JPS5522438A - Creamy solder - Google Patents

Creamy solder

Info

Publication number
JPS5522438A
JPS5522438A JP9463978A JP9463978A JPS5522438A JP S5522438 A JPS5522438 A JP S5522438A JP 9463978 A JP9463978 A JP 9463978A JP 9463978 A JP9463978 A JP 9463978A JP S5522438 A JPS5522438 A JP S5522438A
Authority
JP
Japan
Prior art keywords
solder
lead wires
onto
connection terminals
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9463978A
Other languages
Japanese (ja)
Inventor
Mamoru Sawahata
Tomiro Yasuda
Ryoichi Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9463978A priority Critical patent/JPS5522438A/en
Publication of JPS5522438A publication Critical patent/JPS5522438A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:The creamy solder which is suited for connecting a purality of lead wires onto the connecting terminals on circuit substrates and permits soldering free from formation of bridging. CONSTITUTION:The foregoing solder 7 is supplied across the array of connection terminals onto the connection terminals 2 of a circuit substrate 1 by a pipette 6 of bore 0.15mmphi. After the solder 7 having been coated dries, lead wires are superposed from above and are heated, whereby solding is accomplished. This results in 30% reduction of soldering time and improvement of wetting area from about 90% to about 100% as compared to the case of using conventional solder wires, when, for example, 200 pieces of lead wires are soldered.
JP9463978A 1978-08-04 1978-08-04 Creamy solder Pending JPS5522438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9463978A JPS5522438A (en) 1978-08-04 1978-08-04 Creamy solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9463978A JPS5522438A (en) 1978-08-04 1978-08-04 Creamy solder

Publications (1)

Publication Number Publication Date
JPS5522438A true JPS5522438A (en) 1980-02-18

Family

ID=14115831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9463978A Pending JPS5522438A (en) 1978-08-04 1978-08-04 Creamy solder

Country Status (1)

Country Link
JP (1) JPS5522438A (en)

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