A (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
FR2462024A1 (fr) * 1979-07-17 1981-02-06 Thomson Csf Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
USD316251S (en) 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
US4994897A (en) * 1989-10-26 1991-02-19 Motorola, Inc. Multi-level semiconductor package
JPH0422762A (ja) * 1990-05-16 1992-01-27 Mitsubishi Electric Corp イグナイタ
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
US7005728B1 (en) 2004-06-03 2006-02-28 National Semiconductor Corporation Lead configuration for inline packages
JP1646470S (cg-RX-API-DMAC10.html) * 2019-05-14 2019-11-25
JP7607430B2 (ja) * 2020-10-12 2024-12-27 株式会社マキタ 作業機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368114A (en) * 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3416348A (en) * 1966-09-30 1968-12-17 Westinghouse Electric Corp Flat-pack lead bending device
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
NL6903229A (cg-RX-API-DMAC10.html) * 1969-03-01 1970-09-03
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation

Also Published As

Publication number Publication date
DE2364837A1 (de) 1975-04-24
ES199183U (es) 1975-07-16
US4032706A (en) 1977-06-28
IT993429B (it) 1975-09-30
FR2245084B1 (cg-RX-API-DMAC10.html) 1976-10-08
NL7400553A (nl) 1975-04-01
FR2245084A1 (cg-RX-API-DMAC10.html) 1975-04-18
GB1467054A (en) 1977-03-16
JPS5061980A (cg-RX-API-DMAC10.html) 1975-05-27
ES199183Y (es) 1975-11-16

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