JPS55166974A - Light semiconductor element package - Google Patents

Light semiconductor element package

Info

Publication number
JPS55166974A
JPS55166974A JP7466279A JP7466279A JPS55166974A JP S55166974 A JPS55166974 A JP S55166974A JP 7466279 A JP7466279 A JP 7466279A JP 7466279 A JP7466279 A JP 7466279A JP S55166974 A JPS55166974 A JP S55166974A
Authority
JP
Japan
Prior art keywords
metallic sleeve
cap
light semiconductor
optical fiber
raised portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7466279A
Other languages
English (en)
Other versions
JPS6114678B2 (ja
Inventor
Katsuki Tanaka
Minoru Maeda
Hitoshi Satou
Katsuaki Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7466279A priority Critical patent/JPS55166974A/ja
Publication of JPS55166974A publication Critical patent/JPS55166974A/ja
Publication of JPS6114678B2 publication Critical patent/JPS6114678B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
JP7466279A 1979-06-15 1979-06-15 Light semiconductor element package Granted JPS55166974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7466279A JPS55166974A (en) 1979-06-15 1979-06-15 Light semiconductor element package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7466279A JPS55166974A (en) 1979-06-15 1979-06-15 Light semiconductor element package

Publications (2)

Publication Number Publication Date
JPS55166974A true JPS55166974A (en) 1980-12-26
JPS6114678B2 JPS6114678B2 (ja) 1986-04-19

Family

ID=13553663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7466279A Granted JPS55166974A (en) 1979-06-15 1979-06-15 Light semiconductor element package

Country Status (1)

Country Link
JP (1) JPS55166974A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856443U (ja) * 1981-10-09 1983-04-16 株式会社東芝 光付勢半導体装置用外囲器
WO2008093875A1 (ja) * 2007-02-01 2008-08-07 Nippon Sheet Glass Company, Limited 光モジュール

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856443U (ja) * 1981-10-09 1983-04-16 株式会社東芝 光付勢半導体装置用外囲器
JPS6120764Y2 (ja) * 1981-10-09 1986-06-21
WO2008093875A1 (ja) * 2007-02-01 2008-08-07 Nippon Sheet Glass Company, Limited 光モジュール

Also Published As

Publication number Publication date
JPS6114678B2 (ja) 1986-04-19

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