JPS5518147A - Mount material of crystal oscillatoing element - Google Patents

Mount material of crystal oscillatoing element

Info

Publication number
JPS5518147A
JPS5518147A JP9083878A JP9083878A JPS5518147A JP S5518147 A JPS5518147 A JP S5518147A JP 9083878 A JP9083878 A JP 9083878A JP 9083878 A JP9083878 A JP 9083878A JP S5518147 A JPS5518147 A JP S5518147A
Authority
JP
Japan
Prior art keywords
mount material
crystal
oscillatoing
alloy
connects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9083878A
Other languages
Japanese (ja)
Inventor
Eiji Togawa
Masao Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP9083878A priority Critical patent/JPS5518147A/en
Publication of JPS5518147A publication Critical patent/JPS5518147A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever

Abstract

PURPOSE:To decrease the using quantity of Au as well as to increase the junction intensity by using the specific component compositon of wt% of Au, Ag and Sn each for the mount material which connects and fixes the crystal oscillating element and the plug terminal. CONSTITUTION:The alloy featuring the component composition of 10-85wt% Au: 3-52wt% Ag: the rest of Sn each is used for mount material 3 which connects and fixes crystal oscillating element 1 and plug terminal 2. And Ag is added with control to the alloy of Au and Sn to increase the junction intensity as well as reduce the sensitivity of material 3 to the Au-Sn alloy. Thus the using quantity of Au can be decreased.
JP9083878A 1978-07-25 1978-07-25 Mount material of crystal oscillatoing element Pending JPS5518147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9083878A JPS5518147A (en) 1978-07-25 1978-07-25 Mount material of crystal oscillatoing element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9083878A JPS5518147A (en) 1978-07-25 1978-07-25 Mount material of crystal oscillatoing element

Publications (1)

Publication Number Publication Date
JPS5518147A true JPS5518147A (en) 1980-02-08

Family

ID=14009716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9083878A Pending JPS5518147A (en) 1978-07-25 1978-07-25 Mount material of crystal oscillatoing element

Country Status (1)

Country Link
JP (1) JPS5518147A (en)

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